PITTSBURGH, PA, USA, Jan 27, 2021 – Recently launched Ansys 2021 R1 products deliver improvements in simulation technology along with the immense compute power of high-performance computing to reimagine what is now possible for global engineering teams. Ansys‘ (NASDAQ: ANSS) industry-leading simulation solutions offer new levels of collaboration, providing insight into product safety, reliability and performance.

Companies of every size in every industry are challenging traditional ways of working in pursuit of breakthrough innovation. The simplified workflows and unique product enhancements in Ansys 2021 R1 create opportunities for engineers to accomplish design and product development goals that were previously thought unattainable. With Ansys 2021 R1, engineers no longer need to develop workarounds because of technology limitations and make workflow compromises that increase design cost and risk.

Ansys 2021 R1 provides advancements for large electromagnetic system simulations that previously were not possible while including vendor components in those simulations with greater efficiency and scalability. These components can be encrypted, so vendors can share proprietary 3D component designs and create high-fidelity simulations.

Ansys 2021 R1 pushes semiconductor engineering boundaries, delivering comprehensive analysis of signal integrity, power integrity, thermal and mechanical stress on 3D multi-die systems. While thermo-mechanical stresses and warpage can damage 3D-IC packages, leveraging proven Ansys flagship technology enables users to increase product lifespan and reliability.

Ansys 2021 R1 Expands Sensor Simulation Capabilities with Scanning and Rotating Lidar Models to Improve AV Simulation Reliability

The advances in Ansys 2021 R1 coupled with Ansys Cloud drive faster simulations, simpler workflows and additional solver capabilities, making simulation accessible for companies of all sizes. Ansys Cloud improvements have empowered Ansys fluids, structures and electronics customers to quickly scale up to solve computational issues.

“With Ansys Cloud, the ability to immediately scale up machines is unparalleled,” said Benjamin Turner, mechanical engineer at Hargrove Engineers + Constructors. “It eliminates the need to install any software and delivers pure convenience. I can use my smartphone to check my simulation’s status.”

As leading companies accelerate the pace of their autonomous vehicle (AV) and electric vehicle (EV) development, safety continues to be a top priority. Ansys 2021 R1 provides a comprehensive sensor solution for AVs, including an industry-leading, real-time, physics-based radar sensor capability, combined with closed-loop simulation validation to enhance AV safety. Also, new scanning and rotating lidar models boost AV simulation reliability. Additionally, Ansys’ embedded systems and software solutions increase communication among team members and reduce embedded software certification costs. This delivers improved modeling and code generation flexibility for AUTOSAR automotive software components and provides support for the FACE 3.0 Technical Standard for military avionics. Lastly, Ansys’ cutting-edge systems safety solution helps enhance EV and AV safety analyses by graphically pinpointing where potential system failures may occur, simplifying the software safety review process.

“Using medini analyze for software safety analysis (SSA), Robert Bosch GmbH can reduce the effort for SSA,” said Sven Bergmann, project safety manager, Robert Bosch GmbH. “This enables reusability of information in one integrated tool, improves acceptance of software architects and eases review.”

Thyssenkrupp Presta AG Uses Ansys Mechanical to Simulate Their Steering Components

This new release makes comprehensive development of EV components a reality. Harnessing a new battery designer tool helps engineers optimize materials selection for creating next-gen batteries, while a new EV powertrain library speeds system simulation of electrified components. New software enhancements also add alarm sounds to vehicle advanced driver assistance systems that better EV driving safety, while new battery models equip engineers to tackle different scenarios including battery crush, cooling, nail penetration and module crush.

New customer requirements and increasingly shorter product development timelines present engineering teams with an unprecedented number of new challenges, ranging from system-level issues to fundamental component-level physics. With the acquisition of Analytical Graphics, Inc., Ansys now offers a comprehensive solution, enabling simulation from the component level all the way to a customer’s entire mission. Ansys 2021 R1 also continues to push boundaries at the detailed physics level, equipping teams to make smarter decisions earlier in the product design process, empowering them to avoid costly mistakes that can negatively impact product quality and reliability.

Additionally, Ansys 2021 R1 makes it easier for engineering teams to collaborate on projects in this work-from-home era through latest advances in simulation process and data management provided by Ansys Minerva, powered by Aras. Improved workflows help even novice engineers learn how to use this software quickly, while improving the sharing of data among expert users.

