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IC Design
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IC Design
Design News
Siemens Expands Collaboration with AWS to Help IC, Electronics Design Customers Accelerate Innovation
July 12, 2023
Artificial Intelligence
Siemens Advances Intelligent Custom IC Verification Platform with New, AI-powered Solido Design Environment
July 11, 2023
CAE
Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto
May 17, 2023
Design News
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
October 3, 2022
Design News
Siemens to Join Rapid Assured Microelectronics Prototypes Phase II Program
August 10, 2022
Design News
Siemens Extends Support of Multiple IC Design Solutions for TSMC’s Latest Processes
June 16, 2022
Design News
Siemens, UMC Join to Develop Process Design Kits for Automotive and Power Applications
January 21, 2022
Design News
Butterfly Network Deploys Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design
December 28, 2021
Latest posts
Yuba Water Agency Automates Monitoring of California’s Second Tallest Dam to Ensure Public Safety: Case Study
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Lectra Unveils Automotive Cutting Room 4.0, VectorFashion iC70, Gerber Atria 70 at CISMA in Shanghai
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Registration Opens for Aras Connect 2023 European Tour
September 29, 2023
Trimble, Meta Bring SketchUp to Meta Quest VR Headsets
September 29, 2023