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ZCON India 2025: A Celebration of Innovation, Partnership, and Progress

Sachin R Nalawade
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ZCON India 2025: A Celebration of Innovation, Partnership, and Progress

Event Review by DailyCADCAM

The picturesque city of Colombo, Sri Lanka, played host to ZCON India 2025, held from May 14 to 18, 2025, at the Courtyard Colombo. Organized by ZWSOFT in collaboration with Hope Technologies, this flagship partner event was a celebration of collaboration, innovation, and shared success. The event served as a unique platform for ZWSOFT’s Indian partners to engage in meaningful discussions, align on future strategies, and recognize collective accomplishments, all while enjoying an immersive cultural and professional experience.

The event commenced on May 15 with a warm welcome from Seven Xie, Overseas Marketing Manager at ZWSOFT, who outlined the agenda and set the tone for an inspiring and productive gathering. The opening was marked by a traditional lamp lighting ceremony, symbolizing the beginning of a new chapter of innovation and partnership. Following this, Vicky Su, Head of Asia Business at ZWSOFT, delivered a compelling keynote on “Marketing & Partner Enablement: Drives a Win-Win Business.” Her address highlighted the impressive growth of ZWSOFT’s international business, which has doubled over the past three years. She also shared the exciting news of over 45 new features introduced in ZWCAD 2026, as well as the expanded availability of ZW3D in Lite and Standard versions to better suit diverse customer needs. Vicky proudly noted ZWCAD’s inclusion in G2’s list of the top 50 software products of 2024 and discussed ongoing efforts to localize brand awareness globally. She emphasized that ZWCAD and ZW3D have evolved from being mere alternatives to becoming complete industry solutions, reflecting a shift from software sales to customer success, supported by a strong ecosystem model.

Jacob Panamthanath, CEO of Hope Technologies and the driving force behind ZWCAD’s growth in India, took the stage next to present a detailed review and forward-looking strategy for 2025. He shared that Hope Technologies achieved a remarkable 30% year-on-year revenue growth, a clear indication of strong market traction and partner success. Jacob discussed the company’s strategic priorities for FY25–26, which include expanding into Tier II and III cities across India, offering targeted training for ZWCAD and ZW3D, and enhancing partner capabilities through a newly developed CRM system aimed at improving sales visibility and planning. He also provided a comprehensive overview of the marketing initiatives undertaken in FY24–25, including exhibitions, webinars, and promotional campaigns, and previewed exciting plans for the year ahead. Jacob praised the dedication of Hope Technologies’ support team, which plays a crucial role in resolving post-sales challenges and ensuring customer satisfaction. He concluded by outlining the risks faced by the ecosystem, including competitive pricing, and discussed mitigation strategies.

Bryan Huang, India Channel Manager at ZWSOFT, presented the ZWSOFT Product Development Roadmap, with a strong focus on digital transformation in the AEC and manufacturing sectors. He spoke about ZWCAD’s operational efficiency and its capabilities in 3D modeling, artificial intelligence, and smart design tools. Bryan highlighted how ZWCAD MFG is being adopted in industries such as machine tools, automotive, and equipment manufacturing, while ZWCAD Architectural is supporting architectural design and construction. ZWCAD GIS and ZWCAD Cloud are also gaining popularity. His presentation included glimpses into the 2026 versions of ZWCAD and ZW3D, both of which promise enhanced capabilities. ZW3D, with its integrated CAx solution encompassing CAD, CAM, simulation, inspection, and PLM (Teammate), is steadily positioning itself as an industry favorite. Bryan reinforced ZWSOFT’s commitment to sustainable innovation and strategic partnerships with other technology providers to expand reach and deliver greater value.

Gurumurthy N, Technical Manager at Hope Technologies, gave a comprehensive demonstration of the new features in ZWCAD 2026, ZWCAD MFG 2026, and ZW3D 2026. Officially launched on May 8, 2025, ZWCAD 2026 focuses on user-centric innovation, incorporating AI tools and improving core functions to enhance design efficiency and user experience.

After lunch, Roy Zhang, India Country Manager at ZWSOFT, spoke about “Win Together: Sustainable Partner Enablement.” His session shed light on initiatives such as the marketing accelerator, sales and technical enablement programs, and online training and certification platforms. Roy highlighted ZWSOFT’s active participation in Indian expos and its investment in online courses tailored for specialized domains like piping, ECAD, and structural design.

One of the most anticipated presentations came from Adam Yao, Head of Global Marketing at ZWSOFT, who shared ZWSOFT’s India Marketing Strategy for 2025. Drawing on his 15+ years with the company, Adam reflected on ZWCAD’s journey since its inception in 2004 and its partnership with Hope Technologies since 2009. He proudly noted that India now represents ZWSOFT’s largest install base outside of China. Adam addressed brand awareness challenges and emphasized bridging these gaps through clear product positioning, refined conversion funnels, and a comprehensive CRM system. He provided partners with valuable marketing insights, explaining the full-funnel strategy of ToFu (top-of-funnel activities such as blogs and social media), MoFu (educational activities like webinars), and BoFu (conversion-oriented efforts such as demos and customer success stories). He also shared details on marketing investments and asset support for partners, including demo videos, landing pages, and email campaigns. His session served as a masterclass in product marketing and strategic planning.