This release drives new levels of design exploration through capabilities like automated fluid-solid thermal analysis to easily predict fluid and solid thermal behaviors for the design and evaluation of electronics cooling and heat management devices. To create their unique 3D printers, Qualup SAS leverages Ansys Discovery to visualize thermal and cooling design variations.

“Ansys Discovery allows us to quickly evaluate the influences of design variations on the thermal and internal ventilation of the print chamber as well as the influence of the design on the cooling of certain components,” said Philippe Boichut, owner, Qualup SAS. “Discovery gives us the incredible possibility to modify the modeling live and to visualize the effects instantly — a perfect tool for designers.”

Ansys Discovery Now Includes Automated Fluid Solid Thermal Analysis to Easily Predict Fluid and Solid Thermal Behaviors

Ansys 2021 R1 also helps manufacturing companies fill the gap between injection molding and structural simulation for short fiber reinforced composites that are increasingly used in automotive components and consumer goods. thyssenkrupp Presta AG uses these advances in simulation technology to help them steer toward the future of mobility with the short fiber workflow.

“Ansys 2021 R1’s newest release of Ansys Mechanical provides the ability to model the realistic and complex details of injection molded plastics, like the orientation of fibers and the presence of injection stresses in the parts,” said Francesco Fiorini, structural and durability engineer at thyssenkrupp Presta AG. “This significantly increases the accuracy of our engineering developments.”

“Ansys 2021 R1 will provide companies and engineering teams of every size with the industry-leading technology needed for developing products that will shape the future of our global community,” said Shane Emswiler, senior vice president, Ansys. “Ansys 2021 R1 delivers unique capabilities that equip engineers to pioneer innovations that previously might have been impossible to imagine, creating a significant competitive edge and a faster path to market for their organizations.”

To learn more, please visit: https://www.ansys.com/products/release-highlights.

For specific updates on each of Ansys’ product suites, please visit:

1. Systems
2. Optical
3. Embedded Software
4. Multiphysics
5. Structures
6. 3D Design
7. Electronics
8. Fluids
9. Materials
10. Semiconductors
11. Platforms
12. Additive Manufacturing
13. Photonics

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. For more information, visit www.ansys.com.

Invitation

PARIS, France, Jan 27, 2021 – ESI Group, global player in virtual prototyping for industries, is contributing to the reforestation of the planet by planting 10,000 trees by 2025. By the end of the ongoing year, ESI’s customers and employees will have planted several thousand trees thanks to a program run by Reforest’Action, a company whose main mission is to preserve, restore and create forests in France and around the world, through collective reforestation projects. Each participant can follow the evolution of the reforestation and its benefits in real time (impact on climate, biodiversity, health and employment) on https://www.reforestaction.com/en/esi-group.

“With this reforestation program, which is part of our CSR approach, ESI Group gives the opportunity to its customers and employees to collectively commit to concrete action to preserve our planet by a simple gesture. The aim is to work towards controlling and reducing our carbon footprint with the involvement of our stakeholders,” Corinne Romefort-Régnier, Corporate Governance Director – ESI Group

ESI, a player committed to limiting its environmental footprint along with the one of its customers
This important action in terms of CSR commitment is in line with the nature of the Group’s activities.  Thanks to its solutions, the company is committed to helping its customers develop better products and achieve the highest standards of environmental protection, while significantly reducing waste and gas emissions.

“ESI has developed unique expertise to assist the industry to replace physical tests and prototypes with virtual ones, enabling customers worldwide to virtually manufacture and then test their products, predict their performance and anticipate their maintenance needs in different environments throughout the product lifecycle. As a result, ESI Group helps its customers to take action to reduce their carbon footprint, but also their R&D budget.” Jonas Fredriksson, Managing Director ESI Northern Europe and member of the CSR Steering Committee.

About ESI Group

Founded in 1973, ESI Group is a leading innovator in Virtual Prototyping solutions and a global enabler of industrial transformation. Thanks to the company’s unique know-how in the physics of materials, it has developed and refined, over the last 45 years, advanced simulation capabilities. Having identified gaps in the traditional approach to Product Lifecycle Management (PLM), ESI has introduced a holistic methodology centered on industrial productivity and product performance throughout its entire lifecycle, i.e. Product Performance Lifecycle™, from engineering to manufacturing and in operation. Present in more than 20 countries, and in major industrial sectors, ESI employs 1200 high level specialists around the world and reported 2019 sales of €146 million. ESI is headquartered in France and is listed on compartment B of Euronext Paris. For further information, go to www.esi-group.com.

