LAKE MARY, FL, USA, Sep 3, 2020 – FARO Technologies, Inc. (NASDAQ: FARO), a global leader of 3D measurement, imaging and realization solutions for the 3D Metrology, AEC (Architecture, Engineering & Construction), and Public Safety Analytics markets, announced that it has hired two industry veterans to join its senior leadership team and manage the global hardware and software R&D teams. Avi Ray-Chaudhuri, who serves as Vice President of Hardware R&D, and Wesley Tilley, who serves as Vice President of Software R&D, joined the Company on August 31, 2020.

“As FARO continues to increase its focus on cloud-based software applications that enable long-term differentiation of our 3D solutions, we are adding critical talent to FARO’s executive team to lead both our software and hardware R&D organizations that will accelerate our product development efforts,” said Michael Burger, President and CEO of FARO. “I am thrilled to have two industry leaders like Wes and Avi join our organization and lead these teams.”

Avi Ray-Chaudhuri has over 20 years of leadership success in diverse industries including semiconductor, advanced lithography, and laser development. Most recently, he served as VP, Engineering, Commercial Lasers for Lumentum, where he significantly reduced the product development cycle time and implemented best-in-class program management, engineering and operations practices. Ray-Chaudhuri earned a Doctor of Philosophy, Electrical Engineering from the University of Wisconsin and a B.S. in Electrical Engineering from Princeton University.

Wes Tilley brings has more than 30 years of experience in the telecommunications industry, primarily in the areas of product management and R&D leadership. He most recently served as VP, Communications Software as a Service at Oracle, where he led a strategic shift in global business unit strategy to Cloud native, SaaS offerings in the telecommunications space. Tilley has an MBA in General Management from Duke University and a B.Sc Computer Science from North Carolina State University.

For more information, visit https://www.faro.com.

IRVINE, CA, USA, Sep 2, 2020 – EON Reality, the global leader in Augmented and Virtual Reality-based knowledge and skills transfer for industry and education, is proud to unveil the release of EON-XR, the brand new all-encompassing solution for XR learning and training.

EON-XR’s new evolution marks an XR transformation for  academic and industrial education

EON XR comes after over 20 years of perfecting an AR and VR platform based on patented technology which has received more than 20 international awards. Through the use of XR — the umbrella covering everything in AR, VR, and Mixed Reality — the new evolution of EON-XR is a massive step forward for a world in which remote learning is more important than ever. EON-XR brings a sleek new user experience built from the ground up to maximize ease of use for both the new and existing features.

Of the new features, one of the biggest additions in EON-XR is the ability to hold a remote immersive session as a team through our multi-user feature. This feature enables instructors to add XR learning components to their remote education materials, providing a more hands-on way for students and trainees to experience the topics they’re using in real time — which can be particularly useful in conjunction with EON-XR’s life-size AR scaling capabilities. Rather than a small photo in a textbook, EON-XR allows teachers and trainers to utilize full-size 3D models, Interactive 360° images, and 360° videos to bring their audience face-to-face with the subject matter. EON-XR also provides AR assistance in real time, so that the users get the contextual instructions when they need it, whether in Side by Side AR mode or in Overlaid AR mode.

Two other major improvements in EON-XR are the ability to create multiple 3D recordings within the same session — meaning that instructors can quickly create and demonstrate detailed procedures and aspects of a 3D model (such as a piece of equipment or interactive environment) in XR — and the ability to add 360° videos to lessons focusing on a 3D object. From a remote education perspective this means that not only can teachers and trainers show how an object functions, they can now show exactly how and where it fits within a larger real-life scenario.

While these features are all fully functional on computers, smartphones, and tablets, users who prefer to experience EON-XR while wearing an XR headset (such as an Oculus Rift, HTC Vive, or Magic Leap) will be able to enjoy some exclusive new features as well.

The new 3D assessment tool brings live XR procedural assessment to EON-XR, so instructors can test their pupils’ education by making them replicate the steps of a certain process. At the end of each assessment, EON-XR shows the user a report based on their performance, which is also provided to appropriate instructors. This report includes completion percentage, any additional or inaccurate steps, and the amount of time in which it was completed.

