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Design News

Siemens Expands Collaboration with AWS to Help IC, Electronics Design Customers Accelerate Innovation

July 12, 2023

Artificial Intelligence

Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment

July 11, 2023

CAE

Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto

May 17, 2023

Design News

Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution

October 3, 2022

Design News

Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program

August 10, 2022

Design News

Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes

June 16, 2022

Design News

Siemens, UMC Join to Develop Process Design Kits for Automotive and Power Applications

January 21, 2022

Design News

Butterfly Network Deploys Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design

December 28, 2021

Latest posts

Yuba Water Agency Automates Monitoring of California’s Second Tallest Dam to Ensure Public Safety: Case Study

September 29, 2023

Materialise Expands Eyewear Design Capabilities with New Translucent 3D Printing Material

September 29, 2023

Zuken Introduces AI-Powered PCB Place and Route Technology for CR-8000

September 29, 2023

Lectra Unveils Automotive Cutting Room 4.0, VectorFashion iC70, Gerber Atria 70 at CISMA in Shanghai

September 29, 2023

Registration Opens for Aras Connect 2023 European Tour

September 29, 2023

Trimble, Meta Bring SketchUp to Meta Quest VR Headsets

September 29, 2023

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