Sam Li followed with a detailed presentation on why ZWCAD is more than just an AutoCAD alternative, highlighting its speed, lightweight, intuitive user interface, exceptional customer support, and flexible licensing. Mr. D. Balaji from Hope Technologies shared an inspiring customer success story, demonstrating how his team collaboratively secured a major account previously reliant on competing CAD solutions. This was followed by an insightful session from John Zhuang and Nagaraj Boregowda on strategies for competing with SolidWorks in the mechanical sector, complete with real-world examples.

The evening concluded with the much-awaited Dinner Gala & Partner Awards Ceremony. DailyCADCAM was honored with the Guest of Honour award, presented by Adam Yao. The night celebrated excellence and dedication across the ZWCAD partner ecosystem. Sales Star of the Year awards were presented to standout performers including Shubban Technologies, Invensys CAD Solutions, SOFTTECH Solutions, Concept Technology Solutions, Vaidesh IT Solutions, and individual achievers like Ninad Oak, Tanmay Lakhan, Srinivasa Reddy, Nagaraj Boregowda, and Aruna Gavigatti. Promising Partner of the Year honors went to CUBE CADTech, Rainbow Technologies, and BlueCAD Technologies. The Outstanding Performance 2024 awards were given to Tridex Engineering Software, UG Technologies, Vaidesh IT Solutions, and Sravani Infotech. The prestigious Partner of the Year 2024 awards were presented to V Global Business Solutions, Concept Technology Solutions, Satao CAMtech Solutions, SOFTTECH Solutions, and Blue Bell Engineering Solutions. The awards not only recognized exceptional performance but also highlighted the collaborative spirit and strategic execution across the partner network.

On May 16, the second day opened with a presentation by Sam Li on ZWSOFT Viewer Solutions, a cost-effective CAD viewer now trusted by clients like GM and BMW. Several long-term partners then shared their journeys and success stories, many having worked with ZWSOFT and Hope Technologies for over a decade. Ninad Oak provided an in-depth look at the upgraded Hope CRM 2.0, which aims to streamline partner sales processes. A dynamic Q&A session between partners and ZWSOFT leaders addressed topics ranging from future technologies to sales strategies. The afternoon was reserved for one-on-one meetings, offering valuable face time between partners and ZWSOFT’s leadership team.

Next day, partners were treated to a scenic and cultural tour of Kandy, Sri Lanka. Highlights included a visit to the Pinnawala Elephant Orphanage, the sacred Temple of the Tooth Relic (Sri Dalada Maligawa), a Gem Museum, and a vibrant Kandyan cultural dance performance. The tour was a relaxing and enriching experience, showcasing the natural beauty and heritage of Sri Lanka.

ZCON India 2025 was a resounding success. It brought together innovation, knowledge sharing, and relationship building in an inspiring setting. With clear strategies, strong support systems, and a passionate partner network, ZWSOFT and Hope Technologies are well-positioned to lead the Indian CAD market in 2025 and beyond. DailyCADCAM is proud to have been a part of this incredible journey and looks forward to the continued success of ZWCAD and its partners in India.

A big thank you to Kashif Ikbal, Marketing Manager, and the entire HOPE Technologies team for the outstanding event arrangements in Colombo. Everything was perfectly organized and made the experience truly memorable!

Try ZWCAD 2026

Thank you.

ANCA’s Spindle Speed Increaser Delivers 50,000 RPM on its FX, MX, TX Grinding Machines for Small Tool Applications

Nitin Patil
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ANCA’s Spindle Speed Increaser Delivers 50,000 RPM on its FX, MX, TX Grinding Machines for Small Tool Applications

WIXOM, MI, USA, May 26, 2025 – ANCA has developed a high-performance Spindle Speed Increaser kit designed to elevate the capabilities of its FX, MX, and TX grinding machine platforms. This innovative solution allows users to achieve wheel speeds of up to 50,000 RPM, making it ideally suited for small-diameter grinding wheels and specialized applications, such as PCD pocket grinding and internal diameter (ID) grinding.

Enhancing versatility with high-speed precision

The Spindle Speed Increaser kit is a simple yet powerful addition that significantly expands the potential of your existing ANCA machine. Designed to operate seamlessly within the machine’s grinding spindle, it enables users to access ultra-high spindle speeds without any special machine modifications.

Importantly, the Spindle Speed Increaser is fully compatible with ANCA’s automatic wheel pack changer, allowing it to sit alongside conventional grinding wheel packs for convenient, automated tool changes.

Ideally suited for grinding wheels under 10mm in diameter, the kit opens new opportunities in high-precision grinding applications. Originally developed for the TX platform, the Spindle Speed Increaser is now also offered for FX and MX machines, providing broader access to its capabilities across ANCA’s customer base.

“The regular ANCA grinding spindle runs up to 10,000 RPM – perfect for most standard tool grinding operations using wheels above 75mm in diameter,” explains Duncan Thompson, ANCA Product Manager. “However, customers have been asking for a solution to efficiently use smaller wheels. These wheels require significantly higher RPMs to achieve the surface speeds necessary for optimal grinding, and the Spindle Speed Increaser provides an elegant solution to this challenge.”