Staying within XR headsets, the new Search Assist functionality allows users to scour the internet for relevant information about the memos and annotations they’ve created without ever leaving the application — putting more information at a user’s fingertips than ever before.

As a part of the new EON-XR release EON Reality also introduces the patented new system using virtual lasers for interacting with XR environments. Mobile devices can employ virtual pointers and control buttons to enable users to interact with the objects. Users can aim the pointer at an object, select the object, and then drag and drop thel object to a new location. Embodiments also enable users to select, move, transform, create and delete objects with the pointer. This new virtual pointer technology also provides users with a means of drawing lines and geometric virtual objects.

About EON Reality

EON Reality is the world leader in Augmented and Virtual Reality-based knowledge and skills transfer for industry and education. EON Reality’s 21 years of success are tied to its belief that knowledge is a human right and should be available, accessible, and affordable for every human on the planet. To carry this out, EON Reality has developed the de-facto standard for Augmented Reality and Virtual Reality-based knowledge and skills transfer software that supports devices from mobile phones to large immersive domes. EON Reality’s global development network — with more than 20 locations worldwide — has created the world’s leading AR/VR library for education and industry with over 8,000 applications and over 40 million users worldwide. For more information, visit https://eonreality.com.

NORCROSS, GA, USA, Sep 2, 2020 – Innovate UK, the country’s innovation agency, has selected Hexagon’s Geospatial division to conduct a research project that will result in faster and higher-precision mapping of railway infrastructure through the use of artificial intelligence. The project is funded by Network Rail, the owner and operator of Great Britain’s railway infrastructure, under its R&D portfolio and delivered by Innovate UK through the SBRI competition, Innovation in Automated Survey Processing for Railway Structure Gauging, Phase One. A small group of teams was selected for this effort.

The project will enable Network Rail to automatically identify and measure railway structures from LiDAR data, saving valuable time and resources, while also improving planning and operations across the rail network. The current, manual process takes analysts months or even years due to the size of the data and the labor-intensive tasks involved.

“The combination of cross-sectional area, shape, length and speed all place a space requirement on today’s railway,” said James Sweeney, Senior Engineer at Network Rail. “We anticipate this project will offer us a more efficient way to capture, analyse and measure railway features along 20,000 miles of track, which is important to railway safety and the growth and capacity of our network.”

Network Rail collects detailed information about its track and the surrounding features, such as bridges and tunnels. The data is then analyzed to assess clearances between trains and the infrastructure around them, which is key to safety. The new project aims to automate the extraction and calculation of railway features from sensor data, leveraging AI to automatically analyse point cloud data, identify different structure types and perform measurements on the structures. The data will be collected from reality capture solutions from Hexagon’s Geosystems division.

“Network Rail, supported by Innovate UK, is leading the way in the use of AI to automate rail structure identification and measurement,” said Mladen Stojic, president of Hexagon’s Geospatial division. “We are excited to be part of a project that can help transform the gauging process for UK railways.”

Learn more about how Hexagon helps organizations close the gap between the geospatial and operational worlds with its transportation solutions.

About Hexagon

Hexagon is a global leader in sensor, software and autonomous solutions. We are putting data to work to boost efficiency, productivity, and quality across industrial, manufacturing, infrastructure, safety, and mobility applications.

Our technologies are shaping urban and production ecosystems to become increasingly connected and autonomous — ensuring a scalable, sustainable future.

Hexagon’s Geospatial division creates solutions that visualize location intelligence, delivering a 5D smart digital reality with insight into what was, what is, what could be, what should be, and ultimately, what will be.

Hexagon (Nasdaq Stockholm: HEXA B) has approximately 20,000 employees in 50 countries and net sales of approximately 4.4bn USD. Learn more at hexagon.com and follow us @HexagonAB.