MOSCOW, Russia, Jan 26, 2021 – Nanosoft, the developer of DWG-compatible CAD systems, is pleased to announce that the highly anticipated 2.0 version of the nanoCAD 3DScan is finally here! Alongside updated icons and fixations we’ve added new commands and features for a better and effective performance.

The nanoCAD 3DScan 2.0 is now based on the nanoCAD Plus version 20.1 which means that it automatically receives all of its features.

The nanoCAD 3DScan 2.0 became even more precise with the recognition process with which you can now easily exclude points such as noise or man-made objects.

The classification of points (vegetation) command got significantly enhanced and the procedure can now be used not only to classify vegetation, but to classify any objects by height from the ground surface: low constructions, high-rise buildings, power lines, pipes, etc.

The command Create TIN got new options that allow you to select particular point classes for creation of triangulation mesh based on them. The options are similar to the Classification of ground command.

Previous clouds with the coordinate system WGS84 were importing with distortion. The new version provides the possibility to import point clouds from LAS format with WGS84 coordinate system.

Classification by Class is a brand new command which can handily change the class for visible points only by using the Cut and Section commands.

The Compare Point Clouds command now colors the cloud according to the normal direction when comparing a cloud with triangulation ground surface. This allows to easily determining the position of points relative to the mesh. In addition, the coloring of clouds when resetting the clip after comparing their trimmed parts was fixed.

Overview of new commands and improvements of nanoCAD 3DScan 2.0:

1. automatic recognition of ground surface has been significantly improved
2. possibility to classify vegetation and objects at a given distance from the ground (or any other surface);
3. filtration Based on Source Classes in the “Create TIN” Command
4. support of WGS84 coordinate system;
5. new command Classification by Class added;
6. Compare Point Clouds command updated;

A detailed description of all the changes and updates can be found in the What’s New section. The 30-day trial version can be downloaded from our Web site. nanoCAD 3DScan 2.0 can be purchased online, visit market.nanocad.com.

About Nanosoft

Nanosoft is a community of CAD professionals who have been working in the CAD software industry since the 1980s. We are focused on creating high-quality, cost-effective software solutions for the CAD industry. One of our most important goals is to provide our customers the ideal vehicle for upgrading from unlicensed (pirated) CAD software to legitimate software. For more information, visit https://nanocad.com.

LUXEMBOURG, Jan 26, 2021 – e-Xstream engineering, part of Hexagon’s Manufacturing Intelligence division, has introduced new simulation and virtual manufacturing capabilities that enable users to analyze the production cost of polymer-based additive manufacturing parts against conventional processes, and continuously improve their virtual engineering processes by validating the composite’s microstructure with CT scans of manufactured parts.

Additive manufacturing with composites is gaining traction in the market because of its ability to automate the creation of stronger and lighter components than metal processes and engineer the performance (eg. with continuous fiber reinforced polymer) of the underlying material to purpose. The latest Digimat software enables businesses to simulate the 3D printing process and calculate the total cost of producing each part including the material utilization, employee time, energy, and the required post-processing steps.

Using this new tool, an engineer can take a holistic view of part production and finishing processes to determine the best process chain for production. Crucially, it can also be used to perform batch optimizations to print as many parts as possible in parallel, increasing production capacity and reducing lead time. It can also be used in production planning, to consider the total cost of ownership of machines and amortize those costs over the projected production volumes. This information is visualized for the user through plots and pie charts, so the cost breakdown can be easily analyzed for different scenarios.

Global demand for composite 3D printing is predicted to grow to $1.7 billion by 2030, but applications have been limited to date due technical challenges. Because the fiber orientation changes throughout different areas of the part, this has a significant effect on the mechanical performance. Knowing this information can help engineers troubleshoot quality issues and greatly improves the accuracy of performance predictions. Manufacturers can now CT Scan a part and import the 3D RAW image to build a finite element model of its two-phase microstructure (eg. carbon fiber reinforced polymer) in Digimat and model its behavior.  By embedding this validated material model in their Computer Aided Engineering (CAE) tools, a design engineer can perform analyses that account for variations within a manufactured part to reduce material use or avoid points of failure.

Connecting physical measurement with virtual testing also improves the accuracy of Integrated Computational Materials Engineering (ICME) processes when a new material system is introduced. The part performance can be compared to the simulated process to validate and certify the material model. CT scan validation also supports helps materials professionals refine the microstructure models they have built manually to improve the accuracy of future simulations.