Technology behind the upgrade

At the heart of the Spindle Speed Increaser is a compact geared mechanism driven by the main spindle. This gearing increases output RPM by a factor of approximately seven, achieving speeds up to 50,000 RPM at the grinding wheel.

The kit is supplied with a comprehensive set of seven collets, supporting wheel shank sizes from 1mm to 7mm, providing users with flexibility to suit a range of tool geometries and grinding operations.

Precision in PCD pocket and ID grinding

One of the key use cases for the Spindle Speed Increaser is the grinding of PCD (polycrystalline diamond) pockets – a common operation in the production of tools used across the automotive, aerospace, and woodworking industries.

A typical manufacturing process begins with standard grinding operations such as fluting and relief, using conventional wheel packs. Then, using the Spindle Speed Increaser, small pencil grinding wheels can be deployed to accurately create PCD pockets at high RPM. This ensures optimal surface finish and accuracy in a single-machine setup.

“Using the Spindle Speed Increaser for pocket grinding eliminates the need for secondary setups,” says Duncan. “It saves time, reduces the risk of alignment errors, and increases overall manufacturing efficiency.”
Complementing the hardware, ANCA also offers dedicated PCD pocket grinding software. This easy-to-use package enables users to define complex pocket geometries quickly and precisely, further streamlining the tool production process.

A smart investment for greater return

Available as an optional accessory for both new and existing FX, MX, and TX machines, the Spindle Speed Increaser is an ideal upgrade for tool manufacturers looking to broaden their production capabilities and maximise the value of their machine investment.

“The Spindle Speed Increaser, combined with ANCA’s PCD pocket software, opens the door to new tooling opportunities without requiring additional capital equipment,” Duncan adds. “It’s another smart way to unlock more performance from your existing ANCA machine.”

To see the Spindle Speed Increaser at work, watch our YouTube video showcasing its functionality and application in real-world scenarios.

About ANCA

ANCA is a market leading manufacturer of CNC grinding machines. It was founded in 1974 in Melbourne, Australia where the company still has its global headquarters. ANCA CNC grinders are used for manufacturing precision cutting tools and components across a diverse range of competitive industries including cutting tool manufacturers, power generation, woodworking, automotive, aerospace, electronics and medical. For more information, visit www.anca.com.

Coreform Releases Flex, Cubit 2025.3 for CAE

Nitin Patil
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Coreform Releases Flex, Cubit 2025.3 for CAE

OREM, UT, USA, May 26, 2025 — Coreform, a leader in next-generation simulation technologies, is excited to announce that the Coreform Flex and Coreform Cubit 2025.3 are now available. Coreform Flex shows major robustness improvements and new public verification and reference manuals. Coreform Cubit includes bug fixes and small enhancements.

Coreform Flex trimming robustness updates in 2025.3

This release features significant robustness improvements to the Coreform Flex trimming algorithm. Tet meshing is the incumbent fully-automatic meshing solution for complex geometries, but is still dependent on CAD characteristics allowing for the building of a valid surface mesh. The reality is that modern CAD often includes bad surfaces that cause a tri-mesh to fail. Coreform’s next-gen IGA trimming process is robust over many of these issues.

Internal testing on a repository of over 2000 customer parts was benchmarked against the tet meshing capabilities in Coreform Cubit and Flex trimming was found to be more robust than the tet mesher.

Complete release notes are available here.

Other Coreform Flex updates

Neo-Hookean elasticity

Coreform has implemented a two-parameter, isotropic hyper-elastic neo-Hookean material that converges to the linear elastic model in the small deformation limit.

Mechanical contact 

One of the promises of next-generation IGA has been that higher-order smooth bases could be more robust for challenging contact problems than traditional linear bases. The reality is that implementation of contact with these bases is highly complex and demanding. In this release, Coreform has an initial implementation of mechanical contact that works for both body-fitted and immersed flex approaches. This is the initial capability, and increased robustness and performance are being worked on.

Mooney-Rivlin elasticity

We have implemented the three-parameter isotropic hyperelastic Mooney-Rivlin material model. This also includes an extension of this model for nearly incompressible solids is available via a pressure stabilization approach.  More information can be found in our reference manual.

Neo-Hookean isotropic plasticity

This material model combines the neo-Hookean elasticity material model with a nonlinear isotropic rate-independent plasticity model based on J2 flow theory. 

Improved boundary condition workflow

Coreform Flex weakly enforces Dirischlet boundary conditions such as displacements. This eliminates the interdependence of boundary conditions, CAD, and mesh, but does require some parameters to be selected. In this release we have implemented automatic physics-based parameter selection that further simplifies the workflow.

Nonlinear continuation solver

This release adds an implicit static timestepping method based on numerical continuation that breaks a difficult nonlinear problem into a sequence of simpler nonlinear problems. This improves the ability to converge to difficult nonlinear problems. 

Coreform Cubit 2025.3 updates

Coreform Cubit updates include bug fixes and minor enhancements. Full release notes are available here.

About Coreform LLC

Coreform develops next-generation computer-aided engineering software. Coreform’s founders are authorities in isogeometric analysis and are widely cited researchers. The Coreform IGA solver is based on smooth CAD spline geometry, offering greater accuracy than the faceted meshes used in legacy CAE software. Coreform is also the exclusive commercial distributor of the Cubit meshing software. Coreform was founded in 2014 and is headquartered in Utah, USA. For more information, visit https://coreform.com.

