ANN ARBOR, MI, USA and STOCKHOLM, Sweden, Sep 4, 2020 – CIMdata and Eurostep are pleased to announce the agenda topics for PLM Road Map & PDT 2020, which will take place this year as a virtual-live event in November. The theme for this year’s event is “Digital Thread—the PLM Professionals’ Path to Delivering Innovation, Efficiency, and Quality.” The event will take place between 9:00 AM – 12:30 PM (EST) / 15:00 – 18:30 (CET) on November 17-19.

PLM Road Map & PDT will bring together the perspectives of leading thinkers from aerospace & defense, maritime, and other industries who are working to remediate the pain points that inhibit the Digital Thread. The agenda will also include presentations from program managers responsible for Digital Thread strategies and implementations within their companies.

Presentations over the three days will cover the following topics:

1. Digital Twin, It Requires a Digital Thread
2. Multiple-View Bill of Materials Solution Evaluation Benchmarks
3. 5G for Digital Twins & Shadows
4. Delivering Through Life: Digital Innovation in Maritime
5. Digital Thread: Be Careful What you Wish For, It Just Might Come True
6. Global Collaboration – Defining a Baseline for Data Exchange Processes and Standards
7. Looking Outside the Core of PLM to Deliver Value With PLM
8. Model-Based Definition
9. Model-Based Systems Engineering: The State of the Industry
10. What does it Take to Create the Digital Thread in Complex Systems Development?
11. Digital Thread—the PLM Professionals’ Path to Delivering Innovation, Efficiency, and Quality

“The agenda topics are of high interest to any PLM professional, and the line-up of speakers is great, matching previous PDT Europe and PLM Road Map events,” says Mr. Håkan Kårdén, Eurostep’s Director of Marketing. “In times like these, everything is challenged, but the way to respond is not by standing still but by accelerating efforts and investments to help us meet the future. This year has demonstrated that we need to design PLM to be an agile, resilient, and systems-wide life cycle as well as supply chain. We are looking forward to delivering another must-attend event, this time on-line,” added Mr. Kårdén.

According to Ms. Cheryl Peck, CIMdata’s Director of Marketing, “For over 25-years, we have demonstrated a commitment to delivering high client value through our face-to-face PLM conferences. This year’s virtual event will be no different. The agenda topics we have put together look to future state requirements, roadmaps, and transformational implementations that encompass people, process, and technology.”

PLM Road Map & PDT is a highly relevant event for PLM industry leaders and PLM practitioners globally, providing independent education where ideas, trends, experiences, and relationships critical to the industry germinate and take root.

For more detail on the agenda, please visit https://www.cimdata.com/en/education/plm-conferences/plmrm-pdt-fall-2020.

Invitation

PLANO, TX, USA, Sep 3, 2020 – Siemens Digital Industries Software can now deliver more seamless integration and data and process orchestration across the Xcelerator portfolio through an expanded strategic partnership with eQ Technologic (eQ). Building on the long relationship between Siemens and eQ, Siemens’ customers can now access the eQube Data as a Service platform to create digital threads connecting systems including Product Lifecycle Management (PLM), Enterprise Resource Planning (ERP), Application Lifecycle Management (ALM), Internet of Things (IoT), and other Information Technology (IT), Engineering Technology (ET) and Operational Technology (OT) solutions. eQube extends the Mendix Data Hub, a key component of the expanded Mendix low-code platform, and can help enable industrial data and system integrations with a rich set of over 60 smart connectors developed from domain-specific knowledge drawn from over 20 years of experience.

Leveraging the eQube DaaS platform in conjunction with the Mendix low-code application development platform, users can easily access data from across systems to automate new workflows and create new deeply integrated applications and experiences.

“Siemens and eQ have leveraged eQ’s proven technology for many years to successfully help customers in multiple industries to integrate and federate data and processes across systems,” said Tony Hemmelgarn, President and CEO at Siemens Digital Industries Software. “Expanding our partnership can help us build on this success and expand globally across all the industries we serve.”Many companies have data distributed across multiple systems and generated by a variety of applications. As digital transformation is embraced as a core business strategy, these organizations are under immense pressure to gain collective insight into this distributed data and connect it virtually without replication. The eQube DaaS platform establishes a connected network of integrated data, applications and devices that puts the power of analytics in the hands of end users leading to actionable insight. This partnership can help Siemens customers improve their ability to harness information from multiple systems by establishing an integrated data environment for their digital threads, multi-application integrations, orchestration and virtualization through for-purpose industrial integrations to address specific business problems.

