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Bricsys Appoints Jaishankar Menon as Head of Sales for the Indian Subcontinent

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June 30, 2020: India- Bricsys welcomes Jaishankar Menon as our Head of Sales for the Indian subcontinent, a geography that also includes Sri Lanka, Bangladesh & Nepal.

Mr. Menon has more than two decades of experience in the engineering design, technical software and enterprise systems space. He joins Bricsys after growing sales, distribution channels and operations for leading software companies like Oracle, PTC, Dassault Systemes, Autodesk & Bentley Systems. He has built strong distribution, technology and academic partnerships across the region.

Mr. Jaishankar Menon
Mr. Jaishankar Menon

Mr. Menon helped increase the adoption of Autodesk Revit in India, working with over 500 AEC firms on the subcontinent. His work led to record-breaking revenues for the AEC division at Autodesk. He has specific expertise in product packaging, pricing and distribution strategies customized for the Indian markets.

“I am looking forward to supporting the Bricsys vision to provide tools for people who build things. It’s a perfect time to re-launch the BricsCAD brand in India, as we are in a new phase of nation-building across infrastructure, manufacturing, and digitalization,” Mr. Menon stated. “I will work to build strategic relationships between product users, channel partners, software developers (ISV’s), training centers and technical & engineering colleges.”

Chris Lee, Bricsys VP of APAC, said: “The Bricsys team is excited to welcome Jaishankar Menon as our new leader for India. India plays a critical role in the world’s economy. His work will help us deliver on the Bricsys commitment to bring the best CAD products to our clients & business partners. Bricsys believes in the future of DWG. Jaishankar will bring new energy into the Indian CAD community and sales channels across the subcontinent.”

Mr. Menon earned his degree in Mechanical Engineering from Bangalore University. Please join us in welcoming him to Bricsys and the Hexagon family.

Bricsys

Bricsys® is a global provider of dwg engineering design software brought to market under the BricsCAD® brand.

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OpenCFD Releases OpenFOAM v2006

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BRACKNELL, UK, Jul 1, 2020 – OpenCFD is pleased to announce the June 2020 release of OpenFOAM v2006 (20 06). This release extends OpenFOAM-v1912 features across many areas of the code. The new functionality represents development sponsored by OpenCFD’s customers, internally funded developments, and integration of features and changes from the OpenFOAM community.

OpenFOAM is distributed by OpenCFD under the GPL license as:

  1. Source code to be compiled on any Linux system
  2. Pre-compiled binary installation for Linux systems
  3. Pre-compiled binary installation for Mac OS X systems
  4. MS Windows installer
  5. Bash on Ubuntu on Windows for MS Windows 10

Please refer to the download instructions to obtain the code.

The development repositories are publicly available. These repositories are regularly updated with bug fixes and new functionality.

Upgrading

  1. Help for users is provided in the user upgrade guide.
  2. Help for developers is provided in the developer upgrade guide.
  3. We have also initiated documentation on coding patterns to improve the understanding of some typical idioms, where the reasoning may not be immediately obvious or where there are advantages to using a particular approach. We are happy to incorporate content!

Pre-processing

  1. Improved blockMesh utility more…
  2. New baffle creation in blockMesh more…
  3. New ramp Function1 more…
  4. New expression Function1 more…
  5. New expression PatchFunction1 more…
  6. New coded PatchFunction1 more…
  7. snappyHexMesh: New controls to disable gap refinement more…

Numerics

  1. Improved Arbitrary Mesh Interface (AMI) more…
  2. Community contribution: Integration of OpenQBMM more…
  3. New dense-matrix eigendecomposition solver more…
  4. Community contribution: New and improved adjoint optimisation tools more…
  5. New directional meshwave more…
  6. Governance contribution: New external solver module more…

Solvers and physical models

  1. Improved thermal baffle more…
  2. Improved handling for particle injection bounds more…
  3. New particle Weber number cloud function object more…
  4. Improved Curle function object more…
  5. Improved multiphase phase change more…
  6. Community contribution: New isoAdvector solvers more…
  7. New pipelined Conjugate Gradient (CG) solvers more…
  8. New cloud function object to remove particles more…
  9. Improved lumped point movement for large structures more…
  10. Community contribution: New and updated avalanche and mud slide tools more…

Boundary conditions

  1. New suite of atmospheric boundary layer tools more…
  2. New wall-blending for low- and high-Reynolds number flows more….

