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Design News
Siemens Introduces Questa One Agentic AI Toolkit for IC Design, Verification
Nitin Patil
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March 2, 2026
Design News
Keysight Introduces 3D Interconnect Designer for Chiplet, 3DIC Advanced Package Designs
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EasyLogix PCB Investigator Integrates with Essemtec Platform
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Siemens Acquires ASTER for PCBA Design, Manufacturing, Testing
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Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
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July 2, 2024
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Siemens Introduces Calibre 3DThermal for 3D-IC Design
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June 26, 2024
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Siemens Offers AI-accelerated Verification for Analog, Mixed-Signal, 3D IC Designs in Solido Simulation Suite
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June 26, 2024
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3D PCB Design
Zuken Releases eCADSTAR 2024 for 3D PCB Design
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June 12, 2024
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Georgette Mosbacher Joins Nano Dimension’s Board of Directors
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June 6, 2024
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Infosys Completes Acquisition of Leading Semiconductor Design Services Provider, InSemi
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May 11, 2024
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Siemens Launches Solido IP Validation Suite
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May 7, 2024
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Aerospace
Altair SimSolid to Transform Simulation for Electronics Industry
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March 21, 2024
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Automotive
Siemens to Demonstrate First Pre-Silicon Simulation Environment for Arm Cortex-A720AE for Software-Defined Vehicles
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March 14, 2024
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Siemens Joins Semiconductor Education Alliance
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March 1, 2024
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3D PCB Design
Siemens, Intel Foundry Join to Develop Certified, Production-Ready EMIB Technology Reference Flow
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February 24, 2024
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CAE
Ansys, Intel Foundry Join on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
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February 23, 2024
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