As a first step in the expanded partnership, Siemens will begin offering the eQube DaaS platform with over 60 smart connectors, including PLM, ERP, Asset Management, ALM, IoT, Program & Portfolio and Databases and leverage the eQ team for pre-sales, services and field support. Leveraging the eQube DaaS platform in conjunction with the Mendix low-code application development platform, users can easily access data from across systems to automate new workflows and create new deeply integrated applications and experiences. With better understanding through traceability and actionable insights of cross-system data, Siemens’ customers can reduce required resources and accelerate their transformation into digital enterprises.

“As a long-time Siemens partner, we understand the importance and challenge of connecting data and processes across the digital enterprise, including a wide range of PLM products such as Teamcenter from Siemens, ERP, ALM, MES, Asset Management, other enterprise software products and IoT,” said Dinesh Khaladkar, President and CEO, at eQ Technologic. “Extending this partnership can further help Siemens’ customers accelerate digital transformation by connecting and integrating their systems. eQube solves complex integration problems, simply, helping organizations gain actionable insights and improve collaboration.”

eQ Technologic, Inc. (eQ) is a trusted provider of eQube, a Data as a Service (DaaS) platform that delivers a highly scalable, resilient, and secure Integrated Data Environment (IDE).  eQube-DaaS platform-based solutions for IDE result in substantial productivity gains accelerating Digital Transformation. eQube establishes a Digital Backbone of integrated data, applications and devices that puts the power of analytics in the hands of end users leading to Actionable Insight. eQube-DaaS platform-based solutions have been widely deployed across world-wide customers, from major industries such as Aerospace & Defense, US DoD, Auto & Machinery, High-Tech, Ship Building, Energy, Food, and Consumer Packaged Goods (CPG). Further information is available at www.1eQ.com, YouTube and LinkedIn.

About Siemens Digital Industries Software

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software – Where today meets tomorrow.

About Siemens Digital Industries (DI)

Siemens Digital Industries (DI) is an innovation leader in automation and digitalization. Closely collaborating with partners and customers, DI drives the digital transformation in the process and discrete industries. With its Digital Enterprise portfolio, DI provides companies of all sizes with an end-to-end set of products, solutions and services to integrate and digitalize the entire value chain. Optimized for the specific needs of each industry, DI’s unique portfolio supports customers to achieve greater productivity and flexibility. DI is constantly adding innovations to its portfolio to integrate cutting-edge future technologies. Siemens Digital Industries has its global headquarters in Nuremberg, Germany, and has around 76,000 employees internationally.

About Siemens AG

Siemens AG (Berlin and Munich) is a global technology powerhouse that has stood for engineering excellence, innovation, quality, reliability and internationality for more than 170 years. The company is active around the globe, focusing on the areas of power generation and distribution, intelligent infrastructure for buildings and distributed energy systems, and automation and digitalization in the process and manufacturing industries. Through the separately managed company Siemens Mobility, a leading supplier of smart mobility solutions for rail and road transport, Siemens is shaping the world market for passenger and freight services. Due to its majority stakes in the publicly listed companies Siemens Healthineers AG and Siemens Gamesa Renewable Energy, Siemens is also a world-leading supplier of medical technology and digital healthcare services as well as environmentally friendly solutions for onshore and offshore wind power generation. In fiscal 2019, which ended on September 30, 2019, Siemens generated revenue of €86.8 billion and net income of €5.6 billion. At the end of September 2019, the company had around 385,000 employees worldwide. Further information is available on the Internet at www.siemens.com.

LAKE MARY, FL, USA, Sep 3, 2020 – FARO Technologies, Inc. (NASDAQ: FARO), a global leader of 3D measurement, imaging and realization solutions for the 3D Metrology, AEC (Architecture, Engineering & Construction), and Public Safety Analytics markets, announced that it has hired two industry veterans to join its senior leadership team and manage the global hardware and software R&D teams. Avi Ray-Chaudhuri, who serves as Vice President of Hardware R&D, and Wesley Tilley, who serves as Vice President of Software R&D, joined the Company on August 31, 2020.

“As FARO continues to increase its focus on cloud-based software applications that enable long-term differentiation of our 3D solutions, we are adding critical talent to FARO’s executive team to lead both our software and hardware R&D organizations that will accelerate our product development efforts,” said Michael Burger, President and CEO of FARO. “I am thrilled to have two industry leaders like Wes and Avi join our organization and lead these teams.”