Spatial Announces Release 2025 1.0.1

Nitin Patil
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Spatial Announces Release 2025 1.0.1

BROOMFIELD, CO, USA, May 23, 2025 – Spatial Corp, the leading software development toolkit provider for design, manufacturing, and engineering solutions and Dassault Systèmes subsidiary, announces the production release of 2025 1.0.1.

The 2025 1.0.1 release delivers expanded functionality designed to streamline manufacturing and simulation workflows. Key highlights include a new custom feature detection API in ACIS for more efficient model simplification, expanded CAD format support—including STEP AP242 PMI writing—and continued enhancements to hidden-body removal. With this release, Spatial reduces manual tasks, increases fidelity in geometry translation, and strengthens its toolset for automated design-to-manufacture and design-to-simulation pipelines.

3D ACIS Modeler

  • Custom Feature Detection (Beta): Model simplification often requires manual and repetitive tasks by end-users. This capability allows end-users to define a custom feature and automatically detect other instances of it in the model.
  • Panel Ray Fire: Instead of firing individual rays, your application can use this new interface to define an array of rays in a structured rectangular pattern, which significantly boosts performance.
  • Skinning Enhancements: Optimized algorithms reduce twists and self-intersections to deliver cleaner, more accurate output surfaces.

3D InterOp

Creo Reader Improvements

  • Cosmetic Sketch Translation: Convert text from cosmetic sketches into wireframe bodies to support engraving workflows.
  • Table Patterns: Table patterns are a flexible way to specify the locations of features for machining processes such as drilling, milling, cutting, or punching of holes. This release now supports the extraction of table patterns.

Sketch Support for Inventor:

  • Import sketch data as wire bodies from Inventor 2023 and later.

STEP AP242 Support

  • Writing imported semantic PMI data to STEP AP242 is now supported. Authoring PMI data is expected to be available in time for the next release.

Wire support in glTF Writer

  • This functionality lets customers convert CAD files with PMI to glTF for web viewing applications.

Updated CAD Format Version Support:

  • IFC 4.3.2.0
  • NX 2412
  • Parasolid 37.0
  • Revit 2025
  • Solid Edge 2025

Data Prep

Hidden Body Removal

For parts, a new optional behavior allows hidden bodies to be identified and marked-up without being removed. Hidden body removal for assemblies is now available in a limited form for demonstration purposes. Customers may expect further improvements to hidden body removal soon as Data Prep continues to be a prime focus for Spatial.

CGM Modeler

Generate parallel curves on a body (Beta)

  • This release introduces a new operator to create parallel curves on a body’s surface, separated by a specified geodesic distance. This feature is especially beneficial in manufacturing workflows requiring precise spacing between adjacent toolpaths.

C# Interface

  • This update implements several memory management improvements.

CSM-CVM

CVM mesh quality improvements

  • Mesh regularity has been improved in adaptive workflows.

CDS

Support for soft constraints

  • Ability to convert between geometric constraint and soft constraint.

About Spatial Corp

Spatial Corp, a Dassault Systèmes subsidiary, is the leading provider of 3D software development toolkits for technical applications across a broad range of industries. Spatial 3D modeling, 3D visualization, and CAD translation software development toolkits help application developers deliver market-leading products, maintain focus on core competencies, and reduce time-to-market. For over 35 years, Spatial’s 3D software development toolkits have been adopted by many of the world’s most recognized software developers, manufacturers, research institutes, and universities. Headquartered in Broomfield, Colorado, Spatial has offices in the USA, France, Germany, Japan, China, and the United Kingdom. For more information on Spatial’s latest updates and product offerings, please visit www.spatial.com.

CIMdata to Host Webinar on Status of Global PLM Market on Jun 12, 11AM EDT

Nitin Patil
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CIMdata to Host Webinar on Status of Global PLM Market on Jun 12, 11AM EDT

ANN ARBOR, MI, USA, May 23, 2025 – CIMdata, Inc., the leading global PLM strategic management consulting and research firm, is excited to announce an upcoming free educational webinar, “2025 PLM Market Update.” The webinar will take place on Thursday, 12 June 2025, at 11:00 a.m. (EDT) and will run for one hour.

The PLM Economy, CIMdata’s term for the global ecosystem of software and services providers that assist industrial companies in achieving their PLM objectives, has grown strongly over the past decade. This webinar will focus on the results for the calendar year 2024 and offer insights into CIMdata’s forecast for 2025 through 2029.

This webinar will help attendees:

  • Distinguish CIMdata’s PLM definition from those offered by other market influencers.
  • Understand the differential growth experienced across the various segments of the PLM market.
  • Identify key players in the global PLM market landscape.
  • Find out what happened in the PLM market in 2024 from a mergers and acquisitions standpoint.
  • Understand how the Ukraine conflict and tariffs stand to impact the global PLM market.

According to Christine Longwell, CIMdata’s Director of Research and webinar host, “The PLM market, as estimated by CIMdata, grew by 9.7% in the calendar year 2024, above our forecast of 8.6%. The results were solid, with growth in all PLM segments. Some economic headwinds are expected to impact the market in 2025. However, the growth drivers for the PLM Economy, Industry 4.0, smart connected products, IoT, and digital transformation remain strong. Finally, PLM on the cloud continues solid adoption.”

