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Stratasys to Announce New Printer for Serial Production, European Debut of F870, Factory-Floor Applications from Toyota, GM at Formnext 2026

Nitin Patil - October 30, 2026 0

MINNETONKA, MN, USA and REHOVOT, Israel, Oct 30, 2026 - Stratasys Ltd. (NASDAQ: SSYS) will announce a new manufacturing solution, debut the F870 FDM...

EOS, BIZU Space Collaborate to Advance Additive Manufacturing for Next-Gen Space Propulsion Systems

October 30, 2026

Nikon SLM, PanOptimization Streamline Simulation-Based Build Preparation with PanX

October 30, 2026

Hypertherm Launches HPR 400 A Cartridge for Mild Steel Cutting

October 30, 2026

Continuum Appoints Laurie Richards as VP, Strategic Initiatives

October 30, 2026

Registration Opens for MathWorks’ 2026 MATLAB Online EXPO

October 30, 2026

Design Industry Thought Leadership

Interviews

An Interview with Mr. Joakim Johansson, Head of CRIBWISE & Digital Sales – Tool Flow Solution, Sandvik Machining Solutions

October 22, 2026

Interviews

Cloud-Native CAD and AI: Shaping the Future of Product Development — An Interview with Mr. David Katzman, Executive Vice President & General Manager, Onshape...

September 11, 2026

Interviews

An Interview with Mr. Koert Hagoort, SVP, Mendix R&D, Siemens Digital Industries Software: Shaping the Future of Low-Code Engineering and Connected Enterprise Applications

August 27, 2026

Interviews

An Interview with Mr. Ankur Gupta, Executive Vice President, EDA IC Software, Siemens EDA: AI, Advanced Chip Design, and the Future of Semiconductor Engineering

August 22, 2026

Interviews

Exclusive Interview | Dr. Patrick Hanley, Founder of Hanley Innovations, on the Future of CFD, AI, and Aerodynamics

July 16, 2026

Interviews

DailyCADCAM Interview with Dr Rob Ward, CEO & Co-Founder, DigitalCNC

July 11, 2026

Infrastructure

Exclusive Interview: Mr. Andy Rahden, Vice President of Solution Engineering and Services, Bentley Systems on AI, Digital Twins, and Future Infrastructure Engineering

June 20, 2026

Interviews

Exclusive Interview with Mr. Kaushik Chakraborty, Senior Vice President – Asia Pacific, Bentley Systems

June 20, 2026

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SIMULATION

Design News

Nikon SLM, PanOptimization Streamline Simulation-Based Build Preparation with PanX

Nitin Patil - October 30, 2026 0

LÜBECK, Germany, Oct 30, 2026 — Nikon SLM Solutions and PanOptimization LLC today announced a partnership to streamline the use of PanX, PanOptimization’s industry-leading...

CAE

SCALE Partners with Wissen Baum LLP to Introduce SCALE.sdm Simulation Data Management Solution in India

Sachin R Nalawade - October 17, 2026 0

Dresden, Germany – October 2026 – SCALE has announced a new technology partnership with Wissen Baum LLP to introduce its simulation data management solution,...

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

October 6, 2026

Simscale Launches Engineering AI Agent for Onshape

September 30, 2026

System-Level Modeling and Agentic AI Take the Spotlight in COMSOL Multiphysics Version 2027

September 21, 2026

ESTECO Releases VOLTA, modeFRONTIER, nDAI Summer 2026 Update

September 7, 2026

ASCON Brings 37 Years of Russian CAD Expertise to India with KOMPAS-3D

3D Printing

Stratasys Q3 FY2026 Conference Call on Nov 12, 8:30AM ET

Nitin Patil - October 30, 2026 0

MINNETONKA, MN, USA and REHOVOT, Israel, Oct 30, 2026 - Stratasys Ltd. (Nasdaq: SSYS) will release financial results for the third quarter ended September...

Precision Resource Expands US Additive Manufacturing Network with Two New Facilities, Adds 3D Systems’ DMP Flex Technology

October 29, 2026

Phillips to Bring 2oneLab’s Compact Metal AM Solutions in US Market

October 29, 2026

Velo3D Q3 FY2026 Conference Call on Nov 10, 2PM PT

October 29, 2026

Nidec Develops Autonomous Learning-Based Automatic Control System for its LAMDA Powder DED Metal 3D Printers

October 29, 2026

BigRep Returns to Private Ownership, Launches ALTRA 670 Large-Format Industrial 3D Printer

October 28, 2026

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SOLIDWORKS - BEACON India

3D CAD

BEACON India Successfully Hosts SOLIDWORKS Innovation Day 2026 in Ahmedabad, Showcasing SOLIDWORKS 2027 and the Future of AI-Driven Engineering

Sachin R Nalawade - October 31, 2026 0

Ahmedabad, October 29, 2026: BEACON India successfully hosted SOLIDWORKS Innovation Day 2026 in Ahmedabad, bringing together professionals from the engineering, design, and manufacturing industries...

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

October 2, 2026

SWOOD for SOLIDWORKS: The Complete CAD/CAM Solution for Woodworking Manufacturers

September 25, 2026

3D Product Architect in the 3DEXPERIENCE

MFG Tech Update

EOS, BIZU Space Collaborate to Advance Additive Manufacturing for Next-Gen Space Propulsion Systems

Nitin Patil - October 30, 2026 0

KRAILLING, Germany and SÃO JOSÉ DOS CAMPOS, Brazil, Oct 30, 2026 - EOS, a leading provider of additive manufacturing (AM) solutions, announced a collaboration...

Hypertherm Launches HPR 400 A Cartridge for Mild Steel Cutting

Nitin Patil - October 30, 2026 0

HANOVER, NH, USA, Oct 30, 2026 – Hypertherm Associates, a leading manufacturer of industrial cutting products and software, has expanded its HyPerformance (HPR) consumable...

Continuum Appoints Laurie Richards as VP, Strategic Initiatives

Nitin Patil - October 30, 2026 0

HOUSTON, TX, USA, Oct 30, 2026 - Continuum Powders, a leading provider of high-performance metal powders for advanced manufacturing, today announced the appointment of...

Kratos to Add AMCM M 8K Metal AM System to its Indiana Facility

Nitin Patil - October 29, 2026 0

NOVI, MI, USA, Oct 29, 2026 - EOS is proud to announce that Kratos Defense & Security Solutions, Inc., (NASDAQ: KTOS), a technology company...

Phillips to Bring 2oneLab’s Compact Metal AM Solutions in US Market

Nitin Patil - October 29, 2026 0

HANOVER, MD, USA, Oct 29, 2026 — Phillips Corporation, a global leader in manufacturing technology and services, announced a new partnership with 2oneLab Inc.,...

EDA

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power, Harsh-Environment Semiconductor Innovation

Nitin Patil - September 4, 20260

Design News

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...

TRUMPF Makes Glass Substrates Ready for Next-Gen of AI Chips

Nitin Patil - September 3, 20260

DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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3D CAD

BEACON India Successfully Hosts SOLIDWORKS Innovation Day 2026 in Ahmedabad, Showcasing SOLIDWORKS 2027 and the Future of AI-Driven Engineering

Sachin R Nalawade - October 31, 20260

3D Printing

Stratasys to Announce New Printer for Serial Production, European Debut of F870, Factory-Floor Applications from Toyota, GM at Formnext 2026

Nitin Patil - October 30, 20260

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