ROCK HILL, SC, USA, Sep 2, 2020 – 3D Systems (NYSE:DDD) announced that Jagtar Narula will join the company as Executive Vice President and Chief Financial Officer, effective September 14. He will report to President and CEO, Dr. Jeffrey Graves, and lead the company’s Finance organization, including all finance operations and investor relations.  With a strong technical foundation and extensive experience in investment strategy, Jagtar will play a central role in capital deployment for growth and margin expansion.

 Jagtar Narula, new CFO, 3D Systems

Building upon a strong educational foundation in both Engineering and Finance, Mr. Narula brings to 3D Systems 28 years of progressive financial and business leadership, including extensive M&A experience as well as leading global transformations through both integration of acquisitions and selective divestitures.  Currently, he is SVP Corporate Strategy and Business Development for Blackbaud Corporation where he also previously led Investor Relations and Financial Planning.  Prior to that, Mr. Narula had finance leadership positions of increasing responsibility at Xerox, GE and with private equity.  He holds an MBA from The Wharton School of the University of Pennsylvania as well as an Engineering degree from the University of New York at Buffalo.

“I am excited to have a leader of Jagtar’s experience join our team at such an important time for our company,” said Dr. Graves. “Jagtar’s experience in leading technology companies with complex transformations and large-scale efficiency improvements will be invaluable as we transition to our new focus, align our organization and cost structure to our current revenues, and position ourselves for sustained growth and profitability in the years ahead.  I want to add a special note of thanks to Wayne Pensky for serving as our Interim CFO, allowing us to move quickly to restructure the business and prepare for an exciting future ahead.  Wayne will support Jagtar to ensure a smooth transition in Finance leadership for the company.”

About 3D Systems

More than 30 years ago, 3D Systems brought the innovation of 3D printing to the manufacturing industry. Today, as the leading Additive Manufacturing solutions partner, we bring innovation, performance, and reliability to every interaction – empowering our customers to create products and business models never before possible. Thanks to our unique offering of hardware, software and materials, each application-specific solution is powered by the expertise of our application engineers who collaborate with customers to transform how they deliver their products and services. 3D Systems’ solutions address a variety of advanced applications in Healthcare and Industrial markets such as Medical and Dental, Aerospace & Defense, Automotive and Durable Goods. More information on the company is available at www.3dsystems.com.

LEVIS, QC, Canada, Sep 2, 2020 – Creaform, the worldwide leader in portable and automated 3D measurement solutions, is pleased to announce the appointment of Marc-Antoine Schneider as Head of Sales. Based in Grenoble, France, Mr. Schneider will lead Creaform’s global sales and business development strategies and tactics for all territories and application markets.

Marc-Antoine Schneider, Creaform’s  new Global Head of Sales

During his tenure at Creaform, Mr. Schneider has developed and expanded the company’s network of distributors across multiple countries. Before being named Head of Sales, he was Creaform’s EMEA Sales Territory Manager and contributed to opening branches in Italy and Spain. With a master’s degree in Business Administration, Mr. Schneider originally joined Creaform in 2008 and held several positions in sales for the company, including Regional Sales Manager of Europe, the Middle East, and Africa.

“It is an honour for me to join the Creaform management team. I expect a smooth transition as we address new market challenges and deploy our strong business plan,” said Mr. Schneider. “I look forward to advancing Creaform’s culture of innovation and market-driven strategies.”

“We are thrilled that Mr. Schneider accepted the nomination,” said Fanny Truchon, President at Creaform. “The coming months and years will require us to adjust to a new reality. I am confident he has the forward-thinking mindset and agility to support our worldwide network of sales partners.”

About Creaform

Creaform develops, manufactures, and sells 3D portable and automated measurement technologies and specializes in engineering services. The company offers innovative solutions for applications such as 3D scanning, reverse engineering, quality control, non-destructive testing, product development, and numerical simulation (FEA/CFD). Its products and services cater to a variety of industries, including automotive, aerospace, consumer products, heavy industries, healthcare, manufacturing, oil and gas, power generation, research and education.

