Sunday, April 28, 2024

Semiconductors

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Siemens, Intel Join for Advanced Semiconductor Manufacturing

SANTA CLARA, CA, USA and MUNICH, Germany, Dec 5, 2023 - Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed...

Ansys, Sony Join to Advance Image Sensor Simulation, Camera-based Features in Next-Gen Automotive Applications

PITTSBURGH, PA, USA, Nov 10, 2023 – Ansys (NASDAQ: ANSS) collaborated with Sony Semiconductor Solutions (Sony) to enhance high-fidelity image sensor simulation and camera-based features in next-generation automotive applications, including AV and...

Siemens Announces New $150 Million Investment in US Manufacturing for Critical Infrastructure

MUNICH, Germany and DALLAS, TX, USA, Nov 4, 2023 - Siemens announced an investment of US$150 million in a new high-tech manufacturing plant in Dallas-Fort Worth to help power...

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards

PITTSBURGH, PA, USA, Oct 20, 2023 – Ansys (NASDAQ: ANSS) has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform (OIP) Partner of the year awards for 2023....

Ansys Semiconductor Simulation Solutions Certified for UMC’s 3D Chip Technology

PITTSBURGH, PA, USA, Oct 19, 2023 – Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve the power,...

Stanley Electric Adopts Siemens Questa Advanced Verification Platform for its MEMS IC Design

PLANO, TX, USA, Oct 11, 2023 - Siemens Digital Industries Software announced that Stanley Electric (“Stanley”), a leading automotive electronics company, has adopted Siemens’ Questa Advanced Verification platform as...

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Dassault, Stellantis’ Peugeot Sport Join to Optimize Aerodynamics of PEUGEOT 9X8 Hybrid Hypercar for 2024 World Endurance Championship Season

PARIS, France, Apr 26, 2024 - Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) and Peugeot Sport, the motorsports division of Stellantis, announced their partnership to...

BETA CAE Systems Releases SPDRM v1.11.1

LUCERNE, Switzerland, Apr 26, 2024 - BETA CAE Systems announces the release of SPDRM v1.11.1. This version delivers a number of enhancements and fixes to...

COMSOL Conference 2024 to Make its European Visit to Florence, Italy in October

BURLINGTON, MA, USA, Apr 26, 2024 - The COMSOL Conference 2024 tour will make a stop in Florence, Italy, on October 22–24. The COMSOL...

Streamline Solutions Releases ELEMENTS 4.2.0 for Automotive CFD Design

LONDON, UK, Apr 26, 2024 – Streamline Solutions LLC is delighted to announce the release of ELEMENTS 4.2.0, an open-source CFD software suite for vehicle design...

AMEXCI, Nikon SLM Solutions Strengthen Collaboration in Nordics with AM Technology

LUBECK, Germany, Apr 26, 2024 — AMEXCI, a specialist in serial additive manufacturing, and Nikon SLM Solutions, a global provider of integrated metal additive manufacturing solutions,...