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SIMULATION

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...

3D Printing

SOLIDWORKS - BEACON India

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

Discover how SWOOD helps woodworking manufacturers design, automate, nest, and manufacture custom wood projects directly within SOLIDWORKS. Guest Post by Pruthu S Shastry, Application Engineer,...

MFG Tech Update

Artec 3D Metrology Calibration Lab Achieves ISO/IEC 17025 Accreditation

LUXEMBOURG, Sep 30, 2026 - World-renowned 3D scanning hardware and software developer Artec 3D is delighted to announce that its in-house metrology calibration laboratory...

Titomic Secures AU$752K in New US Orders Across Defense, Energy

HUNTSVILLE, AL, USA, Sep 30, 2026 – Titomic Limited (ASX: TTT), a global leader in cold spray additive manufacturing and advanced coatings, is pleased to announce...

AML3D Signs Initial Production Parts Order for US Navy Submarines

EDINBURGH, Australia, Sep 30, 2026 – AML3D Limited (ASX:AL3) ("AML3D" or "the Company") is pleased to announce an initial production parts order from Austal, valued...

OPEN MIND Joins FANUC 5-Axis Integrated Technology Initiative

WESSLING, Germany, Sep 29, 2026 - OPEN MIND Technologies, a leading developer of CAD/CAM software solutions worldwide, has announced it has become a founding...

InnovMetric Announces Global Partnership with Wuhan VISION3D

InnovMetric, the independent software development company that empowers manufacturers of every size to digitally transform their 3D measurement processes, is proud to announce a...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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