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System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

Sachin R Nalawade - 0
The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...
CAE

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

Nitin Patil - 0
TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

SimScale Opens Engineering AI Agent to its Global Community

Dexory Deploys SimScale’s Engineering AI to Accelerate Warehouse Robotics Development

CIMdata Publishes 2026 Simulation and Analysis Market Report

CASE STUDY | Watch Now | Mold Industry

3D Printing

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BEACON India | SOLIDWORKS

SOLIDWORKS

SOLIDWORKS - BEACON India

3D CAD

SOLIDWORKS Visualize: Transform Your CAD Models into Photorealistic Visuals

Sachin R Nalawade - 0
Guest Post by: Pruthviraj Mistry, Customer Success Manager, BEACON India - Best Engineering Aids and Consultancies Pvt. Ltd.  Introduction In today's competitive manufacturing environment, a great product...

Superelasticity Material Behaviour and its Modelling in Abaqus CAE

Automate File Exports with SOLIDWORKS Task Scheduler | BEACON

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3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

Verisurf Introduces Online 3D Scanning Configurator

Nitin Patil - 0
CHICAGO, IL, USA, Sep 21, 2026 – Verisurf Software introduces an online 3D scanning configurator that helps manufacturers select a complete scanning solution for...

TRUMPF to Unveil TruPunch 5000 Punching Machine at EuroBLECH 2026

Nitin Patil - 0
DITZINGEN and HANOVER, Germany, Sep 21, 2026 – At EuroBLECH, TRUMPF is presenting the new generation of its most productive punching machine, the TruPunch 5000....

TRUMPF to Unveil TruLaser Weld 3000 Robotic Laser Welding Cell at EuroBLECH 2026

Nitin Patil - 0
DITZINGEN, Germany, Sep 21, 2026 – A shortage of skilled workers, frequently changing components, and limited production space pose challenges for many manufacturing companies....

Renishaw’s Equator-X Gauge Wins 2026 AMB Award for Measuring Technology, Quality Assurance

Nitin Patil - 0
GLOUCESTERSHIRE, UK, Sep 21, 2026 – Renishaw's Equator-X dual-method gauging system wins AMB Award for measuring technology and quality assurance. Renishaw, a world leader in...

Kennametal Introduces KAF82 Additive Tungsten Carbide Grade for Metal Cutting

Nitin Patil - 0
PITTSBURGH, PA, USA, Sep 18, 2026 - Kennametal Inc. (NYSE: KMT) announced a breakthrough in additive manufacturing that enables the rapid production of custom...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - 0
Design News
PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - 0
AI
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...
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