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SIMULATION

SCALE Partners with Wissen Baum LLP to Introduce SCALE.sdm Simulation Data Management Solution in India

Dresden, Germany – October 2026 – SCALE has announced a new technology partnership with Wissen Baum LLP to introduce its simulation data management solution,...

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

Hexagon Launches HYPERSCAN SR Wireless Optical Tracking 3D Laser Scanner

COBHAM, UK, Oct 16, 2026 – Hexagon’s Portable Metrology Division has introduced HYPERSCAN SR, a fully wireless optical tracking 3D scanner that makes professional...

Toolhive Brings CAM Programmers and Manufacturing Professionals Together at Pune Event

Sandvik Machining Solutions showcases cloud-based tool data management, CAM integration and shop-floor connectivity at an industry gathering in Pune, India. Pune, India, October 2026: Toolhive,...

Star Cutter Launches Four-Flute/Four-Hole Gundrill for High-Production Deep Hole Drilling

FARMINGTON HILLS, MI, USA, Oct 16, 2026 – Star Cutter Company has introduced a Four-Flute/Four-Hole Gundrill designed to increase productivity and tool life in...

Formlabs Introduces Form Studio 1, Its Most Affordable Professional Resin 3D Printer

Somerville, MA, Oct 14, 2026– Formlabs, the world’s leading supplier of professional SLA and SLS 3D printing systems, today introduced Form Studio 1, the...

AMAZEMET, F4E Collaborate on Manufacturing, Fusion Applications

WARSAW, Poland, Oct 15, 2026 - AMAZEMET has signed a Memorandum of Understanding with Fusion for Energy (F4E), the EU organization responsible for Europe’s...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...
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