Avi Ray-Chaudhuri has over 20 years of leadership success in diverse industries including semiconductor, advanced lithography, and laser development. Most recently, he served as VP, Engineering, Commercial Lasers for Lumentum, where he significantly reduced the product development cycle time and implemented best-in-class program management, engineering and operations practices. Ray-Chaudhuri earned a Doctor of Philosophy, Electrical Engineering from the University of Wisconsin and a B.S. in Electrical Engineering from Princeton University.

Wes Tilley brings has more than 30 years of experience in the telecommunications industry, primarily in the areas of product management and R&D leadership. He most recently served as VP, Communications Software as a Service at Oracle, where he led a strategic shift in global business unit strategy to Cloud native, SaaS offerings in the telecommunications space. Tilley has an MBA in General Management from Duke University and a B.Sc Computer Science from North Carolina State University.

For more information, visit https://www.faro.com.

IRVINE, CA, USA, Sep 2, 2020 – EON Reality, the global leader in Augmented and Virtual Reality-based knowledge and skills transfer for industry and education, is proud to unveil the release of EON-XR, the brand new all-encompassing solution for XR learning and training.

EON-XR’s new evolution marks an XR transformation for  academic and industrial education

EON XR comes after over 20 years of perfecting an AR and VR platform based on patented technology which has received more than 20 international awards. Through the use of XR — the umbrella covering everything in AR, VR, and Mixed Reality — the new evolution of EON-XR is a massive step forward for a world in which remote learning is more important than ever. EON-XR brings a sleek new user experience built from the ground up to maximize ease of use for both the new and existing features.

Of the new features, one of the biggest additions in EON-XR is the ability to hold a remote immersive session as a team through our multi-user feature. This feature enables instructors to add XR learning components to their remote education materials, providing a more hands-on way for students and trainees to experience the topics they’re using in real time — which can be particularly useful in conjunction with EON-XR’s life-size AR scaling capabilities. Rather than a small photo in a textbook, EON-XR allows teachers and trainers to utilize full-size 3D models, Interactive 360° images, and 360° videos to bring their audience face-to-face with the subject matter. EON-XR also provides AR assistance in real time, so that the users get the contextual instructions when they need it, whether in Side by Side AR mode or in Overlaid AR mode.

Two other major improvements in EON-XR are the ability to create multiple 3D recordings within the same session — meaning that instructors can quickly create and demonstrate detailed procedures and aspects of a 3D model (such as a piece of equipment or interactive environment) in XR — and the ability to add 360° videos to lessons focusing on a 3D object. From a remote education perspective this means that not only can teachers and trainers show how an object functions, they can now show exactly how and where it fits within a larger real-life scenario.

While these features are all fully functional on computers, smartphones, and tablets, users who prefer to experience EON-XR while wearing an XR headset (such as an Oculus Rift, HTC Vive, or Magic Leap) will be able to enjoy some exclusive new features as well.

The new 3D assessment tool brings live XR procedural assessment to EON-XR, so instructors can test their pupils’ education by making them replicate the steps of a certain process. At the end of each assessment, EON-XR shows the user a report based on their performance, which is also provided to appropriate instructors. This report includes completion percentage, any additional or inaccurate steps, and the amount of time in which it was completed.

Staying within XR headsets, the new Search Assist functionality allows users to scour the internet for relevant information about the memos and annotations they’ve created without ever leaving the application — putting more information at a user’s fingertips than ever before.

As a part of the new EON-XR release EON Reality also introduces the patented new system using virtual lasers for interacting with XR environments. Mobile devices can employ virtual pointers and control buttons to enable users to interact with the objects. Users can aim the pointer at an object, select the object, and then drag and drop thel object to a new location. Embodiments also enable users to select, move, transform, create and delete objects with the pointer. This new virtual pointer technology also provides users with a means of drawing lines and geometric virtual objects.

About EON Reality

EON Reality is the world leader in Augmented and Virtual Reality-based knowledge and skills transfer for industry and education. EON Reality’s 21 years of success are tied to its belief that knowledge is a human right and should be available, accessible, and affordable for every human on the planet. To carry this out, EON Reality has developed the de-facto standard for Augmented Reality and Virtual Reality-based knowledge and skills transfer software that supports devices from mobile phones to large immersive domes. EON Reality’s global development network — with more than 20 locations worldwide — has created the world’s leading AR/VR library for education and industry with over 8,000 applications and over 40 million users worldwide. For more information, visit https://eonreality.com.

