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PTC Connects Onshape CAD with NVIDIA Isaac Sim in Robotics Design-to-Simulation Workflow

Nitin Patil - 0
BOSTON, MA, USA, Mar 19, 2026 – PTC (NASDAQ: PTC) today announced a new robotics design-to-simulation workflow that connects PTC’s cloud-native Onshape computer-aided design (CAD) and product data management...
CAE

Synopsys Launches Ansys 2026 R1 to Re-Engineer Engineering with Joint Solutions and AI-Powered Products

Sachin R Nalawade - 0
Release combines AI, multiphysics simulation, and real-world digital twin technology to transform how teams explore designs, validate earlier, and engineer smarter, more resilient systems Key...

DST Releases Working Model 2D V10 for 2D Kinematic, Dynamic Simulation

Gamma Technologies Unveils GT Intelligence Studio, Strengthens Leadership Team

SPDM (Simulation Process and Data Management): The Backbone of Modern Digital Engineering

Mexico-based COATL Engineering to Offer ENGYS’ HELYX, ELEMENTS across Latin America

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NX delivers advanced automation, process simulation and integrated technology to improve productivity and ensure first-time quality in tooling development.

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BEACON India | SOLIDWORKS

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SOLIDWORKS for Startups: Driving Faster Product Development and Innovation

Sachin R Nalawade - 0
For manufacturing startups, the challenge is not just designing a product—it’s about bringing that product to market quickly, cost-effectively, and at scale. This requires...

BEACON India: Emerging as the Best Formlabs 3D Printer & Material Reseller in India

BEACON India Opens New Office in Pune, Strengthening SOLIDWORKS Support for Western India

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Hypertherm Launches Powermax33 XP Plasma Cutting System

Nitin Patil - 0
HANOVER, NH, USA, Mar 24, 2026 — Hypertherm Associates, a U.S.-based leading manufacturer of industrial cutting systems and software, has announced the launch of...

Farsoon Launches FS1311M-U Large-Format Metal PBF AM System

Nitin Patil - 0
CHANGSHA, China, Mar 24, 2026 – Farsoon Technologies announces the launch of the FS1311M-U, a next-generation large-format metal Powder Bed Fusion (PBF) system engineered to address...

Hexagon MI Launches APOLLO AI-powered Predictive Condition Monitoring Platform for Metrology Assets

Nitin Patil - 0
NORTH KINGSTOWN, RI, USA, Mar 23, 2026 – Hexagon Manufacturing Intelligence today announced the launch of APOLLO, an AI-driven platform designed to transform how manufacturers...

Farsoon Unveils FS812M-U 800mm-Class Large-Format Metal AM System

Nitin Patil - 0
CHANGSHA, China, Mar 23, 2026 – Farsoon Technologies announced the launch of the FS812M-U, the latest evolution of its market-leading 800mm-class metal additive manufacturing system....

Axtra3D Launches Three New Elastomers for North America, Opens Pre-orders for Axtra Workflow

Nitin Patil - 0
CHARLOTTE, NC, USA, Mar 23, 2026 – Axtra3D announced the availability of three new functional elastomers for the Americas region. The newly qualified materials expand Axtra...

EDA

Cadence Launches ChipStack AI Super Agent for Chip Design, Verification

Nitin Patil - 0
AI
SAN JOSE, CA, USA, Feb 17, 2026 — Cadence (Nasdaq: CDNS) announced a transformative step forward in redefining how semiconductors are designed with the launch...

Toshiba to Use Siemens’ EDA Software for Semiconductor Design Innovation

Nitin Patil - 0
Design News
PLANO, TX, USA, Dec 17, 2025 - Siemens, a leading technology company, announced that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has introduced Siemens’...
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