Post-processing

  1. Improved data conversion to Ensight format more…
  2. New momentum error function object more…
  3. New reading of Abaqus surface files more…
  4. Community contribution: New interface height function object more…
  5. New Dynamic Mode Decomposition (DMD) tools more…
  6. New Obukhov length function object more…
  7. Community contribution: New log(x) function object more…
  8. New pow(x) function object more…
  9. Improved controls for sampled surfaces more…

Build system

  1. New pre-compiled packages more…
  2. Improved wmake build system more…
  3. Visualization Module more…

Documentation

  1. Overhaul of OpenFOAM user documentation more…

About OpenFOAM

OpenFOAM is the free, open source CFD software released and developed primarily by OpenCFD Ltd since 2004. It has a large user base across most areas of engineering and science, from both commercial and academic organizations. OpenFOAM has an extensive range of features to solve anything from complex fluid flows involving chemical reactions, turbulence and heat transfer, to acoustics, solid mechanics and electromagnetics. For more information, visit https://www.openfoam.com.

NUMECA Releases FINE/Acoustics v9.1 for CFD

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BRUSSELS, Belgium, Jul 1, 2020 – NUMECA is delighted to announce the official release of FINE/Acoustics version 9.1. FINE/Acoustics is a complete simulation suite for the analysis of a broad range of industrial applications involving Acoustics, Vibro-Acoustics and Aero-Acoustics, from fast pre-design calculations to detailed large-scale analysis.

 

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Discover the advantages of the newest version of FINE/Acoustics, NUMECA’s integrated simulation suite for Aero-Vibro-Acoustics.

Improved Wizard for Tonal and Broadband Noise Analysis for Turbomachinery 

Speed 

The new solver is 2x faster and consumes less memory, allowing engineers to simulate larger, memory intensive cases. The parallelized FEM solver uses the MPI standard (Linux and Windows OS) and is based on full domain decomposition, enabling considerable savings of engineering and simulation time

Ease-Of-Use

The wizard offers a fully automated chain, requiring minimal user inputs and operations.

For direct tonal noise radiation analysis, the NLH solution is directly propagated to the far-field through the Boudary Element Method (BEM – Green’s function) for the computation of sound power and noise levels at microphones. The generation of the BEM radiation surface is supported by a new interactive tool that helps identify optimal surface position and mesh resolution.

Robustness

Users can now really exploit the full computational power of their computers, thanks to improved Flow-Noise memory management. Optimized dynamic distribution of the computational load across cores takes into account the available free memory on the computing machine. This means reduced temporary disk space through the reduction of the flow-noise source size stored on disk and the reduction of temporary files.

Further improved robustness was obtained thanks to work-flow simplification, the enhancement of the internal diagnostic checks and a massive validation test campaigns performed on academic and industrial configurations.

 

728Wizard work-flow and interface

 

Muffler Wizard with Computation of Insertion Loss (IL) 

The wizard for the computation of the Transmission Loss (TL), already available in FINE™/Acoustics version 8, has been extended with prediction of the Insertion Loss (IL).

One of the main advantages of this is that it enables analysis of an extended frequency range. TL analysis is limited to relatively low frequencies, compatible with planar acoustic waves propagating in the inlet and outlet ducts. This limitation does not affect the IL analysis.

The wizard now also offers the capability to model sound propagation through infinitely long ducts and open ducts (at the outlet termination) and the microphones can be located in the far-field, externally to the muffler duct.

The wizard is more robust and features an enhanced look-&-feel, thanks to added guidelines and improved widget graphics. Added info/warning/error messages and log files improve interaction.

 

image8Example of wizard generated output of acoustic pressure analysis of a muffler

 

About NUMECA International

NUMECA International is a leading developer and provider of Grid Generation, Multi-physics – CFD software systems for analysis, design, and optimization of industrial products and processes, with an emphasis in the domains of turbomachinery, marine, aeronautics, aerospace, energy, chemical processes and multi-physics. NUMECA offers an extended suite of software systems covering a broad range of applications for both internal and external flows, including fluid-structure, fluid thermal, aero-acoustic interactions.

Driven by creativity, innovation & quality, we proudly turn our passion into innovative software toolsets that support the world’s leading industries. For more information, visit www.numeca.com.

