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Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program

Nitin Patil -
PLANO, TX, USA, Aug 10, 2022 - Siemens Digital Industries Software announced that it was selected to participate in the Rapid Assured Microelectronics Prototypes...

Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes

Nitin Patil -
PLANO, TX, USA, Jun 16, 2022 - At the TSMC 2022 Technology Symposium, Siemens Digital Industries Software announced that its ongoing collaboration with longtime...

Siemens, UMC Join to Develop Process Design Kits for Automotive and Power Applications

Nitin Patil -
PLANO, TX, USA, Jan 21, 2022 - Siemens Digital Industries Software announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design...

Butterfly Network Deploys Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design

Nitin Patil -
SAN JOSE, CA, USA, Dec 28, 2021 - Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that Butterfly Network, Inc. has successfully deployed the Cadence Clarity 3D...
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