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Ansys Semiconductor Simulation Solutions Certified for UMC’s 3D Chip Technology

PITTSBURGH, PA, USA, Oct 19, 2023 – Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology,...

Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow

PLANO, TX, USA, Sep 26, 2022 - Siemens Digital Industries Software announced that, it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to...

Siemens, UMC Join to Develop Process Design Kits for Automotive and Power Applications

PLANO, TX, USA, Jan 21, 2022 - Siemens Digital Industries Software announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design...

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