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SIMULATION

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...

3D Printing

SOLIDWORKS - BEACON India

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

Discover how SWOOD helps woodworking manufacturers design, automate, nest, and manufacture custom wood projects directly within SOLIDWORKS. Guest Post by Pruthu S Shastry, Application Engineer,...

MFG Tech Update

MachineWorks 8.9 Previews GPU-powered Machine Simulation, New Recordings Reference Application

SHEFFIELD, UK, Oct 1, 2026 - MachineWorks Ltd, a leading supplier of software components to the engineering industry, is pleased to announce a preview...

SolidCAM AI Assistant Now Available on iOS, Android

SCHRAMBERG, Germany, Oct 1, 2026 - SolidCAM, creator of the breakthrough iMachining toolpath technology and a leading distributor of solutions to precision metal manufacturers...

Freemelt Secures €300K F4E Contract for Tungsten-based Fusion Components Manufacturing

GOTHENBURG, Sweden, Oct 1, 2026 – Freemelt has signed a new contract totaling EUR 300,000 with Fusion for Energy (“F4E”), the European Union organization...

Artec 3D Metrology Calibration Lab Achieves ISO/IEC 17025 Accreditation

LUXEMBOURG, Sep 30, 2026 - World-renowned 3D scanning hardware and software developer Artec 3D is delighted to announce that its in-house metrology calibration laboratory...

Titomic Secures AU$752K in New US Orders Across Defense, Energy

HUNTSVILLE, AL, USA, Sep 30, 2026 – Titomic Limited (ASX: TTT), a global leader in cold spray additive manufacturing and advanced coatings, is pleased to announce...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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