Thursday, May 9, 2024
HomeTagsIC Packaging

Tag results for: IC Packaging

Siemens, Intel Foundry Join to Develop Certified, Production-Ready EMIB Technology Reference Flow

PLANO, TX, USA, Feb 24, 2024 - Siemens Digital Industries Software announced that it has collaborated with Intel Foundry to develop a comprehensive workflow...

Cadence, Dassault Unveil First Cloud-Enabled Integration to Accelerate Mechatronics Systems Development

SAN JOSE, CA, USA, Feb 13, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) and Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) announced at 3DEXPERIENCE...

Siemens Brings Secure Thermal Digital Twin Technology to Electronics Supply Chain

PLANO, TX, USA, Jan 24, 2024 - Siemens Digital Industries Software announced that it is bringing an innovative approach for sharing accurate thermal models...

Cadence Acquires Invecas to Advance System Design Engineering

SAN JOSE, CA, USA, Jan 9, 2024 - Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that it has acquired Invecas, Inc., a leading provider...

Zuken Releases CR-8000 2023 for Advanced PCB Design

MUNICH, Germany and WESTFORD, MA, USA, Sep 5, 2023 - Zuken, a global leader in electronic design automation solutions, announces the availability of CR-8000 2023....

Don't miss