Microdesk Expands BIMrx Portfolio for Design, Construction

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NEW YORK, NY, USA, Jul 1, 2020 – Global BIM and EAM consulting firm Microdesk, a leading provider of business and technology services for the design and construction industry, has expanded its comprehensive BIMrx portfolio with the release of BIMrx Fabrication and BIMrx MEP as well as updates to BIMrx Core. Each of these custom-tailored solutions allow Architects, Engineers and Contractors to streamline workflows and maximize efficiency within Autodesk Revit.

 

 

BIMrx Fabrication was built by construction professionals to ensure the accuracy and effectiveness of everyday fabrication workflows. Regular tasks like tagging, spooling and hangers are automated, and designers have access to database properties of these parts for simplified reporting and estimating through Microsoft Excel. BIMrx Fabrication brings true automated fabrication capabilities to Autodesk Revit.

BIMrx MEP adds important tools to Revit for system management by providing engineers and designers the ability to edit objects in a single interface. Users will be able to utilize BIMrx MEP to undergo clash detection within 3D models that display accurate spatial layouts and engineering data. Designers can also manage segments and parameters within families through formulas in Microsoft Excel.

Additionally, Microdesk released the latest version of BIMrx Cloud Manager, formerly Bulk Loader, an application that allows AECO firms to easily and quickly add and manage projects, users and data in Autodesk BIM 360. BIMrx Cloud Manager is essential for full network synchronization between local storage and BIM 360. The application also includes bulk upload, project creation and browsing capabilities, as well as the ability to export enterprise and project data to excel for advanced reporting and analysis. BIMrx Cloud Manager is the ideal tool for firms managing projects in BIM 360.

“We want to alleviate common pain points designers in our industry deal with every day, and we believe the tools built into BIMrx Fabrication, MEP and Cloud Manager are a significant step in this process,” said Michael DeLacey, President and CEO of Microdesk.  “Our goal is to help our clients spend less time on administrative tasks and more time innovating for creative and sustainable projects.”

Special introductory pricing will be available for a limited time.

For more information on the complete BIMrx product line, please visit the https://www.microdesk.com  or call (800) 336-3375.

ZWSOFT Launches ZWCAD 2021 Beta

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GUANGZHOU, China, Jul 1, 2020 – ZWSOFT today launched ZWCAD 2021 Beta, which smooths the way to faster display, finer visuals, and better user experience. If you wish for a speedy and pleasurable design process, this version will lighten your workload and mood.

Better Visuals Generated More Quickly

As the R&D leader of ZWCAD, Charles Zhao explained in the all-in-one CAx Interview, the second step to accelerate the drawing opening process, namely, data visualization was to be taken with the aid of multi-core CPUs and GPUs as well as parallel processing. Now, the promise has been fulfilled. In ZWCAD 2021 Beta, the reading of drawings becomes approximately 30% faster (compared with ZWCAD 2020) with a smoother display of objects.

Adjustable Transparency for Clearer Drawings

You can now specify the transparency of objects, hatches, references, layers, etc. to distinguish them. For higher efficiency, the transparency of objects in a layer can be set all at once.

 

Adjustable Transparency for Clearer Drawings

 

More Precise Design at 4K Resolutions

If you own a 4K monitor, you can rest assured that ZWCAD 2021 Beta will bring a pleasing visual experience. You can, therefore, design more accurately without sore eyes.

More Precise Design at 4K Resolutions

 

Manage All Xrefs in One Manager

External files in the format of DWG, DWF, PDF, PNG, etc. are frequently used as references in CAD. In this version, all the Xref managers are merged into one so that you can conveniently check and manage them without switching between panels.

 

Manage All Xrefs in One Manager

 

A Unique Layer for Each Viewport

Viewport layers allow you to vary the layer properties (layer color, line type, line weight, plot style, etc.) in each viewport without affecting those of the drawing. Hence, you can easily mark or highlight some specific parts to suit your needs.

 

A Unique Layer for Each Viewport

 

Formulas Enable Faster Calculations

Now that table and field formulas are available, you can utilize formulas, such as Sum, Average, and Count in ZWCAD 2021 Beta like you do in Excel®. As a result, calculating in the table and more specifically, creating bills of materials becomes effortless.