Christine Longwell brings over 25 years of experience, including roles with various PLM solution providers and industrial organizations; for the past decade, she has been involved with market intelligence. As CIMdata’s Director of Research, Christine is responsible for enhancing and managing CIMdata’s process of assembling and presenting CIMdata’s highly esteemed yearly industry-leading Market Analysis Report (MAR) series.

Christine also spearheads the CIMdata team tasked with transforming the vast amount of market data CIMdata receives into actionable insights. This webinar promises to be a valuable resource for financial and market planners, competitive analysts, sales teams, industrial leaders, and anyone keen on understanding the performance and growth potential of the PLM market.

During the webinar, attendees will have the opportunity to ask questions about the topics discussed.

To find out more, visit: https://www.cimdata.com/en/education/educational-webinars/2025-plm-market-update.

To register for this webinar, please visit https://register.gotowebinar.com/register/5234759910149108319.

Artec 3D Digitizes Luxembourg’s Cultural Landmarks for World Expo 2025 in Osaka, Japan

Nitin Patil
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Artec 3D Digitizes Luxembourg’s Cultural Landmarks for World Expo 2025 in Osaka, Japan

Luxembourg, May 23, 2025 – Artec 3D, a pioneering developer and manufacturer of professional 3D scanners and software based in Luxembourg, is proudly showcasing the nation’s rich cultural heritage to the world at Expo 2025 Osaka.

Using its industry-leading 3D scanning and photogrammetry solutions, Artec 3D has created high-resolution digital twins of iconic sights from across Luxembourg. At World Expo, these ultra-realistic models are allowing thousands of Expo visitors to experience the country’s historic landmarks in stunning detail at the Luxembourg Pavilion and beyond.

Gelle Fra
The Gëlle Fra monument in 3D.

A wide array of Luxembourgish heritage sites were digitized for the expo, ranging from architectural gems and natural landscapes to an intricate statue perched above the cityscape. Capturing such cultural gems in brilliant detail demonstrates the technological capabilities and adaptability of Artec 3D’s comprehensive line-up of 3D scanners and advanced AI photogrammetry.

Scanned treasures include Gëlle Fra (Golden Lady), a gleaming statue and national symbol of freedom and remembrance, and Huelen Zant (Hollow Tooth), a weathered fragment of military architecture speaking to Luxembourg’s strategic past. Expo visitors can also see the majestic Castle of Vianden, a medieval fortress from the Éislek region, and some of the many vine rows at the Moselle Vineyards, one of the country’s most picturesque wine regions.

Artec Ray II
Artec Ray II scanning the remains of the Huelen Zant fortress.

Other digitized historic sites include the Grand Ducal Palace: the Grand Duke of Luxembourg’s official residence, which has been rendered with precision, showcasing its regal presence and historic significance. Adding a national folkloric touch to the expo, the statue of Melusina – a legendary mermaid associated with the founding of Luxembourg in 963 AD – has also been turned into a 3D model, in collaboration with local artist Serge Ecker.

To digitize these heritage sites, Artec 3D’s team utilized the full spectrum of its innovative technologies. AI Photogrammetry reconstructed impressive digital twins from drone imagery, Artec Ray II scanned expansive building exteriors with LiDAR, the wireless Artec Leo captured detailed 360-degree views of even the most challenging-to-access areas, and Artec Spider II picked up features with an unparalleled level of detail. This comprehensive approach delivered a set of high-fidelity digital representations that continue to immerse visitors at World Expo 2025.

Hollow Tooth
Digitized with Artec 3D technology, Luxembourgish landmarks can be explored in depth and minute detail.

“It’s an honor for us to bring heritage exploration and innovation together for audiences at and beyond World Expo 2025 with our full range of 3D scanning and photogrammetry solutions,” said Art Yukhin, President and CEO of Artec 3D. “Each of these objects, from the Grand Palace to the Golden Lady statue, presents unique challenges and stories. By capturing them in high fidelity, we are not only preserving Luxembourg’s rich past but also offering a new, interactive way for the world to engage with it.”

This digitization initiative for World Expo in Osaka underscores not only the diversity of Luxembourg’s cultural heritage but also the remarkable flexibility and precision of Artec 3D scanning and AI Photogrammetry in capturing both the monumental and the minute. The resulting 3D models are integrated into the pavilion’s AR experience, offering a global audience the chance to explore and appreciate Luxembourg’s heritage through exciting and immersive visualization.

About Artec 3D

Artec 3D is an international company, headquartered in Luxembourg, with offices in the United States (Santa Clara, California), China (Shanghai), Portugal (Lisbon), Montenegro (Bar), and Japan (Tokyo). Artec 3D develops and produces innovative 3D scanners and software. Artec has a team of professional experts in the capture and processing of 3D surfaces as well as biometric facial recognition. Artec 3D’s products and services can be used in many industries, such as engineering, medicine, media and design, entertainment, fashion, heritage preservation, security technology, and more. For more information, visit https://www.artec3d.com.