With headquarters and manufacturing operations in Lévis, Québec, Creaform operates innovation centers in Lévis as well as Grenoble, France, with direct sales operations in Canada, USA, Mexico, Brazil, France, Germany, Italy, Spain, China, Japan, Korea, Thailand and Singapore. Creaform is part of AMETEK Ultra Precision Technologies, a division of AMETEK Inc., which is a leading global manufacturer of electronic instruments and electromechanical devices, with annual sales of approximately $5 billion. For more information, visit https://www.creaform3d.com/.

MOUNTAIN VIEW, CA, USA, Sep 2, 2020 – Synopsys, Inc. (Nasdaq: SNPS) announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today’s complex multi-die systems for applications like high-performance computing (HPC), automotive and mobile.

“Applications such as AI and 5G networking increasingly require higher levels of integration, lower power consumption, smaller form factors, and faster time to production, and this is driving the demand for advanced-packaging technologies,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “TSMC’s Innovative 3DIC technologies such as CoWoS® and InFO enable customer innovation with greater functionality and enhanced system performance at increasingly competitive costs. Our collaboration with Synopsys provides customers with a certified solution for designing with TSMC’s CoWoS® and InFO packaging technologies to enable high productivity and faster time to functional silicon.”

The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package. The solution includes features such as TSMC design macro support and auto-routing of high-density interposer based interconnects using CoWoS technology. For RDL-based InFO designs, schedules are reduced from months to a few weeks through automated DRC-aware, all-angle multilayer signal and power/ground routing, power/ground plane creation, and dummy metal insertion, along with the support for TSMC design macros.

For CoWoS-S and InFO-R designs, dies need to be analyzed in the context of the package and the overall system.  Die-aware package and package-aware die power integrity, signal integrity, and thermal analysis are critical for design validation and signoff. Integration of Ansys’ RedHawk™ family of chip-package co-analysis solutions in 3DIC Compiler meets this critical need, enabling seamless analysis and faster convergence to an optimal solution. Customers can achieve smaller designs and higher performance by eliminating overdesign.

“Synopsys and TSMC recognize the design challenges being faced by our customers looking to create next-generation products using multi-die solutions, and our collaboration provides our mutual customers with an optimized path to implementation,” said Charles Matar, senior vice president of System Solutions and Ecosystem Enablement for the Design Group at Synopsys. “By providing natively implemented silicon interposer and fan-out layouts, physical verification, co-simulation and analysis capabilities in a single unified platform, we enable our customers to address today’s complex architectures and packaging requirements, in addition, to increased productivity and faster turnaround time.”

For more information, please visit Synopsys’ 3DIC Compiler’s webpage at www.synopsys.com/3DIC.

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

LONDON, UK, Sep 1, 2020 – AVEVA, a global leader in engineering and industrial software, unveiled ‘Cloud-First’, a key component of its long-term software portfolio strategy to focus on providing core services in the cloud to ensure high uptime and availability, user management and the flexibility to try new solutions. The strategy includes the introduction of scenario-driven integration between products for rapid time to value.

As part of this strategy, AVEVA has also announced significant new advances to its industry-leading cloud platform, AVEVA Connect –  AVEVA Unified Engineering and AVEVA Insight Guided and Advanced Analytics. These new solutions, accessed in the cloud, reduce total cost of ownership, help users to improve efficiency and enable decision support with infused industrial Artificial Intelligence (AI).

Designed to securely host AVEVA software solutions in the cloud, AVEVA Connect already enables more than 1,900 customers and over 25,000 users to access multiple products from one platform with a single sign-on. Connecting teams, data and processes in the Cloud is a key differentiator for AVEVA today given the changes in working patterns, the massive amounts of data being generated by industries and the need to bring many disparate processes together via one source. It facilitates improved user management across all assets as well as the capability to monitor usage of subscription credits across the entire AVEVA software portfolio.

“The new normal has required a shift in business focus and imperatives,” said Ravi Gopinath, Chief Cloud Officer and Chief Product Officer, AVEVA. “Moving forward, businesses will witness reduced capital investments, changing working processes, a heightened need for visualization tools and much greater agility and responsiveness across the value chain to minimize value leaks and optimize production to maximize profit opportunities.  Organizational focus has shifted to demand increased flexibility, much more real time collaboration, intelligent applications and a more streamlined user experience. AVEVA Connect will serve as a ‘one stop shop’ for all these requirements.”

