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EVOLVE Electrical, Mechanical 10.2 Released

Nitin Patil - September 11, 2026 0

ATLANTA, GA, USA, Sep 11, 2026 — EVOLVE announced the release of EVOLVE Electrical and EVOLVE Mechanical 10.2, introducing Auto Tag Arrangement to help...

AMC Bridge and Tech Soft 3D to Discuss New Research on How Manufacturers Are Navigating Build-or-Buy Decisions for 3D Engineering Data in Upcoming Webinar

September 11, 2026

Dassault Systèmes Collaborates with Kyndryl to Accelerate Infrastructure and Manufacturing Transformation in India

September 11, 2026

ORNL, Mazak Develop Metal AM Platform, Integrating VC Ez-20X 5-Axis Machining with Fronius WAAM

September 11, 2026

Star Cutter Introduces New Flexible Automation Cell for CNC Grinding

September 11, 2026

Renishaw to Launch XC100 Environmental Compensator for Machine Calibration at IMTS 2026, AMB 2026

September 11, 2026

Design Industry Thought Leadership

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

Interviews

Exclusive Interview: BIMcollab Enters India to Help Project Teams Turn BIM into Better Coordination

June 7, 2026

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SIMULATION

CAE

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

Nitin Patil - September 7, 2026 0

TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

Nitin Patil - September 4, 2026 0

MUNICH, Germany, Sep 4, 2026 - SunCubes, a deep-tech startup pioneering wireless energy transmission technology for unmanned aerial systems, has announced it is deploying...

SimScale Opens Engineering AI Agent to its Global Community

August 21, 2026

Dexory Deploys SimScale’s Engineering AI to Accelerate Warehouse Robotics Development

August 17, 2026

CIMdata Publishes 2026 Simulation and Analysis Market Report

July 7, 2026

Dry Coolers Selects GT‑SUITE from Gamma Technologies to Accelerate Data Center Product Development

June 16, 2026

CASE STUDY | Watch Now | Mold Industry

3D Printing

NASENI Plans Metal 3D Printing Hub in Nigeria

Nitin Patil - September 7, 2026 0

ABUJA, Nigeria, Sep 7, 2026 - The National Agency for Science and Engineering Infrastructure (NASENI) has unveiled plans to drive Nigeria into the future...

Axtra3D Appoints Marion Timmermans as VP, Revenue, Growth EMEA, RoW

September 4, 2026

Titomic Secures New US Orders across Strategic Aerospace, Defense, Energy, Industrial Markets

September 4, 2026

Meltio Releases US-Assembled Robot Cell for Industrial Production

September 4, 2026

3D Systems, SRNL Enter CRADA to Advance 3D Printing to Support Nuclear Energy, Energy Infrastructure, National Security

August 27, 2026

University of Rome Tor Vergata, Roboze Announce Scientific Collaboration

August 27, 2026

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SOLIDWORKS - BEACON India

3D CAD

SOLIDWORKS Visualize: Transform Your CAD Models into Photorealistic Visuals

Sachin R Nalawade - August 9, 2026 0

Guest Post by: Pruthviraj Mistry, Customer Success Manager, BEACON India - Best Engineering Aids and Consultancies Pvt. Ltd. Introduction In today's competitive manufacturing environment, a great product...

Superelasticity Material Behaviour and its Modelling in Abaqus CAE

August 9, 2026

Automate File Exports with SOLIDWORKS Task Scheduler | BEACON

August 9, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

ORNL, Mazak Develop Metal AM Platform, Integrating VC Ez-20X 5-Axis Machining with Fronius WAAM

Nitin Patil - September 11, 2026 0

FLORENCE, KY, USA, Sep 11, 2026 – Oak Ridge National Laboratory (ORNL) and Mazak partnered for the development of a convergent metal additive manufacturing...

Star Cutter Introduces New Flexible Automation Cell for CNC Grinding

Nitin Patil - September 11, 2026 0

FARMINGTON HILLS, MI, USA, Sep 11, 2026 – Star Cutter has introduced its new Flexible Automation Cell, a demonstration platform that brings together automation hardware,...

Renishaw to Launch XC100 Environmental Compensator for Machine Calibration at IMTS 2026, AMB 2026

Nitin Patil - September 11, 2026 0

GLOUCESTERSHIRE, UK, Sep 11, 2026 – Renishaw is proud to announce the launch of its new XC100 environmental compensator at IMTS 2026 and AMB 2026....

Star SU Carbide Hobs Support High-Performance Gear Manufacturing

Nitin Patil - September 11, 2026 0

FARMINGTON HILLS, MI, USA, Sep 11, 2026 – As manufacturers increase cutting speeds and seek greater machine utilization, tooling performance becomes increasingly important to...

America Makes, NCDMM Announce Winners of INSITE Project Call of $13.2 Million

Nitin Patil - September 10, 2026 0

YOUNGSTOWN, OH, USA, Sep 10, 2026 - America Makes and the National Center for Defense Manufacturing and Machining (NCDMM) are proud to announce the winner of...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...