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Xometry, TradeCentric Expand Partnership, Bringing Purchasing, Invoicing Directly into Customers’ Existing eProcurement Systems

Nitin Patil - September 15, 2026 0

NORTH BETHESDA, MD, USA, Sep 15, 2026 - Xometry, Inc. (NASDAQ: XMTR), the global AI-native marketplace connecting buyers and suppliers of custom manufacturing, announced...

Morpholio Trace for Business Brings New Way for Firms to Buy, Deploy at Scale

September 15, 2026

Siemens Advances UAE’s Industrial, Digital Goals during Presidential State visit to Germany

September 15, 2026

Star Cutter, Star SU Launch Unified Brand

September 15, 2026

SHINING 3D Launches FreeScan Trak ProW+ for Faster, More Flexible Large-Scale 3D Measurement

September 15, 2026

Artec 3D Launches Neo Tolerance-driven Wireless 3D Scanner

September 15, 2026

Design Industry Thought Leadership

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

Interviews

Exclusive Interview: BIMcollab Enters India to Help Project Teams Turn BIM into Better Coordination

June 7, 2026

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ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

Nitin Patil - September 7, 2026 0

TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

Nitin Patil - September 4, 2026 0

MUNICH, Germany, Sep 4, 2026 - SunCubes, a deep-tech startup pioneering wireless energy transmission technology for unmanned aerial systems, has announced it is deploying...

SimScale Opens Engineering AI Agent to its Global Community

August 21, 2026

Dexory Deploys SimScale’s Engineering AI to Accelerate Warehouse Robotics Development

August 17, 2026

CIMdata Publishes 2026 Simulation and Analysis Market Report

July 7, 2026

Dry Coolers Selects GT‑SUITE from Gamma Technologies to Accelerate Data Center Product Development

June 16, 2026

CASE STUDY | Watch Now | Mold Industry

3D Printing

NASENI Plans Metal 3D Printing Hub in Nigeria

Nitin Patil - September 7, 2026 0

ABUJA, Nigeria, Sep 7, 2026 - The National Agency for Science and Engineering Infrastructure (NASENI) has unveiled plans to drive Nigeria into the future...

Axtra3D Appoints Marion Timmermans as VP, Revenue, Growth EMEA, RoW

September 4, 2026

Titomic Secures New US Orders across Strategic Aerospace, Defense, Energy, Industrial Markets

September 4, 2026

Meltio Releases US-Assembled Robot Cell for Industrial Production

September 4, 2026

3D Systems, SRNL Enter CRADA to Advance 3D Printing to Support Nuclear Energy, Energy Infrastructure, National Security

August 27, 2026

University of Rome Tor Vergata, Roboze Announce Scientific Collaboration

August 27, 2026

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3D CAD

SOLIDWORKS Visualize: Transform Your CAD Models into Photorealistic Visuals

Sachin R Nalawade - August 9, 2026 0

Guest Post by: Pruthviraj Mistry, Customer Success Manager, BEACON India - Best Engineering Aids and Consultancies Pvt. Ltd. Introduction In today's competitive manufacturing environment, a great product...

Superelasticity Material Behaviour and its Modelling in Abaqus CAE

August 9, 2026

Automate File Exports with SOLIDWORKS Task Scheduler | BEACON

August 9, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

Star Cutter, Star SU Launch Unified Brand

Nitin Patil - September 15, 2026 0

FARMINGTON HILLS, MI, USA, Sep 15, 2026 – As Star Cutter Company approaches its 100th anniversary, the company and Star SU are introducing a...

SHINING 3D Launches FreeScan Trak ProW+ for Faster, More Flexible Large-Scale 3D Measurement

Sachin R Nalawade - September 15, 2026 0

SHINING 3D launches FreeScan Trak ProW+, a wireless tracking and scanning system with ultra-large tracking range, marker-free scanning, and flexible large-scale inspection. Sept. 9, 2026:...

Artec 3D Launches Neo Tolerance-driven Wireless 3D Scanner

Nitin Patil - September 15, 2026 0

Luxembourg, Sep 15, 2026 — Global 3D scanning hardware and software leader Artec 3D has today announced the launch of Artec Neo, the first...

Nadine Crauwels to Step Down as President, Sandvik Machining

Nitin Patil - September 14, 2026 0

STOCKHOLM, Sweden, Sep 14, 2026 - The President of business area Machining, Nadine Crauwels, has decided to leave Sandvik to pursue a new phase...

ORNL, Mazak Develop Metal AM Platform, Integrating VC Ez-20X 5-Axis Machining with Fronius WAAM

Nitin Patil - September 11, 2026 0

FLORENCE, KY, USA, Sep 11, 2026 – Oak Ridge National Laboratory (ORNL) and Mazak partnered for the development of a convergent metal additive manufacturing...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

Nemetschek Signs MoUs with ITE, Singapore Polytechnic to Build AI, Digital Delivery Capability in Singapore’s Built Environment

September 9, 2026

Keysight, Centre for Assuring Autonomy at University of York in UK Collaborate on AI Safety Research for Software-Defined Vehicles

September 8, 2026

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Nitin Patil - September 15, 20260

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