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Phillips to Bring 2oneLab’s Compact Metal AM Solutions in US Market

Nitin Patil - October 29, 2026 0

HANOVER, MD, USA, Oct 29, 2026 — Phillips Corporation, a global leader in manufacturing technology and services, announced a new partnership with 2oneLab Inc.,...

Velo3D Q3 FY2026 Conference Call on Nov 10, 2PM PT

October 29, 2026

MAIT Expands Engineering, Digital Product Development Portfolio in Collaboration with Sigmetrix

October 29, 2026

Nidec Develops Autonomous Learning-Based Automatic Control System for its LAMDA Powder DED Metal 3D Printers

October 29, 2026

Nemetschek Unveils Allplan Max 2027 AI for Engineering

October 28, 2026

Trinamix Launches CAD Vault for Oracle Fusion Cloud PLM Powered by OpenBOM Cloud PDM

October 28, 2026

Design Industry Thought Leadership

Interviews

An Interview with Mr. Joakim Johansson, Head of CRIBWISE & Digital Sales – Tool Flow Solution, Sandvik Machining Solutions

October 22, 2026

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

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SIMULATION

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SCALE Partners with Wissen Baum LLP to Introduce SCALE.sdm Simulation Data Management Solution in India

Sachin R Nalawade - October 17, 2026 0

Dresden, Germany – October 2026 – SCALE has announced a new technology partnership with Wissen Baum LLP to introduce its simulation data management solution,...

CAE

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

Nitin Patil - October 6, 2026 0

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

September 30, 2026

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

September 21, 2026

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

September 7, 2026

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

September 4, 2026

ASCON Brings 37 Years of Russian CAD Expertise to India with KOMPAS-3D

3D Printing

Velo3D Q3 FY2026 Conference Call on Nov 10, 2PM PT

Nitin Patil - October 29, 2026 0

FREMONT, CA, USA, Oct 29, 2026 - Velo3D, Inc. (Nasdaq: VELO), a leading metal additive manufacturing technology company, announced that it will release its...

Nidec Develops Autonomous Learning-Based Automatic Control System for its LAMDA Powder DED Metal 3D Printers

October 29, 2026

BigRep Returns to Private Ownership, Launches ALTRA 670 Large-Format Industrial 3D Printer

October 28, 2026

3D Systems Q3 FY2026 Conference Call on Nov 5, 8:30AM ET

October 28, 2026

3D Systems Opens US Industrial Technology Center in Littleton, Colorado

October 26, 2026

HORKOS Launches NX70 DUO version AM Machining Center Powered by Meltio’s Wire-DED Technology in Japan

October 23, 2026

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BEACON India | SOLIDWORKS

SOLIDWORKS

SOLIDWORKS - BEACON India

BEACON SOLIDWORKS

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Sachin R Nalawade - October 2, 2026 0

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

September 25, 2026

DriveWorks for SOLIDWORKS: The Ultimate Design Automation Solution for Manufacturers

September 25, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

Phillips to Bring 2oneLab’s Compact Metal AM Solutions in US Market

Nitin Patil - October 29, 2026 0

HANOVER, MD, USA, Oct 29, 2026 — Phillips Corporation, a global leader in manufacturing technology and services, announced a new partnership with 2oneLab Inc.,...

Registration Opens for Industrial Maintenance Training at Phillips Workforce in Portsmouth, Virginia

Nitin Patil - October 28, 2026 0

PORTSMOUTH, VA, USA, Oct 28, 2026 — Registration is now open for accelerated, hands-on industrial maintenance training at Phillips Workforce, a new workforce development...

Concepts NREC, Siemens Collaborate to Integrate Simcenter STAR-CCM+ CFD with Agile Engineering Design System

Nitin Patil - October 28, 2026 0

WHITE RIVER JUNCTION, VT, USA, Oct 28, 2026 — Concepts NREC and Siemens have formed a technical partnership to add Simcenter STAR-CCM+ as a...

Tekna Secures CAD 1.64 Million Titanium Powder Order for LPBF Additive Manufacturing

Nitin Patil - October 27, 2026 0

ARENDAL, Norway and SHERBROOKE, QC, Canada, Oct 27, 2026 – Tekna (OSE: TEKNA), a world-leading provider of advanced materials and plasma systems, is pleased...

Nidec Machine Tool Launches MVR-5X Double-Column 5-Axis Milling Machine

Nitin Patil - October 27, 2026 0

KYOTO, Japan, Oct 27, 2026 – Nidec Machine Tool Corporation announced that it will begin sales of the MVR-5X, a double-column 5-axis milling machine, on...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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