When refining new manufacturing processes, users can capture information about the part, material, 3D printer or process used and their physical tests as they work using material lifecycle management. e-Xstream engineering’s MaterialCenter software captures a traceable, validated database of those trusted material properties so that they can be used in the design phase of a product. Using material lifecycle management, information can be easily documented within multi-disciplinary teams and shared throughout an organization capturing valuable knowledge for reuse by authorized users.

Predicting the material behavior of a CT-scanned microstructure is a computationally intensive process, for example it could take several days to analyze complex behavior such as creep using Central Processing Units (CPU) computing only. By optimizing these processes for Graphics Processing Units (GPUs), some tasks can now be performed interactively by the engineer because results are produced in minutes. Benchmarks show the time required to analyse the stiffness of a material is reduced by 98%. This rapid solve time, combined with the introduction of a command line interface, also enables the use of Digimat finite element models within automated cloud-based optimization workflows on high performance computing platforms.

When producing high performance structures such as aerospace components from composites, the Progressive Failure Analysis (PFA) model makes it possible to define safety margins for a structure and make optimal use of the expensive materials and processes. The latest version of Digimat performs these complex Camanho model analyses twice as fast, making it possible to perform a parametric study to define defect tolerances and maximize production yields.

Learn more: www.e-xstream.com/products/digimat/whats-new-digimat-2021.1

About Hexagon | e-Xstream engineering

Hexagon is a global leader in sensor, software and autonomous solutions. We are putting data to work to boost efficiency, productivity, and quality across industrial, manufacturing, infrastructure, safety, and mobility applications.

Our technologies are shaping urban and production ecosystems to become increasingly connected and autonomous – ensuring a scalable, sustainable future.

e-Xstream engineering, part of Hexagon’s Manufacturing Intelligence division, provides Integrated Computational Materials Engineering (ICME) solutions to innovate and optimize product performance using the right materials and manufacturing process for the right application. Learn more at e-Xstream.com. Hexagon’s Manufacturing Intelligence division provides solutions that utilize data from design and engineering, production and metrology to make manufacturing smarter.

Hexagon (Nasdaq Stockholm: HEXA B) has approximately 21,000 employees in 50 countries and net sales of approximately 3.9bn EUR. Learn more at hexagon.com and follow us @HexagonAB.

PLANO, TX, USA, Jan 26, 2021 – Siemens pleased to announce that its industry-leading tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.

With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE (AFS) platform on Samsung’s most advanced process technology. Samsung’s 3nm GAA platform is engineered to reduce total silicon size, use less power and improve performance over previous process nodes.

“Samsung and Siemens have an established track record of collaboration to enable our mutual customers to fully leverage the AFS platform, and we are pleased that the AFS platform is now certified for early design starts on the very latest Samsung Foundry process,” said Sangyun Kim, Vice President of Foundry Design Technology Team at Samsung Electronics. “The combined expertise of Samsung Foundry and Siemens provides designers the ability to develop and quickly verify innovative ICs for a variety of high-growth markets and applications.”

With this new certification, the AFS platform is now enabled in Samsung Foundry’s device models and design kits. Mutual customers rely on the AFS platform to deliver nanometer-scale SPICE accuracy while verifying analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits faster than with traditional SPICE simulators.

“With its newest process, Samsung Foundry continues to deliver highly innovative technology for the manufacture of the most sophisticated of IC designs,” said Ravi Subramanian, Ph.D., Senior Vice President, IC Verification Solutions, Siemens Digital Industries Software. “We are pleased to collaborate with Samsung Foundry to help enable our mutual customers to design and manufacture advanced ICs. We look forward to continued collaboration with Samsung Foundry on future advanced technology developments catering to innovative applications.”

About Siemens Digital Industries Software

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software – Where today meets tomorrow.

SAN JOSE, CA, USA, Jan 25, 2021 – Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that it has entered into a definitive agreement to acquire NUMECA International, a leader in computational fluid dynamics (CFD), mesh generation, multi-physics simulation and optimization. The addition of NUMECA’s technologies and talent supports the Cadence Intelligent System Design strategy and broadens its system analysis portfolio with CFD solutions, servicing a fast-moving market segment where accuracy, reliability and predictability are paramount concerns for high-fidelity modeling.

