Hexagon and Altium Partner to Improve Sustainability of Electronics Industry with Cloud-based Digital Reality Solutions
2 March 2023:
Hexagon’s Manufacturing Intelligence division and Altium have entered a strategic partnership which will help the design and manufacturing of electronics be more environmentally sustainable. The partnership...
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
PLANO, TX, USA, Oct 3, 2022 - Siemens Digital Industries Software introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for...
Amphenol Launches the SnapEDA Viewer with over 21,000 Free Ready-to-use CAD Models for Hardware Design
San Francisco, CA – (September 22, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over...
Zuken Releases eCADSTAR 2022 for IoT-Enabled PCB Designs
BRISTOL, UK and MUNICH, Germany, Jun 16, 2022 – With Release 2022 of eCADSTAR, Zuken continues to advance the concept of a user-friendly, internet-connected PCB design system for the small...
