Panasonic Invests in Zuken’s CR-8000 Series and DS-CR PCB Design Data Management Systems
YOKOHAMA, Japan, Nov 3, 2021 - Zuken Inc. is proud to announce that Panasonic Corporation has ordered the Zuken CR-8000 series of solutions for leading-edge electronic designs and DS-CR design data management systems for its...
Siemens Releases mPower Power Integrity Software for Analog, Digital and Mixed-Signal IC Designs
PLANO, TX, USA, Oct 25, 2021 - Siemens Digital Industries Software introduced new mPower power integrity software for analog, digital and mixed signal IC designs. Available now, the new...
Materialise, Proponent Join to Help Aerospace OEMs, Suppliers Access the Benefits of 3D Printing
LEUVEN, Belgium, Oct 25, 2021 - Materialise (NASDAQ: MTLS) and Proponent announced a partnership that will raise the profile of 3D printing in aerospace aftermarket supply chains. Proponent, headquartered...
Cadence Introduces Integrity 3D-IC Platform for Multi-Chiplet Design, Advanced Packaging
SAN JOSE, CA, USA, Oct 13, 2021 - Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the delivery of the Cadence Integrity 3D-IC platform, the industry’s first comprehensive, high-capacity...
Lenovo Joins NVIDIA’s Early Access Program for VMware Project Monterey to Enable Secure, Accelerated Data Centers
SANTA CLARA, CA, USA, Oct 11, 2021 - NVIDIA announced it is extending its collaboration with Lenovo to include participation in NVIDIA’s early access program in support of Project Monterey, which is...
Hexagon, Stratasys Partnership Unlocks Aerospace Innovation and Reduces Part Lead Time with Certified Design-to-3D-Print Solution for Plastics
LUXEMBOURG, Oct 8, 2021 - Hexagon's Manufacturing Intelligence division has announced a new solution with Stratasys, a leader in polymer 3D printing solutions, to help manufacturers in the aerospace...
