Stanley Electric Adopts Siemens Questa Advanced Verification Platform for its MEMS IC Design
PLANO, TX, USA, Oct 11, 2023 - Siemens Digital Industries Software announced that Stanley Electric (“Stanley”), a leading automotive electronics company, has adopted Siemens’ Questa Advanced Verification platform as...
Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment
PLANO, TX, USA, Jul 11, 2023 - Siemens Digital Industries Software introduced Solido Design Environment software – an artificial intelligence (AI)-powered, cloud-ready integrated circuit (IC) design and verification solution...
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
MUNICH, GERMANY - Media OutReach - 15 November 2022 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as...
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
SAN JOSE, CA, USA, Oct 20, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), announced that it has expanded...
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
PLANO, TX, USA, Oct 3, 2022 - Siemens Digital Industries Software introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for...
Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow
PLANO, TX, USA, Sep 26, 2022 - Siemens Digital Industries Software announced that, it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new...