NORCROSS, GA, USA, Sep 2, 2020 – Innovate UK, the country’s innovation agency, has selected Hexagon’s Geospatial division to conduct a research project that will result in faster and higher-precision mapping of railway infrastructure through the use of artificial intelligence. The project is funded by Network Rail, the owner and operator of Great Britain’s railway infrastructure, under its R&D portfolio and delivered by Innovate UK through the SBRI competition, Innovation in Automated Survey Processing for Railway Structure Gauging, Phase One. A small group of teams was selected for this effort.

The project will enable Network Rail to automatically identify and measure railway structures from LiDAR data, saving valuable time and resources, while also improving planning and operations across the rail network. The current, manual process takes analysts months or even years due to the size of the data and the labor-intensive tasks involved.

“The combination of cross-sectional area, shape, length and speed all place a space requirement on today’s railway,” said James Sweeney, Senior Engineer at Network Rail. “We anticipate this project will offer us a more efficient way to capture, analyse and measure railway features along 20,000 miles of track, which is important to railway safety and the growth and capacity of our network.”

Network Rail collects detailed information about its track and the surrounding features, such as bridges and tunnels. The data is then analyzed to assess clearances between trains and the infrastructure around them, which is key to safety. The new project aims to automate the extraction and calculation of railway features from sensor data, leveraging AI to automatically analyse point cloud data, identify different structure types and perform measurements on the structures. The data will be collected from reality capture solutions from Hexagon’s Geosystems division.

“Network Rail, supported by Innovate UK, is leading the way in the use of AI to automate rail structure identification and measurement,” said Mladen Stojic, president of Hexagon’s Geospatial division. “We are excited to be part of a project that can help transform the gauging process for UK railways.”

Learn more about how Hexagon helps organizations close the gap between the geospatial and operational worlds with its transportation solutions.

About Hexagon

Hexagon is a global leader in sensor, software and autonomous solutions. We are putting data to work to boost efficiency, productivity, and quality across industrial, manufacturing, infrastructure, safety, and mobility applications.

Our technologies are shaping urban and production ecosystems to become increasingly connected and autonomous — ensuring a scalable, sustainable future.

Hexagon’s Geospatial division creates solutions that visualize location intelligence, delivering a 5D smart digital reality with insight into what was, what is, what could be, what should be, and ultimately, what will be.

Hexagon (Nasdaq Stockholm: HEXA B) has approximately 20,000 employees in 50 countries and net sales of approximately 4.4bn USD. Learn more at hexagon.com and follow us @HexagonAB.

ROCK HILL, SC, USA, Sep 2, 2020 – 3D Systems (NYSE:DDD) announced that Jagtar Narula will join the company as Executive Vice President and Chief Financial Officer, effective September 14. He will report to President and CEO, Dr. Jeffrey Graves, and lead the company’s Finance organization, including all finance operations and investor relations.  With a strong technical foundation and extensive experience in investment strategy, Jagtar will play a central role in capital deployment for growth and margin expansion.

 Jagtar Narula, new CFO, 3D Systems

Building upon a strong educational foundation in both Engineering and Finance, Mr. Narula brings to 3D Systems 28 years of progressive financial and business leadership, including extensive M&A experience as well as leading global transformations through both integration of acquisitions and selective divestitures.  Currently, he is SVP Corporate Strategy and Business Development for Blackbaud Corporation where he also previously led Investor Relations and Financial Planning.  Prior to that, Mr. Narula had finance leadership positions of increasing responsibility at Xerox, GE and with private equity.  He holds an MBA from The Wharton School of the University of Pennsylvania as well as an Engineering degree from the University of New York at Buffalo.

“I am excited to have a leader of Jagtar’s experience join our team at such an important time for our company,” said Dr. Graves. “Jagtar’s experience in leading technology companies with complex transformations and large-scale efficiency improvements will be invaluable as we transition to our new focus, align our organization and cost structure to our current revenues, and position ourselves for sustained growth and profitability in the years ahead.  I want to add a special note of thanks to Wayne Pensky for serving as our Interim CFO, allowing us to move quickly to restructure the business and prepare for an exciting future ahead.  Wayne will support Jagtar to ensure a smooth transition in Finance leadership for the company.”

