Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
PLANO, TX, USA, Oct 3, 2022 - Siemens Digital Industries Software introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for...
SnapEDA Launches Syndication Network Spanning Over 30 Distribution Partners
SAN FRANCISCO, CA (September 28, 2022) - Today, SnapEDA, the first search engine for electronics design is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners,...
Amphenol Launches the SnapEDA Viewer with over 21,000 Free Ready-to-use CAD Models for Hardware Design
San Francisco, CA – (September 22, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over...
Cadence to Acquire Future Facilities for Data Center Digital Twins
SAN JOSE, CA, USA, Jul 13, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has entered into an agreement to acquire Future Facilities, a leading...
Siemens NX Summer 2022 Release Brings Cross-Discipline Collaborative Tools for Mechanical, Electronic Teams, Knowledge Capture and Reuse Capability
PLANO, TX, USA, Jun 22, 2022 - Siemens Digital Industries Software announced that the latest release of Siemens’ NX software, an industry leading product engineering solution, brings greater electronic...
Nano Dimension Appoints Saul Simon to its Board of Directors
WALTHAM, MA, USA, Jun 14, 2022 - Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), an industry leader in Additively Manufactured Electronics (AME) and Micro Additive Manufacturing (Micro-AM), announced the appointment of Saul Simon...
