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SIMULATION

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

SPEE3D Appoints Bryan O’Connor as Global CEO

MELBOURNE, Australia, Oct 6, 2026 – SPEE3D, a leading global additive manufacturing company, is pleased to announce the appointment of Bryan O’Connor as its...

Mears Invests in Sixth Velo3D Sapphire XC System, Dedicating it to Cu-Ni Parts Production

FREMONT, CA, USA, Oct 6, 2026 - Velo3D, Inc. (Nasdaq: VELO) ("Velo3D"), a metal 3D printing technology company that enables customers to build mission-critical...

SolidCAM Upgrades its Simulator by Integrating MachineWorks GPU into SolidCAM 2026

SHEFFIELD, UK, Oct 6, 2026 – MachineWorks Ltd is pleased to announce that SolidCAM, a leading supplier of advanced CAD/CAM solutions, has enhanced the...

Okuma America Promotes Summer Cline to CFO

CHARLOTTE, NC, USA, Oct 6, 2026 – Okuma America Corporation announced the promotion of Mrs. Summer Cline to Chief Financial Officer (CFO). This promotion...

Nanosoft Releases nanoCAD 3DScan 26

MOSCOW, Russia, Oct 5, 2026 – Nanosoft AS announces the release of nanoCAD 3DScan 26, the latest version of its standalone solution for point cloud processing....

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...

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