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Design News
Siemens Introduces Questa One Agentic AI Toolkit for IC Design, Verification
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March 2, 2026
Design News
Keysight Introduces 3D Interconnect Designer for Chiplet, 3DIC Advanced Package Designs
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EasyLogix PCB Investigator Integrates with Essemtec Platform
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Siemens Acquires ASTER for PCBA Design, Manufacturing, Testing
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April 14, 2023
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Hexagon and Altium Partner to Improve Sustainability of Electronics Industry with Cloud-based Digital Reality Solutions
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March 6, 2023
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EPLAN Partner Network Expands to 60 Companies
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February 7, 2023
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Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules
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December 13, 2022
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Automotive
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
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Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
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Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
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October 3, 2022
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SnapEDA Launches Syndication Network Spanning Over 30 Distribution Partners
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September 28, 2022
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Amphenol Launches the SnapEDA Viewer with over 21,000 Free Ready-to-use CAD Models for Hardware Design
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September 27, 2022
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Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow
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September 26, 2022
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Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program
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August 10, 2022
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Aviation
Kawasaki Heavy Industries Introduces Zuken’s E3.series and DS-E3 to Aircraft Development for Japan Ministry of Defense
Nitin Patil
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July 14, 2022
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SOLIDWORKS Tips & Tricks | BEACON India
Formlabs 3D Printer | BEACON India
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