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EDA
EDA
Design News
Certus Adopts AI-powered Solido for IO Library, Analog IP, ESD Development
Nitin Patil
-
December 4, 2025
Design News
Siemens Introduces Tessent AnalogTest for Automated Analog Circuit Test Generation
Design News
Synopsys, GlobalFoundries Collaborate to Bring Chip Design to Tapeout Education Pilot to Universities Worldwide
Design News
Chennai-based Data Patterns Selects Siemens Teamcenter, Polarion to Connect Design to Manufacturing
Design News
Siemens Launches PartQuest Design Enablement Portfolio for Electronic Component Manufacturers
Design News
Siemens Brings Real-Time Supply Chain Intelligence to Xcelerator, Digital Twin
Nitin Patil
-
June 16, 2023
0
3D PCB Design
Zuken Releases eCADSTAR 2023 for Internet-Connected PCB Design
Nitin Patil
-
June 9, 2023
0
CAE
Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto
Nitin Patil
-
May 17, 2023
0
CAE
Ansys Joins TSMC’s OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
Nitin Patil
-
April 28, 2023
0
Design News
Nicomatic Launches SnapEDA CAD Models for Over 8 Million Connectors to Accelerate Circuit Board Design
Sachin R Nalawade
-
April 22, 2023
0
Design News
LogicSwap’s Free Data Migration Software Converts Third-Party PCB Design Data to eCADSTAR
Nitin Patil
-
April 14, 2023
0
Design News
Hexagon and Altium Partner to Improve Sustainability of Electronics Industry with Cloud-based Digital Reality Solutions
Sachin R Nalawade
-
March 6, 2023
0
Design News
EPLAN Partner Network Expands to 60 Companies
Sachin R Nalawade
-
February 7, 2023
0
Design News
Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules
Nitin Patil
-
December 13, 2022
0
Automotive
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
Sachin R Nalawade
-
November 16, 2022
0
Design News
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Nitin Patil
-
October 20, 2022
0
Design News
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
Nitin Patil
-
October 3, 2022
0
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