NUMECA’s technology addresses the high-growth CFD market segment, which has an estimated $1.6B TAM. The acquisition builds on the momentum of recent Cadence system innovation developments with the Clarity 3D Solver for electromagnetic (EM) simulation, the Clarity 3D Transient Solver for finite difference time domain (FDTD) system-level EM simulation and the Celsius Thermal Solver for electrical-thermal co-simulation product introductions. NUMECA’s technology will also contribute to Cadence best-in-class system analysis solutions for integrated circuits (ICs), electronic subsystems and full system designs.

NUMECA’s core competency in CFD encompasses many industries and applications including aerospace, automotive, industrial and marine, with its proven technologies adopted by industry leaders such as NASA, ArianeGroup, Honda and Ford.

“Cadence continues to be at the forefront of innovation, addressing real-world system design challenges by leveraging our deep computational software expertise,” said Dr. Anirudh Devgan, president of Cadence. “The acquisition of NUMECA’s proven CFD technology and talented team complements Cadence’s finite element analysis and other system innovation technologies and is another successful step that will advance our customers’ ability to design the exciting products of tomorrow.”

“Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, boards, complex mechanical structures and more,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “With the addition of NUMECA’s technology to the Cadence portfolio, we are broadening our system analysis capabilities and integrated design solutions, addressing critical customer challenges in areas such as internal and external flows, acoustics, heat transfer, fluid-structure interaction and optimization.”

“Since our inception, NUMECA’s stated mission has been to deliver dedicated CFD solutions to predict product and system performance focused on the highest levels of reliability and safety for our industry-leading customers’ most challenging designs,” said Dr. Charles Hirsch, president of NUMECA. “We are very excited to join Cadence, as we share a common culture of innovation in computational software. Together, we will continue covering the industrial challenges of our current market, while providing creative system solutions to address the needs of next-generation products.”

The terms of the transaction were not disclosed. The acquisition is expected to be immaterial to revenue and earnings this year, and close in the first quarter of 2021, subject to customary closing conditions.

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For six years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

About NUMECA

NUMECA is recognized as a worldwide provider of innovative computational fluid dynamics (CFD) software, optimization and heat transfer technologies. NUMECA software is used by designers, naval architects, research engineers and product developers in aerospace, marine, automotive, energy and power generation, allowing them to reach superior product quality and performance at a reduced engineering cost. Learn more at numeca.com.

GLOUCESTERSHIRE, UK, Jan 25, 2021 – To continue to provide customers in the CNC machining industry with vital data to help realize the benefits of Industry 4.0, global engineering technologies company, Renishaw, has become a member of the umati community, alongside its existing role on the Standards Committee of MTConnect. As an active member of both these communities, Renishaw will support the development of common language standardization for machine tools by publishing process measurement and part quality data. This will help customers improve overall equipment effectiveness (OEE) and interoperability.

umati, or universal machine technology interface, is an open standard backed by the German Machine Tool Builders’ Association (VDW) and the German Mechanical Engineering Industry Association (VDMA). Members of both organizations have worked together to develop a common information model, based on the OPC UA protocol, to simplify connectivity between equipment and software, and control data exchange between different machines.

“Renishaw offers a unique breadth of technologies that can be applied throughout the CNC manufacturing process chain,” explains Paul Maxted, Director of Industrial Metrology Applications at Renishaw. “Our technologies can collect data throughout the manufacturing process, from initial set-up to in-process measurements and final part verification. As an active member of the umati community we can provide this data to further develop the information model as a leading common standard for Industry 4.0. Publishing our data in umati will further improve interoperability between machines on the shop floor, providing users with valuable measurement information to improve quality and make informed decisions to continuously improve manufacturing operations.”

“Adoption of the umati standard into Renishaw’s manufacturing data platform, Renishaw Central, will provide enhanced connectivity between physical manufacturing processes and digital software,” says Guy Brown, Renishaw Central Development Manager. “As we work with the other umati members to help set the standard for data collection, Renishaw intends to help manufacturers clearly trace what is happening throughout the process chain, and more importantly, why it is happening.”

“Overall equipment effectiveness is a vital performance metric for our customers, but it is often misleading,” explains James Hartley, Applications and Marketing Manager. “If manufacturers do not have the quality metrics needed to calculate OEE, they are often set at 100 per cent — an inaccurate result that suggests processes are running efficiently. As a member of umati, we can help manufacturers to accurately measure OEE and optimise their process chains.”

Renishaw has supported automation and process control within the CNC manufacturing industry for over 45 years and recognises the value of data driven manufacturing to address current and future challenges to improve manufacturing efficiency.

For further information, visit www.renishaw.com/smartmanufacturing