New AVEVA Connect Solutions delivering Improved Efficiencies for Industrial Organizations

AVEVA Unified Engineering, breaks down the silos to deliver a collaborative data-centric environment with a single source of accountability across the engineering lifecycle. Multi-discipline teams across owner operators and EPCs can now collaborate to execute greenfield and brownfield projects with high traceability in a secure cloud environment that can be set up in days to accelerate time to value and reduce total installed cost. The AVEVA Insight Guided and Advanced Analytics are now available in the Cloud for advanced pattern recognition to augment automated analytics and condition monitoring. The solution offers a quick time to value enabling customers to start on a predictive analytics-based Asset Performance strategy without the need for complex modelling or data science. This solution allows the user to create easy-to-deploy models targeting specific assets, providing reliable anomaly detection with minimal configuration

AVEVA’s Cloud-First Strategy to Cater for Demands of the New Normal

From operating information analysis and low-code application development to complex engineering visualization, AVEVA Connect’s functionality allows easy trials for new capabilities. This will enable customers to benefit from the latest, most innovative products available, all accessed via the cloud.

‘Cloud-First’ includes the introduction of scenario-driven integration between products for rapid time to value. Later this year, AVEVA will also introduce software development kits to enable partners to provide their solutions within the AVEVA Connect platform in order to increase the range of capabilities available to customers.

“The shift to the cloud isn’t a matter of choice but something that must aggressively be pursued. The tremendous advantages of deployment and ownership costs, the ability to flexibly consume purely based on need and the removal of localized barriers to allow unprecedented levels of work efficiency and collaboration mean that we will continue to add to the rich domain content of our portfolio, because this is not just about technology, but about the realities and specifics of our customer’s business,” concluded Ravi Gopinath, Chief Cloud Officer and Chief Product Officer, AVEVA.

About AVEVA

AVEVA is a global leader in engineering and industrial software driving digital transformation across the entire asset and operations life cycle of capital-intensive industries.  The company’s engineering, planning and operations, asset performance, and monitoring and control solutions deliver proven results to over 16,000 customers across the globe. Its customers are supported by the largest industrial software ecosystem, including 4,200 partners and 5,700 certified developers. AVEVA is headquartered in Cambridge, UK, with over 4,400 employees at 80 locations in over 40 countries. For more details visit: www.aveva.com

TRIESTE, Italy, Sep 1, 2020 – High-profile names from the automotive sector join the next ESTECO Users’ Meeting 2020 for a vibrant automotive-focused session. Register now and don’t miss experts from Ford Motor Company, IVECO, Mahindra & Mahindra and TAFE present compelling applications of modeFRONTIER to enhance comfort and security in vehicles.

Our technology has been used for years from major companies in the automotive industry to manage hundreds of interrelated design parameters, understand their interactions, and balance complex tradeoffs while making decisions. We decided to gather some of the most interesting applications in a focused session during UM20.

1. Bill Dowling, Technical Expert Vehicle Architecture & Attribute Synthesis at Ford Motor Company, is going to present at ESTECO Users’ Meeting 2020 with a talk titled “Vehicle Architecture & Attribute Trade Space Analysis”
2. Alfonso Hickman, MDO CAE Engineer, also from Ford Motor Company, is going to give his presentation “modeFRONTIER as a platform for innovation in automotive FMVSS 201u design robustness automation”
3. Andrea Morello, Performance Engineer and CAE senior analyst, and Marco Barbi, Structural analyst senior at IVECO, join the lineup of the Automotive session with their presentation “Crash brackets development for ECE R29”
4. Abhijit Londhe, Senior Principal Engineer at Mahindra & Mahindra, is going to talk about “Optimization of Farm Tractor Rollover Protective Structure Optimization using modeFRONTIER”
5. Finally, Nalini Mukherjee, R&D Manager from TAFE Motors and Tractors Limited, will hold his speech “3D Combustion Bowl Geometry Optimization using Response Surface Modeling“

Register for the ESTECO Users’ Meeting 2020 and join this inspiring automotive session and many other engaging presentations.

