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3D Scanning

Nanosoft Releases nanoCAD 3DScan 26

Nitin Patil - October 5, 2026 0

MOSCOW, Russia, Oct 5, 2026 – Nanosoft AS announces the release of nanoCAD 3DScan 26, the latest version of its standalone solution for point cloud processing....

PROSTEP, Lattice Collaborate on Data Conversion in Shipbuilding

October 5, 2026

Schneider Electric to Acquire PTC for $22.6 Billion

October 5, 2026

Vention Opens Physical AI Lab for Manufacturing

October 5, 2026

Trimble Announces Winners of 2026 Momentum Awards

October 5, 2026

DMG MORI Precision Boring Launches PBN 200 | 1250 Horizontal Boring Machining Center

October 5, 2026

Design Industry Thought Leadership

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

Interviews

Exclusive Interview: BIMcollab Enters India to Help Project Teams Turn BIM into Better Coordination

June 7, 2026

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SIMULATION

Simscale Launches Engineering AI Agent for Onshape

Nitin Patil - September 30, 2026 0

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

Design News

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

Sachin R Nalawade - September 21, 2026 0

The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

September 7, 2026

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

September 4, 2026

SimScale Opens Engineering AI Agent to its Global Community

August 21, 2026

Dexory Deploys SimScale’s Engineering AI to Accelerate Warehouse Robotics Development

August 17, 2026

CASE STUDY | Watch Now | Mold Industry

3D Printing

AML3D Joins A$3.9 Million Advanced Aerospace Manufacturing Project

Nitin Patil - September 25, 2026 0

EDINBURGH, Australia, Sep 25, 2026 – AML3D Limited (ASX: AL3) (“AML3D” or “the Company”) is pleased to announce it is participating in a three-year...

Sinto Advanced Ceramics Expands AM Material Portfolio with Two Non-Oxide Ceramics

September 25, 2026

America Makes to Celebrate National Manufacturing Day with ‘3D Printing for Drones’ Student Experiences Across Five US States

September 25, 2026

Axiomatek to Bring EOS’ Industrial 3D Printing Technology in Mexico

September 23, 2026

Phase3D’s Fringe Inspection to Integrate into EOS Metal AM Machines

September 18, 2026

Stratasys Launches F870 Large-Format FDM 3D Printer

September 9, 2026

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BEACON India | SOLIDWORKS

SOLIDWORKS

SOLIDWORKS - BEACON India

BEACON SOLIDWORKS

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Sachin R Nalawade - October 2, 2026 0

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

September 25, 2026

DriveWorks for SOLIDWORKS: The Ultimate Design Automation Solution for Manufacturers

September 25, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

Nanosoft Releases nanoCAD 3DScan 26

Nitin Patil - October 5, 2026 0

MOSCOW, Russia, Oct 5, 2026 – Nanosoft AS announces the release of nanoCAD 3DScan 26, the latest version of its standalone solution for point cloud processing....

DMG MORI Precision Boring Launches PBN 200 | 1250 Horizontal Boring Machining Center

Nitin Patil - October 5, 2026 0

NAGAOKA, Japan, Oct 5, 2026 - As a member of the DMG MORI Group, DMG MORI Precision Boring Co., Ltd. (hereinafter “Precision Boring“) has launched the new...

ENGEL to Present WINTEC e-win 1800 Integrated Production Cell for Automotive Connectors, Debut viper 6 at Fakuma 2026

Nitin Patil - October 2, 2026 0

SCHWERTBERG, Austria, Oct 2, 2026 – With the electric WINTEC e-win 1800 and the new viper 6, ENGEL demonstrates how standard components such as...

Jigar Patel of University of Waterloo Wins $10,000 Innovation Prize in 2026 Dyndrite Student Competition

Nitin Patil - October 2, 2026 0

ORLANDO, FL, USA, Oct 2, 2026 - Dyndrite, a provider of next-generation industrial software for additive manufacturing, announced Jigar Patel of the University of...

MachineWorks 8.9 Previews GPU-powered Machine Simulation, New Recordings Reference Application

Nitin Patil - October 1, 2026 0

SHEFFIELD, UK, Oct 1, 2026 - MachineWorks Ltd, a leading supplier of software components to the engineering industry, is pleased to announce a preview...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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