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Ansys 2024 R2 Introduces TwinAI, HFSS-IC Solver

PITTSBURGH, PA, USA, Jul 24, 2024 – Ansys (NASDAQ: ANSS) 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of...

Altair Signs MoU with University of Nottingham to Develop Aerospace Digital Twin Project

TROY, MI, USA, Jul 24, 2024 — Altair (Nasdaq: ALTR), a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the UK-based University...

Siemens Unveils Innovator3D IC for 3D IC Design, Verification, Manufacturing

PLANO, TX, USA, Jun 25, 2024 - Siemens Digital Industries Software announced Innovator3D IC, new software that delivers a fast, predictable path for the...

Siemens, KU Leuven Launch Digital Twin for Smart, Sustainable Products Chair 

PLANO, TX, USA, Jun 13, 2024 - Siemens Digital Industries Software, in collaboration with KU Leuven, has launched the Digital Twin for Smart and...

Nemetschek Establishes Global Network of Official dTwin Partners

MUNICH, Germany, May 21, 2024 – The Nemetschek Group, a leading software provider for the AEC/O and media industries, today announced the next steps in...

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