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SIMULATION

SCALE Partners with Wissen Baum LLP to Introduce SCALE.sdm Simulation Data Management Solution in India

Dresden, Germany – October 2026 – SCALE has announced a new technology partnership with Wissen Baum LLP to introduce its simulation data management solution,...

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

SHINING 3D Successfully Hosts 2026 Global Reseller & Partner Meeting

HANGZHOU, China, Oct 20, 2026 – SHINING 3D successfully hosted its 2026 Global Reseller & Partner Meeting from October 14 to 15 at its...

Titomic Advances Exploratory Collaboration with Bechtel Plant Machinery to Accelerate Next-Gen US Navy Technologies

HUNTSVILLE, AL, USA, Oct 20, 2026 — Titomic USA, Inc. (ASX: TTT), a global advanced manufacturing company serving the U.S. and allied industrial base,...

Walter Introduces WedgeFit Grooving System with Double Dovetail Guide

TUBINGEN, Germany, Oct 20, 2026 – With the WedgeFit, Walter is expanding its range for radial grooving, parting-off, groove turning and Copy turning to include...

Fathom Acquires TCS, PGM, Expanding its US Manufacturing Capabilities in Aerospace, Defense

CHICAGO, IL and AUSTIN, TX, USA, Oct 20, 2026 – CORE Industrial Partners (“CORE”), a manufacturing, industrial technology and industrial services-focused private equity firm,...

Hexagon Launches HYPERSCAN SR Wireless Optical Tracking 3D Laser Scanner

COBHAM, UK, Oct 16, 2026 – Hexagon’s Portable Metrology Division has introduced HYPERSCAN SR, a fully wireless optical tracking 3D scanner that makes professional...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...
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