Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules
BRISTOL, UK and MUNICH, Germany, Dec 13, 2022 – Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are...
Infineon and Stellantis Signs MOU for Multi-year Delivery of Silicon Carbide (SiC) Chips
MUNICH, GERMANY - Media OutReach - 15 November 2022 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as...
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
SAN JOSE, CA, USA, Oct 20, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), announced that it has expanded...
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
PLANO, TX, USA, Oct 3, 2022 - Siemens Digital Industries Software introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for...
SnapEDA Launches Syndication Network Spanning Over 30 Distribution Partners
SAN FRANCISCO, CA (September 28, 2022) - Today, SnapEDA, the first search engine for electronics design is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners,...
Amphenol Launches the SnapEDA Viewer with over 21,000 Free Ready-to-use CAD Models for Hardware Design
San Francisco, CA – (September 22, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over...