 

Table and Field Formulas Enable Faster Calculations

 

New features that improve user experience are far more than the ones mentioned above. For example, application developers can also have a better porting experience thanks to the upgrade of Visual Studio to 2017 version and APIs for Tool Palettes and Ribbon. Experiencing is believing, we warmly welcome you to give ZWCAD 2021 Beta a try.

About ZWSOFT

ZWSOFT CO., LTD. (Guangzhou) is a reliable and innovative engineering software provider with its flagship products ZWCAD and ZW3D. Committed to providing complete and seamless user experience to worldwide users with its all-in-one CAx solutions, ZWSOFT has continuously satisfied diverse needs of various industries such as AEC and MFG. With over 20 years’ experience in the industry, its products and service have been proven by over 900,000 clients across 90 countries. For more information, visit https://www.zwsoft.com.

Takenaka, Lockheed Martin to Present at ESTECO Users’ Meeting 2020

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TRIESTE, Italy, Jun 30, 2020 – ESTECO pleased to announce that, with the new hybrid edition of ESTECO Users’ Meeting 2020 approaching, the agenda is taking shape with the first keynote speakers from two major international companies.

 

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Toru Inaba from Takenaka Corporation and Juan Montoro from Lockheed Martin Aeronautics will share their experience with the application of VOLTA for SPDM in the architectural and aerospace fields. Register now and don’t miss these engaging presentations from prominent professionals.

Toru Inaba, Head Office at Computational Design Group at Takenaka, specialized in steel-structures and has developed several design programs in this field. He will join ESTECO Users’ Meeting 2020 with a speech titled “Application of a collaborative web tool for structural design projects in the architectural field” and will present on how at Takenaka they could benefit from VOLTA technology to seamlessly share the analysis results and complex simulation projects with other teams.

Juan Montoro is Conceptual Design Engineering Manager at Lockheed Martin and has a 20-year experience in commercial and military aircraft, rotorcraft and UAV design and development. At the ESTECO Users’ Meeting 2020 he will present “The EXPEDITE program and the benefits of VOLTA as a server based MDO framework” on the shift of moving MDO from a desktop to a server based approach. Here he will explain how they used VOLTA to foster Multidisciplinary Design Optimization and develop an optimization workflow of a close air support vehicle.

Register now to listen to Takenaka and Lockheed Martin’s success stories featuring ESTECO technology. Join us virtually or on-site on 30 September and 1 October 2020.

Pointwise V18.3 R2 Released for CFD, Features 5X Faster Surface Meshing

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FORT WORTH, TX, USA, Jun 30, 2020 – The latest release of Pointwise’s computational fluid dynamics (CFD) mesh generation software accelerates its surface meshing process by up to a factor of five on benchmark grids.

 

Pointwise-V183R2The surface meshes (gray) on NASA’s Common Research Model were generated using the new, faster surface meshing. The cut through the hex-core volume mesh shows multiple levels of mesh refinement (colors indicate cell volume). The cyan mesh illustrates how the hex-core mesh topology is imprinted onto the symmetry plane.

 

“’Accelerate’ is one of our three main development thrusts,” said John Chawner, Pointwise’s president. “Anything we can do to speed-up the software improves the user’s experience and shrinks the time required to generate a CFD mesh.” The speed-up targets multi-core desktop systems. Meshing B-Rep NURBS geometry models now uses multi-threading.

Pointwise V18.3 R2 also extends hex-core meshing, introduced in the software’s previous release, to imprint the hex-core cell topology onto symmetry planes. In addition, high-order mesh curving now supports periodicity making high-order meshes much more suitable for turbomachinery applications.

Customers can immediately download Pointwise V18.3 R2 from pointwise.com/downloads.

About Pointwise, Inc.

Pointwise, Inc. is solving the top problem facing computational fluid dynamics (CFD) today – reliably generating high-fidelity meshes. The company’s Pointwise software generates structured, unstructured, overset and hybrid meshes; interfaces with CFD solvers such as ANSYS FLUENT and CFX, STAR-CCM+, OpenFOAM, and SU2 as well as many neutral formats, such as CGNS; runs on Windows, Linux, and Mac, and has a scripting language, Glyph, that can automate CFD meshing. Manufacturing firms and research organizations worldwide have relied on Pointwise as their complete CFD preprocessing solution since 1994. For more information, visit www.pointwise.com.

