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Bentley Announces Winners of 2026 Year in Infrastructure Awards

Nitin Patil - October 9, 2026 0

SINGAPORE – (The Bentley Systems 2026 Year in Infrastructure Event), Oct 9, 2026 – Bentley Systems, Inc., (Nasdaq: BSY), the infrastructure engineering software company,...

Hexagon to Acquire TA Associates-backed Rocscience, Provider of Geotechnical, Engineering Analysis Software for $535 Million

October 9, 2026

3D Formtech Invests in Nikon’s SLM 500 for High-Volume Aluminum Parts Production

October 9, 2026

Interspectral Appoints Jonas Hurtig as CEO

October 9, 2026

AFD Systems Strengthens Aerospace Production Capability with Investment in Stratasys F900 3D Printer

October 9, 2026

ASCON Releases KOMPAS-3D v25

October 9, 2026

Design Industry Thought Leadership

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

Interviews

Exclusive Interview: BIMcollab Enters India to Help Project Teams Turn BIM into Better Coordination

June 7, 2026

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BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

Nitin Patil - October 6, 2026 0

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

Nitin Patil - September 30, 2026 0

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

September 21, 2026

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

September 7, 2026

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

September 4, 2026

SimScale Opens Engineering AI Agent to its Global Community

August 21, 2026

CASE STUDY | Watch Now | Mold Industry

3D Printing

AFD Systems Strengthens Aerospace Production Capability with Investment in Stratasys F900 3D Printer

Nitin Patil - October 9, 2026 0

BLACKPOOL, UK, Oct 9, 2026 - AFD Systems has further strengthened its aerospace manufacturing capability with the acquisition of a Stratasys F900 industrial additive...

Noida-based Objectify Technologies Joins Roboze Manufacturing Network

October 8, 2026

amsight to Lead ESA FIRST! Project to Digitalize Qualification of 3D-Printed Space Components

October 8, 2026

Velo3D Announces New Technology, Operations Leadership

September 28, 2026

AML3D Joins A$3.9 Million Advanced Aerospace Manufacturing Project

September 25, 2026

Sinto Advanced Ceramics Expands AM Material Portfolio with Two Non-Oxide Ceramics

September 25, 2026

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BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Sachin R Nalawade - October 2, 2026 0

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

September 25, 2026

DriveWorks for SOLIDWORKS: The Ultimate Design Automation Solution for Manufacturers

September 25, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

Interspectral Appoints Jonas Hurtig as CEO

Nitin Patil - October 9, 2026 0

NORRKÖPING, Sweden, Oct 9, 2026 – Interspectral has appointed Jonas Hurtig as its new Chief Executive Officer. Former CEO Isabelle Hachette has decided to leave her...

Phase3D, Wietech 3D Collaborate on Metal AM Inspection

Nitin Patil - October 8, 2026 0

HARRISBURG, PA, USA, Oct 8, 2026 - Phase3D has partnered with Wietech 3D to expand access to in-situ inspection for metal additive manufacturing, bringing...

Yamazen to Bring Makino’s Machining Centers, Automation Solutions across Mid-Atlantic

Nitin Patil - October 7, 2026 0

MASON, OH, USA, Oct 7, 2026 – Makino Inc is committed to providing manufacturers across the Mid-Atlantic Region with machining expertise, responsiveness, and the local...

AutoForm Assembly R26 Unveiled for BiW Assembly Processes

Nitin Patil - October 7, 2026 0

PFAFFIKON SZ, Switzerland, Oct 7, 2026 – AutoForm Engineering GmbH, the leading supplier of software solutions for stamping and BiW assembly processes, unveils its...

Mimir Acquires Sandvik’s Metal Powder Business Osprey

Nitin Patil - October 7, 2026 0

STOCKHOLM, Sweden, Oct 7, 2026 - Mimir has completed its acquisition of Osprey from Sandvik, establishing an independent advanced materials company with production sites...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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Bentley Announces Winners of 2026 Year in Infrastructure Awards

Nitin Patil - October 9, 20260

Design News

Hexagon to Acquire TA Associates-backed Rocscience, Provider of Geotechnical, Engineering Analysis Software for $535 Million

Nitin Patil - October 9, 20260

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