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EDA
EDA
3D PCB Design
Siemens Acquires ASTER for PCBA Design, Manufacturing, Testing
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January 14, 2026
Design News
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
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December 13, 2022
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Automotive
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
Sachin R Nalawade
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November 16, 2022
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Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
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October 20, 2022
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Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
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SnapEDA Launches Syndication Network Spanning Over 30 Distribution Partners
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Amphenol Launches the SnapEDA Viewer with over 21,000 Free Ready-to-use CAD Models for Hardware Design
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September 27, 2022
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Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow
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Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program
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August 10, 2022
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Aviation
Kawasaki Heavy Industries Introduces Zuken’s E3.series and DS-E3 to Aircraft Development for Japan Ministry of Defense
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July 14, 2022
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Cadence to Acquire Future Facilities for Data Center Digital Twins
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Siemens NX Summer 2022 Release Brings Cross-Discipline Collaborative Tools for Mechanical, Electronic Teams, Knowledge Capture and Reuse Capability
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June 22, 2022
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Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes
Nitin Patil
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June 16, 2022
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SOLIDWORKS Tips & Tricks | BEACON India
Formlabs 3D Printer | BEACON India
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