Autodesk Supports Pre-approved Home Designs, AI-powered Permitting to Accelerate Los Angeles Wildfire Recovery

Nitin Patil
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0
Autodesk Supports Pre-approved Home Designs, AI-powered Permitting to Accelerate Los Angeles Wildfire Recovery

SAN FRANCISCO, CA, USA, May 23, 2025 – Autodesk, Inc. (NASDAQ: ADSK) announced new funding, technology, and support to accelerate rebuilding efforts in wildfire-affected areas of Los Angeles, following this January’s devastating fires across the region.

TFCF’s initial concept designs, contributed by architects and designers from across Los Angeles and beyond. More concept designs are currently under development.
  1. Autodesk is partnering with The Foothill Catalog Foundation (TFCF), a nonprofit organization and network of volunteers creating a first-of-its-kind catalog of modular, pre-approved home designs for survivors of fires in the Los Angeles region. The plans provided through TFCF are expected to reduce architectural and permitting costs for survivors—which can often exceed tens of thousands of dollars—by up to 95%. The plans will also help cut permitting timelines—which can take up to a year—down to a matter of weeks.
  2. Autodesk is also funding an AI-powered software tool to supercharge the approval of building permits and speed recovery from the LA Fires, in partnership with Governor Gavin Newsom, LA Rises and other companies.

“Our technology powers the industries that are rebuilding Los Angeles — from planning, architecture, engineering, and manufacturing to construction,” said Andrew Anagnost, President and CEO, Autodesk. “This is about designing and building for resilience—not just to recover from disaster, but to efficiently scale solutions, inspire recovery models everywhere and futureproof our communities.”

A scalable blueprint for wildfire recovery

With Autodesk’s support, TFCF is enlisting hundreds of volunteer architects, engineers, and students to create home designs tailored to neighborhoods like Altadena. The plans will meet stringent climate resilience standards, including resistance to extreme heat, wildfire, and power outages, while preserving the region’s unique architectural character.

TFCF is also developing a standardized Revit template to ensure each design meets pre-approval and sustainability requirements from the outset. Architects contributing to the catalog will use tools including BIM Collaborate Pro, as well as tools from the Autodesk AEC Collection, such as Autodesk Forma, to streamline collaboration, provide AI-powered analyses and help deliver more resilient homes to families faster.

“This partnership is helping turn our vision into reality at a time when families can’t afford to wait,” said Alex Athenson, co-founder of The Foothill Catalog Foundation. “With Autodesk’s established role as a Design and Make leader and their invaluable resources, we’re making sustainable, regionally sensitive home designs more accessible—and creating a pathway for faster, more resilient recovery for communities that need it most.”

With a focus on design for long-term resilience and sustainability, Autodesk is deepening its commitment to helping communities recover. The company’s Design and Make platform is used by AEC industry teams worldwide to reduce waste and lower environmental impacts. These community-centered donations offer real-time solutions to urgent system challenges for those impacted by the fires.

About Autodesk

The world’s designers, engineers, builders, and creators trust Autodesk to help them design and make anything. From the buildings we live and work in, to the cars we drive and the bridges we drive over. From the products we use and rely on, to the movies and games that inspire us. Autodesk’s Design and Make Platform unlocks the power of data to accelerate insights and automate processes, empowering our customers with the technology to create the world around us and deliver better outcomes for their business and the planet. For more information, visit autodesk.com or follow @autodesk. #MakeAnything

TRUMPF Electronics Opens New Technical Center in Malaysia

Nitin Patil
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0
TRUMPF Electronics Opens New Technical Center in Malaysia

FREIBURG, Germany and Singapore, May 23, 2025 – TRUMPF Electronics, one of world’s leading plasma power suppliers for the semiconductor sector, marked its entry into the Southeast Asian market with a debut at SEMICON SEA 2025, alongside its new regional technical center in Malaysia.

The newly opened technology center is located in Kota Damansara, 17 kilometers from the Malaysian capital Kuala Lumpur. It is outfitted with cutting-edge infrastructure, purpose-built to streamline production processes and uphold the highest standards in manufacturing excellence. TRUMPF Electronics’ solutions are widely adopted across cutting-edge technologies and key sectors, including the semiconductor, solar, display, and industrial coating industries. The new technical center aims to provide dedicated maintenance and repair services for international equipment manufacturers, while onsite product fitting and professional training are available. The facility will also serve to develop high-tech skills for the Malaysian workforce, with TRUMPF Electronics making a long-term commitment to local talent for the next generation of semiconductor advancements.

TRUMPF Electronics offers sophisticated plasma solutions for the semiconductor ecosystem. With over a century of expertise, TRUMPF Electronics delivers advanced radio-frequency generators and matching systems that ensure precise, stable plasma needed for the high-tech manufacturing of components like microchips and solar panels. Plasma power supplies operate with an efficiency of up to 80% and use about half the energy of older generators. They are also highly reliable, enabling manufacturers to produce high-tech goods more sustainably, with reduced energy costs and minimal disruptions.

TRUMPF Electronics offers sophisticated plasma solutions for the semiconductor ecosystem, like the TruPlasma RF Series.

These systems stand out in both performance and reliability – they automatically adjust in real time to keep the plasma process running optimally, ensuring the output remains stable. These technologies are integral to semiconductor manufacturing processes like plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), etching, and ion implantation, delivering exceptional precision, quality, and productivity with wafer fabrication.

