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Semiconductors

Design News

Siemens, ASE Collaborate on Innovator3D IC-driven 3Dblox Workflows for ASE’s VIPack Platform

Nitin Patil - September 26, 2025

Design News

Zuken Joins JOINT3 Consortium to Develop Next-Gen Semiconductor Packaging

Design News

Dassault, NIC Vietnam’s Collaborative Forum Unites 70 Leaders Across Industries to Accelerate Nation’s Semiconductor Rise

Design News

Siemens in Collaboration with Arm, ECS Launches Cre8Ventures Open Higher Education Program for Semiconductor Innovation Across Europe

Design News

Rapidus Adopts Siemens Teamcenter for Semiconductor Lifecycle Management

Design News

SK hynix Adopts Siemens Polarion to Help Gain Korea’s First ASPICE Certification

Sachin R Nalawade - July 21, 2023 0

3D Printing

Oerlikon Joins with 3D Systems to Scale, Advance Metal Additive Manufacturing, Acquires 4th DMP Factory 500 3D Printer from 3D Systems

Nitin Patil - July 14, 2023 0

CAE

Ansys, Synopsys Advance RFIC Semiconductor Design with New Reference Flow for Samsung Technology

Nitin Patil - June 29, 2023 0

Design News

Lattice Introduces Lattice Insights Training Portal to Empower FPGA Application Design, Development

Nitin Patil - May 26, 2023 0

CAE

Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto

Nitin Patil - May 17, 2023 0

Design News

Zuken, CSA Catapult Present Results of R&D Collaboration for Optimization of Tools for Design of Power Modules

Nitin Patil - December 13, 2022 0

Design News

Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow

Nitin Patil - September 26, 2022 0

Design News

Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program

Nitin Patil - August 10, 2022 0

Design News

Samsung Adopts Ansys’ EM Simulation Portfolio to Create Semiconductor Designs to Optimize High-Speed Connectivity

Nitin Patil - July 8, 2022 0

CAE

Ansys Joins Intel Foundry Services Cloud Alliance to Advance Semiconductor Development

Nitin Patil - June 29, 2022 0

Design News

Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes

Nitin Patil - June 16, 2022 0

5G

Ansys Releases Totem-SC, PathFinder-SC to Optimize Power, Reliability for Automotive, 5G, HPC Semiconductors

Nitin Patil - June 9, 2022 0

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