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SIMULATION

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

Formlabs Introduces Form Studio 1, Its Most Affordable Professional Resin 3D Printer

Somerville, MA, Oct 14, 2026– Formlabs, the world’s leading supplier of professional SLA and SLS 3D printing systems, today introduced Form Studio 1, the...

AMAZEMET, F4E Collaborate on Manufacturing, Fusion Applications

WARSAW, Poland, Oct 15, 2026 - AMAZEMET has signed a Memorandum of Understanding with Fusion for Energy (F4E), the EU organization responsible for Europe’s...

SigmaNEST Becomes SigmaTEK

MASON, OH, USA, Oct  14, 2026 — The company behind SigmaNEST software is now SigmaTEK, part of Sandvik Group. The new name, effective today,...

Freemelt Receives Prototype Order from Defense Company in Sweden

GOTHENBURG, Sweden, Oct 14, 2026 – Freemelt has received a prototype order from a defense company with operations in Sweden as part of an agreement...

Mazak Appoints Suzette Mendez as General Manager for Midwest

FLORENCE, KY, USA, Oct 13, 2026 - Mazak has appointed Suzette Mendez as General Manager for its Midwest Region. With more than 20 years...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...
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