EOS Expands PREMIUM, CORE Metal Materials Portfolio for Additive Manufacturing

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KRAILLING, Germany, Jun 30, 2020 – EOS, the world’s leading technology supplier in the field of industrial 3D printing of metals and polymers, expands its range of PREMIUM and CORE metal materials portfolio for additive manufacturing (AM). The company introduces one new PREMIUM and seven new CORE products for the EOS M 290, EOS M 300-4 and EOS M 400-4 systems.

“With more companies crossing the border from prototyping to serial production based on AM, the demand for reliable data for materials and built parts is growing. For this, EOS introduced Technology Readiness Levels (TRLs) in 2019 for materials and processes to classify technological maturity levels for easy customer orientation.” Hanna Pirkkalainen, Product Manager Metal Materials, EOS

She goes on to say: “Depending on specific application requirements, customers can choose between CORE materials (TRL 3 and 5) with a major focus on  early market access to new materials, and PREMIUM materials (TRL 7-9) which attach particular importance to repeatable part quality essential in serial production.”

New PREMIUM MaterialEOS ToolSteel 1.2709 for EOS M 290 Systems

Validated for EOS M 290 systems, EOS ToolSteel 1.2709 is a TRL 7, ultra-high strength and hardness maraging steel for demanding molding applications. This tool steel has an excellent fatigue strength and improved polishability. Properties are adjustable with different heat treatments after 3D printing. This new material is validated for the EOS M 290 system. Typical applications range from plastic injection molding, to extrusion tools, hot pressing tools to die casting tools for aluminum and zinc alloys.

 

Pipemold, material EOS ToolSteel 1.2709 for EOS M 290 systems
Pipemold, material EOS ToolSteel 1.2709 for EOS M 290 systems

 

New CORE Processes

The three new CORE products for AlSi10Mg, Ti64 Grade 5 and 23 with up to 50 percent faster build rates increase the productivity of the EOS M 290 considerably. This leads to costs-per-part that are even more competitive and opens up new applications with profitable business cases. With EOS NickelAlloy IN718 and EOS MaragingSteel MS1, two new CORE materials are also now available for the EOS M 300-4. The materials portfolio of the EOS M 400-4 has also been extended to include two new and faster CORE processes for EOS Titanium Ti64 Grade 5 and EOS Titanium Ti64 Grade 23.

 

Isar Aerospace Technologies, exhaust outlet, material EOS Titanium Ti64 Grade 5 and Grade 23 for both the EOS M 290 and EOS M 400-4 systems
Isar Aerospace Technologies, exhaust outlet, material EOS Titanium Ti64 Grade 5 and Grade 23 for both the EOS M 290 and EOS M 400-4 systems

 

EOS Aluminum AlSi10Mgfor EOS M 290 Systems

Developed for the EOS M 290 system, the new 60µm process is classified as CORE material with TRL 3. The material offers high productivity, improved buildability and enables heat treatment to improve ductility. Typical applications are in all industries and the process is specifically targeted for applications where cost-efficiency is the main requirement.

 

Heat exchanger concept with bionic structures, material EOS Aluminum AlSi10Mg for EOS M 290 systems
Heat exchanger concept with bionic structures, material EOS Aluminum AlSi10Mg for EOS M 290 systems

 

EOS Titanium Ti64 Grade 5 and Grade 23

The new 80µm processes for both titanium alloys and for both the EOS M 290 and EOS M 400-4 systems enable higher build rates, resulting in lower cost-per-part. Both Ti6AI4V alloys offer excellent mechanical properties: high density with high strength and excellent corrosion resistance. The new 80µm processes are optimized for faster production of parts with properties similar to wrought Ti64. Typical applications range from aerospace and automotive components to other industrial applications where a combination of low weight with high strength is required.

 

Liebherr bracket, EOS NickelAlloy IN718 for EOS M 300-4 systems
Liebherr bracket, EOS NickelAlloy IN718 for EOS M 300-4 systems

 

EOS NickelAlloy IN718 and EOS MaragingSteel MS1 for EOS M 300-4 Systems

Developed for the EOS M 300-4 system, the 40 µm process comes with a TRL 3 classification. EOS NickelAlloy IN718 is a precipitation-hardening nickel-chromium alloy which is characterized by having good tensile, fatigue, creep and rupture strength at temperatures up to 700 ºC (1,290 ºF). Typical applications range from gas turbine components to instrumentation, power industry and process industry parts.

