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Tag results for: 3D IC Design

Siemens Introduces Calibre 3DThermal for 3D-IC Design

PLANO, TX, USA, Jun 26, 2024 - Siemens Digital Industries Software introduced Calibre 3DThermal, innovative software for thermal analysis, verification and debugging in 3D...

Siemens Unveils Innovator3D IC for 3D IC Design, Verification, Manufacturing

PLANO, TX, USA, Jun 25, 2024 - Siemens Digital Industries Software announced Innovator3D IC, new software that delivers a fast, predictable path for the...

Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design

SAN JOSE, CA, USA, Oct 20, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE),...

Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow

PLANO, TX, USA, Sep 26, 2022 - Siemens Digital Industries Software announced that, it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to...

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