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ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

MUNICH, Germany, Sep 4, 2026 - SunCubes, a deep-tech startup pioneering wireless energy transmission technology for unmanned aerial systems, has announced it is deploying...

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SOLIDWORKS - BEACON India

SOLIDWORKS Visualize: Transform Your CAD Models into Photorealistic Visuals

Guest Post by: Pruthviraj Mistry, Customer Success Manager, BEACON India - Best Engineering Aids and Consultancies Pvt. Ltd.  Introduction In today's competitive manufacturing environment, a great product...

MFG Tech Update

Kennametal Introduces KAF82 Additive Tungsten Carbide Grade for Metal Cutting

PITTSBURGH, PA, USA, Sep 18, 2026 - Kennametal Inc. (NYSE: KMT) announced a breakthrough in additive manufacturing that enables the rapid production of custom...

Matsuura Brings IBARMIA Technology in US Market

ST. PAUL, MN, USA, Sep 18, 2026 – Seeking greater alignment with its target customer (5-axis, multitasking, automation, and flexibility) across multiple sectors, starting September...

Roush Yates Engines Adds Four Matsuura CNC Machining Centers to Expand its Machining Capabilities

ST. PAUL, MN, USA, Sep 18, 2026 – Matsuura Machinery USA, a global leader in high-performance CNC machining centers, announced a strategic partnership with...

Kennametal Named Official Tooling Supplier for NASCAR

CHICAGO, IL, USA, Sep 18, 2026 - Kennametal Inc. (NYSE: KMT) announced it has been named the Official Tooling Supplier of NASCAR. Dave Bersaglini,...

Phase3D’s Fringe Inspection to Integrate into EOS Metal AM Machines

HARRISBURG, PA, USA and KRAILLING, Germany, Sep 18, 2026 – Phase3D is working with EOS to bring Fringe Inspection to the metal AM world,...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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