 

Tool insert, EOS MaragingSteel MS1 for EOS M 300-4 systems
Tool insert, EOS MaragingSteel MS1 for EOS M 300-4 systems

 

The 50 µm process based on EOS MaragingSteel MS1 is as well designed for use on the EOS M 300-4 system. The material also comes with a TRL 3 classification. Parts built with this material are characterized by having very good mechanical properties. The parts can be easily post-hardened to more than 50 HRC to obtain excellent hardness and strength. Typical applications range from injection molding tools and inserts to mechanical engineering parts.

EOS Technology Readiness Levels (TRLs)

EOS introduced Technology Readiness Levels (TRLs) in 2019 for materials and processes to classify technological maturity levels for easy customer orientation, easier choice of materials for specific applications, and more predictable results in development and production. With extensive data per material and validated parameters for part properties, EOS is both facilitating and accelerating the transition to AM-based series production.

EOS introduced two categories to classify the materials for usage in serial applications:   TRL 3–6 refer to Core materials, whereas TRL 7–9 refer to Premium materials. For example, level 3 refers to concept proof, level 5 refers to design freeze and a verification of the technical solution, while level 7 refers to production capability with extensive statistical data documentation.

About EOS

EOS is the world’s leading technology supplier in the field of industrial 3D printing of metals and polymers. Formed in 1989, the independent company is pioneer and innovator for comprehensive solutions in additive manufacturing. Its product portfolio of EOS systems, materials, and process parameters gives customers crucial competitive advantages in terms of product quality and the long-term economic sustainability of their manufacturing processes. Furthermore, customers benefit from deep technical expertise in global service, applications engineering and consultancy. For more information, visit https://www.eos.info.

matterlab Releases ArchiveHub, an Archiving Solution for AEC Professionals Using BIM 360

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LONDON, UK, Jun 30, 2020 – AEC product and innovation lab matterlab is announcing the launch of ArchiveHuba new companion product to Autodesk BIM 360, a construction management tool part of Autodesk Construction Cloud. ArchiveHub lets users download and quickly access a complete, offline copy of their entire BIM 360 project.

 

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With ArchiveHub, users can download complete projects from their BIM 360 account while keeping all metadata and file structures intact, minimizing the risk of archiving projects with human errors or incomplete data.

The application comes with a desktop tool called ArchiveHub Viewer, which offers an interface similar to BIM 360 and allows users to browse their archive easily at any time.

Before, archiving projects in the AEC industry was a long, complicated process that involved consolidating and downloading large volumes of data across a supply chain.

This could be especially difficult if a project involves multiple handover points between teams. Losing data causes delays in project timelines and extra expense to project owners, as the team has to go back and dig for missing project information.

With BIM 360 linked, matterlab’s ArchiveHub helps users prevent data loss with a downloaded copy of project information including version histories, issues, attachments, RFIsand users. It also preserves information hierarchies and relationships between items by saving permissions data.

By creating a local copy of BIM 360 project information, users can easily deliver a complete data handover to a client or a new project owner. It also means users can keep a full project copy for their own reference or audits in the future.

ArchiveHub is built on Microsoft Azure’s cloud technology and leverages Autodesk Forge services, enabling users to download their data quickly and reliably, and browse their archives seconds after beginning their download.

ArchiveHub works with BIM 360 users’ standard Autodesk login and is available on the Autodesk App Store or from matterlab’s website.

About matterlab ‍

matterlab is a product and innovation lab for the built environment that specialises in generative design and automation. matterlab was founded in 2019 and are based in London, UK. For more information, visit https://www.matterlab.co.

AMD Expands 3rd Gen Ryzen Desktop Processor Portfolio, Adds 3 New 3900XT Processors

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SANTA CLARA, CA, USA, Jun 29, 2020 – AMD (NASDAQ: AMD) announced three new additions to the 3rd Gen AMD Ryzen desktop processor family – the AMD Ryzen 9 3900XT, AMD Ryzen 7 3800XT and AMD Ryzen 5 3600XT processors. Introducing XT branding for the first time to the Ryzen family of processors, the new AMD Ryzen 3000XT desktop processors are purpose-built to maximize performance under any workload. Expanding on the award-winning 3rd Gen AMD Ryzen processor family, 3000XT series desktop processors are optimized with higher boost frequencies to deliver elite-level performance that dominates gaming and content creation.