About 3D Systems

More than 30 years ago, 3D Systems brought the innovation of 3D printing to the manufacturing industry. Today, as the leading Additive Manufacturing solutions partner, we bring innovation, performance, and reliability to every interaction – empowering our customers to create products and business models never before possible. Thanks to our unique offering of hardware, software and materials, each application-specific solution is powered by the expertise of our application engineers who collaborate with customers to transform how they deliver their products and services. 3D Systems’ solutions address a variety of advanced applications in Healthcare and Industrial markets such as Medical and Dental, Aerospace & Defense, Automotive and Durable Goods. More information on the company is available at www.3dsystems.com.

LEVIS, QC, Canada, Sep 2, 2020 – Creaform, the worldwide leader in portable and automated 3D measurement solutions, is pleased to announce the appointment of Marc-Antoine Schneider as Head of Sales. Based in Grenoble, France, Mr. Schneider will lead Creaform’s global sales and business development strategies and tactics for all territories and application markets.

Marc-Antoine Schneider, Creaform’s  new Global Head of Sales

During his tenure at Creaform, Mr. Schneider has developed and expanded the company’s network of distributors across multiple countries. Before being named Head of Sales, he was Creaform’s EMEA Sales Territory Manager and contributed to opening branches in Italy and Spain. With a master’s degree in Business Administration, Mr. Schneider originally joined Creaform in 2008 and held several positions in sales for the company, including Regional Sales Manager of Europe, the Middle East, and Africa.

“It is an honour for me to join the Creaform management team. I expect a smooth transition as we address new market challenges and deploy our strong business plan,” said Mr. Schneider. “I look forward to advancing Creaform’s culture of innovation and market-driven strategies.”

“We are thrilled that Mr. Schneider accepted the nomination,” said Fanny Truchon, President at Creaform. “The coming months and years will require us to adjust to a new reality. I am confident he has the forward-thinking mindset and agility to support our worldwide network of sales partners.”

About Creaform

Creaform develops, manufactures, and sells 3D portable and automated measurement technologies and specializes in engineering services. The company offers innovative solutions for applications such as 3D scanning, reverse engineering, quality control, non-destructive testing, product development, and numerical simulation (FEA/CFD). Its products and services cater to a variety of industries, including automotive, aerospace, consumer products, heavy industries, healthcare, manufacturing, oil and gas, power generation, research and education.

With headquarters and manufacturing operations in Lévis, Québec, Creaform operates innovation centers in Lévis as well as Grenoble, France, with direct sales operations in Canada, USA, Mexico, Brazil, France, Germany, Italy, Spain, China, Japan, Korea, Thailand and Singapore. Creaform is part of AMETEK Ultra Precision Technologies, a division of AMETEK Inc., which is a leading global manufacturer of electronic instruments and electromechanical devices, with annual sales of approximately $5 billion. For more information, visit https://www.creaform3d.com/.

MOUNTAIN VIEW, CA, USA, Sep 2, 2020 – Synopsys, Inc. (Nasdaq: SNPS) announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today’s complex multi-die systems for applications like high-performance computing (HPC), automotive and mobile.

“Applications such as AI and 5G networking increasingly require higher levels of integration, lower power consumption, smaller form factors, and faster time to production, and this is driving the demand for advanced-packaging technologies,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “TSMC’s Innovative 3DIC technologies such as CoWoS® and InFO enable customer innovation with greater functionality and enhanced system performance at increasingly competitive costs. Our collaboration with Synopsys provides customers with a certified solution for designing with TSMC’s CoWoS® and InFO packaging technologies to enable high productivity and faster time to functional silicon.”

The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package. The solution includes features such as TSMC design macro support and auto-routing of high-density interposer based interconnects using CoWoS technology. For RDL-based InFO designs, schedules are reduced from months to a few weeks through automated DRC-aware, all-angle multilayer signal and power/ground routing, power/ground plane creation, and dummy metal insertion, along with the support for TSMC design macros.

For CoWoS-S and InFO-R designs, dies need to be analyzed in the context of the package and the overall system.  Die-aware package and package-aware die power integrity, signal integrity, and thermal analysis are critical for design validation and signoff. Integration of Ansys’ RedHawk™ family of chip-package co-analysis solutions in 3DIC Compiler meets this critical need, enabling seamless analysis and faster convergence to an optimal solution. Customers can achieve smaller designs and higher performance by eliminating overdesign.

