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Siemens Releases Simcenter Testlab 2606

Nitin Patil - September 29, 2026 0

PLANO, TX, USA, Sep 29, 2026 - Siemens announced the latest updates to Simcenter Testlab software, helping engineering teams reduce manual work, deliver consistent...

OPEN MIND Joins FANUC 5-Axis Integrated Technology Initiative

September 29, 2026

MathWorks Launches MATLAB, Simulink R2026b

September 29, 2026

Flow Science Announces Fall 2026 Asia-Pacific FLOW-3D User Conferences

September 29, 2026

InnovMetric Announces Global Partnership with Wuhan VISION3D

September 29, 2026

OPEN MIND USA Celebrates 30th Anniversary

September 29, 2026

Design Industry Thought Leadership

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

Interviews

Exclusive Interview: BIMcollab Enters India to Help Project Teams Turn BIM into Better Coordination

June 7, 2026

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SIMULATION

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System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

Sachin R Nalawade - September 21, 2026 0

The upcoming release includes new add-on products for utilizing system diagrams and modeling electric motors, as well as extended support for integrating AI tools...

CAE

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

Nitin Patil - September 7, 2026 0

TRIESTE, Italy, Sep 7, 2026 – ESTECO is pleased to announce Summer 2026 product update of VOLTA, modeFRONTIER and nDAI. ESTECO’s Summer 2026 product...

SunCubes Deploys SimScale’s Engineering AI to Develop Laser-based Charging Solutions that Let Drones, UAVs Recharge in Flight

September 4, 2026

SimScale Opens Engineering AI Agent to its Global Community

August 21, 2026

Dexory Deploys SimScale’s Engineering AI to Accelerate Warehouse Robotics Development

August 17, 2026

CIMdata Publishes 2026 Simulation and Analysis Market Report

July 7, 2026

CASE STUDY | Watch Now | Mold Industry

3D Printing

AML3D Joins A$3.9 Million Advanced Aerospace Manufacturing Project

Nitin Patil - September 25, 2026 0

EDINBURGH, Australia, Sep 25, 2026 – AML3D Limited (ASX: AL3) (“AML3D” or “the Company”) is pleased to announce it is participating in a three-year...

Sinto Advanced Ceramics Expands AM Material Portfolio with Two Non-Oxide Ceramics

September 25, 2026

America Makes to Celebrate National Manufacturing Day with ‘3D Printing for Drones’ Student Experiences Across Five US States

September 25, 2026

Axiomatek to Bring EOS’ Industrial 3D Printing Technology in Mexico

September 23, 2026

Phase3D’s Fringe Inspection to Integrate into EOS Metal AM Machines

September 18, 2026

Stratasys Launches F870 Large-Format FDM 3D Printer

September 9, 2026

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3D CAD

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

Sachin R Nalawade - September 25, 2026 0

Discover how SWOOD helps woodworking manufacturers design, automate, nest, and manufacture custom wood projects directly within SOLIDWORKS. Guest Post by Pruthu S Shastry, Application Engineer,...

DriveWorks for SOLIDWORKS: The Ultimate Design Automation Solution for Manufacturers

September 25, 2026

CAMWorks for SOLIDWORKS: The Complete Intelligent CAM Solution for CNC Manufacturing

September 22, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

OPEN MIND Joins FANUC 5-Axis Integrated Technology Initiative

Nitin Patil - September 29, 2026 0

WESSLING, Germany, Sep 29, 2026 - OPEN MIND Technologies, a leading developer of CAD/CAM software solutions worldwide, has announced it has become a founding...

InnovMetric Announces Global Partnership with Wuhan VISION3D

Sachin R Nalawade - September 29, 2026 0

InnovMetric, the independent software development company that empowers manufacturers of every size to digitally transform their 3D measurement processes, is proud to announce a...

OPEN MIND USA Celebrates 30th Anniversary

Nitin Patil - September 29, 2026 0

BOSTON, MA, USA, Sep 29, 2026 - OPEN MIND Technologies USA, the North American subsidiary of OPEN MIND Technologies AG, is celebrating its 30th anniversary of...

Titomic Receives $5 Million US Defense Contract for Next-Gen Cold Spray System

Nitin Patil - September 28, 2026 0

HUNTSVILLE, AL, USA, Sep 28, 2026 – Titomic Limited (ASX: TTT), a global leader in industrial-scale cold spray additive manufacturing and coating solutions, is pleased...

Dynamism to Bring AON3D’s Hylo Industrial 3D Printer in North America

Nitin Patil - September 28, 2026 0

MONTREAL, QC, Canada and CHICAGO, IL, USA, Sep 28, 2026 — AON3D announced a new reseller partnership with Dynamism, a Chicago-based additive manufacturing provider...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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