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IC Design
IC Design
Design News
Lightium Selects Aras Innovator to Support Development of Photonic AI Chips
Nitin Patil
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May 14, 2026
Design News
Siemens Streamlines Design, Analysis of Complex, Heterogeneously Integrated 2.5D, 3D ICs with Two New EDA Solutions
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Japan-based Secafy Adopts Siemens’ EDA Tools for Innovative Hardware Security Development
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Zuken Joins IBM Research AI Hardware Center to Develop Next-Gen AI Hardware Solutions
Design News
Siemens Introduces Tessent In-System Test for Advanced, Deterministic Testing throughout Silicon Lifecycle
Design News
Siemens Advances Integrated Circuit Test and Analysis at 5nm and Below
Nitin Patil
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July 11, 2024
0
Design News
Siemens Introduces Calibre 3DThermal for 3D-IC Design
Nitin Patil
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June 26, 2024
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Design News
Siemens Offers AI-accelerated Verification for Analog, Mixed-Signal, 3D IC Designs in Solido Simulation Suite
Nitin Patil
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June 26, 2024
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Design News
Siemens Joins Semiconductor Education Alliance
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March 1, 2024
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3D PCB Design
Siemens, Intel Foundry Join to Develop Certified, Production-Ready EMIB Technology Reference Flow
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February 24, 2024
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Design News
Cadence Acquires Invecas to Advance System Design Engineering
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January 9, 2024
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Design News
Siemens Acquires Insight EDA to Expand Calibre Integrated Circuit Reliability Verification Offering
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November 16, 2023
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Automotive
Stanley Electric Adopts Siemens Questa Advanced Verification Platform for its MEMS IC Design
Nitin Patil
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October 11, 2023
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Artificial Intelligence
Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment
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July 11, 2023
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Automotive
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
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November 16, 2022
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Design News
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Nitin Patil
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October 20, 2022
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Design News
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
Nitin Patil
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October 3, 2022
0
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