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Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design

SAN JOSE, CA, USA, Oct 20, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE),...

Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow

PLANO, TX, USA, Sep 26, 2022 - Siemens Digital Industries Software announced that, it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to...

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