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EDA
EDA
Design News
Essemtec Introduces New 2K Precision Dispensing Solution for Electronics Manufacturing
Nitin Patil
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April 9, 2026
Design News
Modelithics Releases COMPLETE+3D Library v26 for Ansys HFSS
AI
Siemens Launches Fuse EDA AI Agent for Automation across Semiconductor, 3D IC and PCB System Workflows
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Marc Nikutowski Named as Director, Essemtec EMEA Sales
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Siemens Introduces Questa One Agentic AI Toolkit for IC Design, Verification
3D PCB Design
Zuken Releases eCADSTAR 2023 for Internet-Connected PCB Design
Nitin Patil
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June 9, 2023
0
CAE
Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto
Nitin Patil
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May 17, 2023
0
CAE
Ansys Joins TSMC’s OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
Nitin Patil
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April 28, 2023
0
Design News
Nicomatic Launches SnapEDA CAD Models for Over 8 Million Connectors to Accelerate Circuit Board Design
Sachin R Nalawade
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April 22, 2023
0
Design News
LogicSwap’s Free Data Migration Software Converts Third-Party PCB Design Data to eCADSTAR
Nitin Patil
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April 14, 2023
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Hexagon and Altium Partner to Improve Sustainability of Electronics Industry with Cloud-based Digital Reality Solutions
Sachin R Nalawade
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March 6, 2023
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EPLAN Partner Network Expands to 60 Companies
Sachin R Nalawade
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February 7, 2023
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Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules
Nitin Patil
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December 13, 2022
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Automotive
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
Sachin R Nalawade
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November 16, 2022
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Design News
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Nitin Patil
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October 20, 2022
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Design News
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
Nitin Patil
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October 3, 2022
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Design News
SnapEDA Launches Syndication Network Spanning Over 30 Distribution Partners
Sachin R Nalawade
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September 28, 2022
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SOLIDWORKS Tips & Tricks | BEACON India
Formlabs 3D Printer | BEACON India
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