TRUMPF Electronics showcased the TruPlasma RF generator and TruPlasma Match series at the recent SEMICON SEA 2025 in Singapore, alongside other advanced technologies and solutions for the semiconductor ecosystem. Visitors explored the ways in which TRUMPF’s innovations are powering next-gen applications and helping to drive the industry forward in this dynamic region.

“Southeast Asia has emerged as a key hub for the semiconductor industry, driven by its rapidly expanding digital economy and the resulting demand for advanced chips. The new technical center in Malaysia represents a pivotal milestone in our commitment to bolster the region’s dynamic semiconductor industry. By investing in local infrastructure, we are dedicated to delivering innovative solutions that empower our customers and propel the region’s growth,” said Dariusz Czaja, Managing Director of TRUMPF Electronics Asia.

TRUMPF Electronics continues to expand its presence across Asia, with technical centers in Japan and Malaysia, the latter of which maintains service availability for requests from other countries in the region like Vietnam and Thailand.

About TRUMPF Electronics

Founded in 1922 and headquartered in Freiburg, Germany, TRUMPF Electronics is one of the global leader in plasma power supplies, industrial heating, battery inverter systems, microwave generators and microwave amplifiers. Its products are widely used in the
semiconductor, display, solar-energy and industrial-glass-coating industries. Since 1990, the company has been a member of the TRUMPF Group – one of the technology and market leaders in highly versatile machine tools for sheet metal processing and in the field
of industrial lasers. With over 100 years of expertise, TRUMPF Electronics specializes in developing and manufacturing plasma power supplies with a focus on deposition and dry etching in semiconductor manufacturing processes. The company operates sales and
service subsidiaries across Europe, America, and Asia.

About TRUMPF

TRUMPF is a high-tech company offering manufacturing solutions in the fields of machine tools and laser technology. It drives digital connectivity in manufacturing through consulting, platform products and software. TRUMPF is one of the technology and market leaders in highly versatile machine tools for sheet metal processing and in the field of industrial lasers.

In 2023/24, TRUMPF employed 19,018 people and generated sales of 5.2 billion euros. With about 90 companies, the TRUMPF Group is represented in nearly every European country as well as in North America, South America and Asia. The company has production facilities in Germany, France, the United Kingdom, Italy, Austria, Switzerland, Poland, the Czech Republic, the United States, Mexico and China.
Find out more about TRUMPF at www.trumpf.com.

Artec 3D to Accelerate Machine Learning R&D with LuxProvide MeluXina Supercomputer

Nitin Patil
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Artec 3D to Accelerate Machine Learning R&D with LuxProvide MeluXina Supercomputer

Luxembourg, May 22, 2025 – Global 3D scanning leader Artec 3D is delighted to announce an exciting new partnership with LuxProvide, the organization behind the MeluXina supercomputer.

Located in Luxembourg, MeluXina is capable of carrying out billions of calculations per second, making it one of Europe’s most powerful computer systems. Moving forward, the technology is set to become a critical asset in the development of next-generation 3D surface reconstruction algorithms – and turbocharge Artec 3D’s machine learning (ML) research.

With further R&D, advanced neural reconstruction is expected to improve surface accuracy, capturing intricate details with unprecedented clarity. AI-powered material detection will enable users to differentiate between surfaces more effectively, improving applications in quality control and reverse engineering. In terms of texture capture, machine learning is also set to enhance mapping, resulting in more lifelike 3D models with ultra-realistic colors.

Overall, it’s forecast that optimized AI algorithms will reduce scanning and post-processing times, enabling engineering professionals to work more efficiently and deliver faster results. Likewise, smarter automation and AI-driven insights will increasingly allow manufacturers to simplify workflows, while making high-end 3D scanning more accessible and intuitive.

“Collaborating with LuxProvide is allowing us to harness MeluXina’s immense computational power and take our R&D to the next level,” said Art Yukhin, CEO & President of Artec 3D. “This partnership allows us to explore innovative machine learning techniques that will shape the future of 3D scanning and data processing, enabling our products to deliver even more precision, speed, and versatility to our customers.”

The WP5 New Machine Learning Algorithms research project is being viewed as a significant step forward for Artec 3D as it continues to innovate in the fields of photogrammetry, machine learning, and AI. The results are set to enhance the company’s offering in various industries, including healthcare, automotive, manufacturing, and heritage preservation.

With the continued support of advanced platforms like MeluXina, Artec 3D is poised to remain at the forefront of 3D scanning technology, driving the evolution of digital and data-driven economies worldwide.

“We are proud to support Artec 3D’s pioneering work in AI-driven 3D technology,” added Filipe Pais, CCSO of LuxProvide. “By leveraging the expertise of LuxProvide, as well as the power of MeluXina Supercomputer, we are enabling Artec 3D to accelerate its research and development initiatives by giving them the resources they need to develop smarter 3D scanning solutions using AI and advanced data processing. This collaboration reflects our commitment to empowering tech leaders in Luxembourg and beyond.”

About LuxProvide

LuxProvide is at the forefront of digital intelligence, combining data science expertise with supercomputing capabilities. Centered around MeluXina, Luxembourg’s advanced supercomputer, LuxProvide focuses on accuracy, security, and sustainability in the digital realm. The company transcends traditional technological boundaries, fostering innovative solutions that elevate the human experience and drive positive change. LuxProvide is dedicated to pioneering a future where technology not only evolves but enhances every aspect of life.