About ESTECO

ESTECO is an independent software provider, highly specialized in numerical optimization and simulation data management with a sound scientific foundation and a flexible approach to customer needs. With more than 15 years’ experience, the company supports leading organizations in designing the products of the future, today. ESTECO smart engineering suite brings enterprise-wide solutions for design optimization, simulation data management and process integration and automation with the aim of helping companies excel across this innovation journey. Over 300 international organizations across many different industries have chosen ESTECO to consolidate specialized expertise, streamline teamwork and boost product development. Founded in 1999, the company is headquartered in Trieste (Italy), with offices in Michigan (USA), Pune (India) and an international network of channel partners. For more information, visit www.esteco.com.

LONDON, UK, Sep 1, 2020 – Advanced Design Technology (ADT), a global leader in the design of unique turbomachinery design software TURBOdesign Suite, is delighted to announce that CADFEM GmbH and ADT LTD have reached agreement for CADFEM to distribute TURBOdesign Suite in Germany, Switzerland and Austria.

“We are very pleased to be working with CADFEM,” said Professor Mehrdad Zangeneh, Managing Director of ADT. “CADFEM is a major player as an ANSYS reseller in many countries, particularly in DACH countries, and the close integration of TURBOdesign Suite and ANSYS Workbench provides an excellent opportunity to use those close links with the turbomachinery industry. This partnership will help support customers in the DACH region and their need for advanced turbomachinery design tools based on 3D Inverse Design. It will also help many companies in the DACH region to benefit from higher performance, faster development time and quicker multi-point, multi-objective, multi-disciplinary optimization offered by TURBOdesign Suite coupled with ANSYS Workbench.”

“Many of CADFEM’s turbomachinery customers need to design high performance turbomachines that meet multi-point, multi-objective and multi-disciplinary requirements and ADT’s TURBOdesign Suite offers the best solution on the market. It provides a rapid method for development of high-performance turbomachinery, can be closely integrated with ANSYS workbench and is particularly suited to new manufacturing methods such as additive manufacturing.” said Jurgen Vogt, Managing Director of CADFEM GmbH.

TURBOdesign Suite is a unique turbomachinery design software package based on 3D Inverse Design technology. TURBOdesign Suite helps engineers significantly cut design time and cost to create breakthrough designs for all types of turbomachinery components, from pumps and hydraulic turbines to fans and blowers, compressors and high-speed turbines.

Using the software, designers evaluate turbomachinery package size and performance predictions; perform detailed 3D blade design with 3D inverse design capabilities; analyze flow information per component; stage performances with turbomachinery specific 3D computational fluid dynamics (CFD); and automate exploration of the design space with automatic optimization capabilities.

Effective June 1st, 2020, CADFEM GmbH will be responsible for the commercialisation of TURBOdesign Suite in Germany, Switzerland and Austria.

About Advanced Design Technology

Advanced Design Technology (ADT) is a global leader in the development of advanced turbomachinery design methods, which help shorten development time and improve performance of turbomachinery components. ADT’s aim is to put designers in direct control of the aerodynamic design and to considerably shorten the design time and time to market for a range of turbomachinery products. ADT’s clients, who represent some of the leading global players in the aerospace, automotive, power generation and marine fields, have achieved significant returns on investment in terms of reduction in design times, higher performance and ease of know-how transfer among different design teams and projects. For more information, call +44 (0) 20 7299 1170 or visit www.adtechnology.com.

About CADFEM GmbH

CADFEM was founded near Munich in 1985 and has continuously aided and advanced the practical application of technology in business and science. Their name has long been synonymous with a close partnership with ANSYS: CADFEM sells the entire ANSYS simulation portfolio for structural mechanics, fluid mechanics, electromechanics, electromagnetics, electronics and embedded software.