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DailyCADCAM
HAPPY CADING!
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Industry
Semiconductors
Semiconductors
Shapeways Strengthens Position in its Multi-Million-Dollar Automotive Sector with Newly Secured Electric Vehicle Contract
September 26, 2023
Registration Opens for Aras Connect 2023 European Tour
September 29, 2023
Design News
SK hynix Adopts Siemens Polarion to Help Gain Korea’s First ASPICE Certification
July 21, 2023
3D Printing
Oerlikon Joins with 3D Systems to Scale, Advance Metal Additive Manufacturing, Acquires 4th DMP Factory 500 3D Printer from 3D Systems
July 14, 2023
CAE
Ansys, Synopsys Advance RFIC Semiconductor Design with New Reference Flow for Samsung Technology
June 29, 2023
Design News
Lattice Introduces Lattice Insights Training Portal to Empower FPGA Application Design, Development
May 26, 2023
CAE
Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto
May 17, 2023
Design News
Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules
December 13, 2022
Design News
Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow
September 26, 2022
Design News
Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program
August 10, 2022
Design News
Samsung Adopts Ansys’ EM Simulation Portfolio to Create Semiconductor Designs to Optimize High-Speed Connectivity
July 8, 2022
CAE
Ansys Joins Intel Foundry Services Cloud Alliance to Advance Semiconductor Development
June 29, 2022
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