“Synopsys and TSMC recognize the design challenges being faced by our customers looking to create next-generation products using multi-die solutions, and our collaboration provides our mutual customers with an optimized path to implementation,” said Charles Matar, senior vice president of System Solutions and Ecosystem Enablement for the Design Group at Synopsys. “By providing natively implemented silicon interposer and fan-out layouts, physical verification, co-simulation and analysis capabilities in a single unified platform, we enable our customers to address today’s complex architectures and packaging requirements, in addition, to increased productivity and faster turnaround time.”

For more information, please visit Synopsys’ 3DIC Compiler’s webpage at www.synopsys.com/3DIC.

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

LONDON, UK, Sep 1, 2020 – AVEVA, a global leader in engineering and industrial software, unveiled ‘Cloud-First’, a key component of its long-term software portfolio strategy to focus on providing core services in the cloud to ensure high uptime and availability, user management and the flexibility to try new solutions. The strategy includes the introduction of scenario-driven integration between products for rapid time to value.

As part of this strategy, AVEVA has also announced significant new advances to its industry-leading cloud platform, AVEVA Connect –  AVEVA Unified Engineering and AVEVA Insight Guided and Advanced Analytics. These new solutions, accessed in the cloud, reduce total cost of ownership, help users to improve efficiency and enable decision support with infused industrial Artificial Intelligence (AI).

Designed to securely host AVEVA software solutions in the cloud, AVEVA Connect already enables more than 1,900 customers and over 25,000 users to access multiple products from one platform with a single sign-on. Connecting teams, data and processes in the Cloud is a key differentiator for AVEVA today given the changes in working patterns, the massive amounts of data being generated by industries and the need to bring many disparate processes together via one source. It facilitates improved user management across all assets as well as the capability to monitor usage of subscription credits across the entire AVEVA software portfolio.

“The new normal has required a shift in business focus and imperatives,” said Ravi Gopinath, Chief Cloud Officer and Chief Product Officer, AVEVA. “Moving forward, businesses will witness reduced capital investments, changing working processes, a heightened need for visualization tools and much greater agility and responsiveness across the value chain to minimize value leaks and optimize production to maximize profit opportunities.  Organizational focus has shifted to demand increased flexibility, much more real time collaboration, intelligent applications and a more streamlined user experience. AVEVA Connect will serve as a ‘one stop shop’ for all these requirements.”

New AVEVA Connect Solutions delivering Improved Efficiencies for Industrial Organizations

AVEVA Unified Engineering, breaks down the silos to deliver a collaborative data-centric environment with a single source of accountability across the engineering lifecycle. Multi-discipline teams across owner operators and EPCs can now collaborate to execute greenfield and brownfield projects with high traceability in a secure cloud environment that can be set up in days to accelerate time to value and reduce total installed cost. The AVEVA Insight Guided and Advanced Analytics are now available in the Cloud for advanced pattern recognition to augment automated analytics and condition monitoring. The solution offers a quick time to value enabling customers to start on a predictive analytics-based Asset Performance strategy without the need for complex modelling or data science. This solution allows the user to create easy-to-deploy models targeting specific assets, providing reliable anomaly detection with minimal configuration

AVEVA’s Cloud-First Strategy to Cater for Demands of the New Normal

From operating information analysis and low-code application development to complex engineering visualization, AVEVA Connect’s functionality allows easy trials for new capabilities. This will enable customers to benefit from the latest, most innovative products available, all accessed via the cloud.

‘Cloud-First’ includes the introduction of scenario-driven integration between products for rapid time to value. Later this year, AVEVA will also introduce software development kits to enable partners to provide their solutions within the AVEVA Connect platform in order to increase the range of capabilities available to customers.

“The shift to the cloud isn’t a matter of choice but something that must aggressively be pursued. The tremendous advantages of deployment and ownership costs, the ability to flexibly consume purely based on need and the removal of localized barriers to allow unprecedented levels of work efficiency and collaboration mean that we will continue to add to the rich domain content of our portfolio, because this is not just about technology, but about the realities and specifics of our customer’s business,” concluded Ravi Gopinath, Chief Cloud Officer and Chief Product Officer, AVEVA.

About AVEVA

AVEVA is a global leader in engineering and industrial software driving digital transformation across the entire asset and operations life cycle of capital-intensive industries.  The company’s engineering, planning and operations, asset performance, and monitoring and control solutions deliver proven results to over 16,000 customers across the globe. Its customers are supported by the largest industrial software ecosystem, including 4,200 partners and 5,700 certified developers. AVEVA is headquartered in Cambridge, UK, with over 4,400 employees at 80 locations in over 40 countries. For more details visit: www.aveva.com