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SIMULATION

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

Phase3D, Wietech 3D Collaborate on Metal AM Inspection

HARRISBURG, PA, USA, Oct 8, 2026 - Phase3D has partnered with Wietech 3D to expand access to in-situ inspection for metal additive manufacturing, bringing...

Yamazen to Bring Makino’s Machining Centers, Automation Solutions across Mid-Atlantic

MASON, OH, USA, Oct 7, 2026 – Makino Inc is committed to providing manufacturers across the Mid-Atlantic Region with machining expertise, responsiveness, and the local...

AutoForm Assembly R26 Unveiled for BiW Assembly Processes

PFAFFIKON SZ, Switzerland, Oct 7, 2026 – AutoForm Engineering GmbH, the leading supplier of software solutions for stamping and BiW assembly processes, unveils its...

Mimir Acquires Sandvik’s Metal Powder Business Osprey

STOCKHOLM, Sweden, Oct 7, 2026 - Mimir has completed its acquisition of Osprey from Sandvik, establishing an independent advanced materials company with production sites...

Renishaw Celebrates 15 Years at Miskin, Completion of First-Phase Development

GLOUCESTERSHIRE, UK, Oct 7, 2026 – This year, Renishaw is celebrating the 15th anniversary of the purchase of its Miskin site in South Wales, and...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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