About Artec 3D

Artec 3D is an international company, headquartered in Luxembourg, with offices in the United States (Santa Clara, California), China (Shanghai), Portugal (Lisbon), Montenegro (Bar), and Japan (Tokyo). Artec 3D develops and produces innovative 3D scanners and software. Artec has a team of professional experts in the capture and processing of 3D surfaces as well as biometric facial recognition. Artec 3D’s products and services can be used in many industries, such as engineering, medicine, media and design, entertainment, fashion, heritage preservation, security technology, and more. For more information, visit https://www.artec3d.com.

Bentley Systems’ Illuminate Mumbai Event Highlighted Ways to Accelerate India’s Self-Reliant, Digitally-Driven Infrastructure

Sachin R Nalawade
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Bentley Systems’ Illuminate Mumbai Event Highlighted Ways to Accelerate India’s Self-Reliant, Digitally-Driven Infrastructure

MUMBAI, India – May 16, 2025 – Bentley Systems, Incorporated, the infrastructure engineering software company, recently convened infrastructure leaders, innovators, and policy influencers in Mumbai for Illuminate Mumbai—a high-impact event focused on empowering India’s journey toward its India 2047 goals through the adoption of open, intelligent digital twins for infrastructure.

India aims to achieve developed-nation status by 2047, with infrastructure standing at the core of its transformation. The Illuminate Mumbai event enabled attendees to explore how digital twins, infrastructure AI, and open data ecosystems are turning India’s infrastructure vision into real-world outcomes—from smart highways and resilient water systems to efficient structural design and scalable workforce enablement.

According to Kaushik Chakraborty, senior vice president, Asia Pacific, Bentley Systems, “Illuminate Mumbai underscored a central message: While India and the world may face a shortage of engineers, it does not lack infrastructure data. The challenge—and opportunity—is to harness that data through digital intelligence to better address India’s current and future infrastructure requirements—to advance cities, transportation systems, water and utility networks, and more. Bentley’s solutions are uniquely positioned to close this gap, turning information into action to support India’s goals of Atmanirbhar Bharat (self-reliant India) and infrastructure-led economic development and growth.”

Strategically aligned with national initiatives like Gati Shakti, Smart Cities, and Jal Jeevan Mission, Bentley is committed to being a long-term digital partner in India’s infrastructure evolution. Illuminate Mumbai provided a forum for Bentley’s global and regional executives as well as users to share how the company’s open and interoperable digital twin platform and innovative software solutions, including Bentley Infrastructure Cloud, OpenSite+, OpenFlows Water, OpenUtilities SubStation, PLAXIS geotechnical software, and more, are enabling self-reliance by giving Indian engineers, contractors, and public agencies full control over their data, workflows, and insights.

Key event highlights include:

  • Kamalakannan Thiruvadi, regional executive, South Asia, Bentley, welcomed attendees with a strong message on India’s unique opportunity to lead in infrastructure innovation, noting digitally-driven technology, like AI and digital twins, are already being used across India to improve asset performance, increase resiliency, and reduce carbon impacts.
  • The executive keynote, led by Andy Rahden, vice president of Solution Engineering at Bentley, shared powerful insights on digital transformation in engineering, tackling workforce challenges, and scaling sustainability through open, interoperable technologies. The keynote featured a dynamic panel discussion with:
  • Pawan Rallabandi, Business Unit Head – Digital & Advanced Technologies, Tata Consulting Engineers
  • Sandeep Desai, CIO, AFCONS
  • Bimal Patwari, Co-Founder & CEO, Pinnacle Infotech

The forum also included remarks from Joe Yang, Principal Commercial Officer at the U.S. Consulate in Mumbai, highlighting the importance of international collaboration in driving digital innovation in infrastructure.

A spotlight session led by Dr. Anil Kashyap, Director General of NICMAR and President of NICMAR University, emphasized the critical role of academia in nurturing digital skills for the infrastructure workforce of tomorrow.

The program also contained dedicated technology sessions, providing real-world examples of digital twin applications; sector-specific innovation discussions across structural engineering, transportation/airport, electric energy, and water utilities. The event featured unique user case studies in transportation (Louis Berger International—A WSP Company); Water (Deccan Technical Consultants); Structural and Geotechnical (Sterling Engineering Consultancy, Afcons Infrastructure, and TCE), and Utilities (Elegrow Technology).

About Bentley Systems

Around the world, infrastructure professionals rely on software from Bentley Systems to help them design, build, and operate better and more resilient infrastructure for transportation, water, energy, cities, and more. Founded in 1984 by engineers for engineers, Bentley is the partner of choice for engineering firms and owner-operators worldwide, with software that spans engineering disciplines, industry sectors, and all phases of the infrastructure lifecycle. Through our digital twin solutions, we help infrastructure professionals unlock the value of their data to transform project delivery and asset performance.

© 2025 Bentley Systems, Incorporated. Bentley and the Bentley logo are either registered or unregistered trademarks or service marks of Bentley Systems, Incorporated or one of its direct or indirect wholly owned subsidiaries. All other brands and product names are trademarks of their respective owners.

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