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SIMULATION

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

3D Printing

SOLIDWORKS - BEACON India

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

Discover how SWOOD helps woodworking manufacturers design, automate, nest, and manufacture custom wood projects directly within SOLIDWORKS. Guest Post by Pruthu S Shastry, Application Engineer,...

MFG Tech Update

America Makes Adds Yash Parikh to Executive Committee

YOUNGSTOWN, OH, USA, Sep 25, 2026 – In light of recent updates to the America Makes Operating Plan, the Executive Committee has expanded from 11...

DMG MORI Unveils DMV 160 3-Axis Vertical Milling Center for Parts Up to 1600mm Length, 2200 kg

TOKYO, Japan, Sep 24, 2026 – With the new DMV 160, DMG MORI is expanding its series for productive and high-precision 3-axis vertical machining. Its...

FARO CREAFORM, La Roche-Posay Racing Team Announce Technology Partnership Ahead of America’s Cup Campaigns

LEVIS, QC, Canada, Sep 24, 2026 — FARO CREAFORM, a business of AMETEK, Inc. and global provider of 3D scanning and portable CMM solutions, today...

SHINING 3D Extends Global Industry Partnership with WorldSkills through 2028

HANGZHOU, China, Sep 24, 2026 – At the 48th WorldSkills Competition in Shanghai, SHINING 3D announced the renewal of its Global Industry Partnership with...

SHINING 3D Launches ShiningSpace, an Open Digital Platform for Real-World 3D Assets

SHINING 3D, a leading manufacturer of high-accuracy 3D scanning technology, today announced the launch of ShiningSpace, an open digital platform for previewing, managing, sharing,...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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