 

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Today also marks worldwide availability of the AMD B550 chipset, the first mainstream chipset with support for PCIe 4.0. Available in a variety of motherboard form factors, the AMD B550 chipset is perfect for high-speed performance in both gaming and multitasking. Additionally, AMD announced the A520 chipset for socket AM4 and 3rd Gen AMD Ryzen desktop processors with more than 40 designs in development. Alongside these new chipset and processors, AMD also announced the redesigned StoreMI storage acceleration software with a new UI and enhanced acceleration algorithm.

“At AMD, we are committed to listening closely to our customers and the enthusiast community to deliver leadership products,” said Saeid Moshkelani, senior vice president and general manager, client business unit. “With AMD Ryzen 3000XT processors, we’re making additional optimizations to the 7nm manufacturing process to deliver industry leading single-thread performance and more choice and flexibility for enthusiasts.”

AMD Ryzen 3000XT Series Processors

Building upon the legacy established by the 3rd Gen AMD Ryzen processor family, the 3000XT Series processors elevate the world-class “Zen 2” architecture with an optimized 7nm manufacturing process technology to offer higher boost frequency and increased performance at the same TDPs of their Ryzen 3000 counterparts.

The AMD Ryzen 9 3900XT offers:

  1. Up to 4% increase in single-threaded performance over AMD Ryzen 3000 desktop processors
  2. Up to 40% more power efficiency than the competition

 

MODEL CORES/THREADS BOOST5/ BASE6 FREQUENCY (GHZ) TOTAL CACHE (MB) TDP7 (WATTS) Platform SEP8 (USD) EXPECTED AVAILABILITY
AMD Ryzen™ 9 3900XT 12/24 Up to 4.7/3.8 70 105 AM4 $499 July 7, 2020
AMD Ryzen™ 7 3800XT 8/16 Up to 4.7/3.9 36 105 AM4 $399 July 7, 2020
AMD Ryzen™ 5 3600XT 6/12 Up to 4.5/3.8 35 95 AM4 $249 July 7, 2020

 

Thermal Solutions

AMD Ryzen 5 3600XT retail box processors include a Wraith Spire cooler. The AMD Ryzen 9 3900XT, AMD Ryzen 7 3800XT and Ryzen 5 3600XT processors feature tailored specifications engineered for enthusiasts who regularly choose aftermarket cooling for the highest possible performance. As a result, AMD is recommending the use of an AIO solution with a minimum 280mm radiator or equivalent air cooling to experience these products at their best. A list of AMD recommended coolers can be found on AMD.com to ensure enthusiasts can maximize the potential from the entire 3000XT series of desktop processors.

Expanded AM4 Platform Offerings

The new A520 chipset for socket AM4 is the latest addition to the AMD 500 Series chipset family providing a streamlined, trusted platform to satisfy everyday PC users. These AMD 500 Series motherboards including the new A520 provide essential performance for 3rd Gen AMD Ryzen processors and beyond. The AMD Ryzen 3000XT Series processors also come with unbeatable platform support, compatible with all motherboards equipped with a Ryzen 3000-ready BIOS, including day one support on the entire 500 series chipset families.

AMD StoreMI

AMD StoreMI technology has been reimagined for 2020 and beyond with an all-new interface and new features. Highlights of the 2.0 version include a new caching-based acceleration algorithm that enhances data integrity and prioritizes most-used data, speeding up boot times by up to 31%9 and decreasing game load times by up to 13% vs an HDD only10. With its intelligent design and streamlined interface, AMD StoreMI is ideal for achieving SSD level speed with HDD level capacity.

Availability

AMD Ryzen 5 3600XT, AMD Ryzen 7 3800XT and AMD Ryzen 9 3900XT processors are expected to be available from top retailers and etailers worldwide starting July 7, 2020. AMD A520 motherboards are expected to be available at leading retailers and etailers starting in August 2020 from board partners including ASRock, ASUS, Biostar, Colorful, GIGABYTE, and MSI.

About AMD

For 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) websiteblogFacebook and Twitter pages.