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PTC Launches Arena Supply Chain Intelligence to Help Manufacturers, Product Companies Mitigate Supply Chain Risks

Nitin Patil
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PTC Launches Arena Supply Chain Intelligence to Help Manufacturers, Product Companies Mitigate Supply Chain Risks

BOSTON, MA, USA, Jun 26, 2025 – PTC (NASDAQ: PTC) today announced the release of its Arena product lifecycle management (PLM) and quality management system (QMS) solution’s new Supply Chain Intelligence (SCI) offering. The Arena SCI™ offering continuously checks for emerging risks from evolving supply chain conditions and eliminates the need for disconnected supply chain tools by embedding real-time, AI-driven component monitoring and risk mitigation insight directly into product development workflows. These capabilities transform how product development teams manage component risks throughout the entire product lifecycle within their existing PLM environment.

Product development and introduction teams can use Arena SCI to continuously monitor electronic components across bills of materials to identify emerging risks from changing supply chain conditions. When risks are detected, Arena SCI provides visibility, suggests alternative components based on technical compatibility, and enables teams to make more informed sourcing decisions earlier in the product development process—helping prevent sourcing interruptions before they impact production.

“By delivering supply chain intelligence directly where design decisions are made in a cloud-native environment, Arena Supply Chain Intelligence simplifies collaboration between design teams and suppliers and supports more proactive component sourcing decisions to help offset supply chain disruptions,” said David Katzman, General Manager of Arena and Onshape, PTC. “Supply chain collaboration has been one of Arena’s core strengths for years, and our investment in SCI adds a new dimension for our customers as they prioritize resiliency. We expect to enhance SCI with even more features in future releases, including more AI-driven functionality powered by our Arena AI™ capabilities.”

Arena SCI leverages the leading electronic component data source from Accuris to provide comprehensive electronic risk details and suggest alternative parts—enabling faster time to market while reducing the potential for added costs from continual, unanticipated disruptions.

“Our teams face constant pressure to move faster, even as supply chain challenges become increasingly unpredictable. We are seeking ways to help us stay ahead by identifying risks early and avoiding costly last-minute changes, so we can keep projects on track and deliver on time. We see Arena SCI as an opportunity to help achieve this,” said Dan Freeman, Director of Hardware Engineering, Universal Audio.

Arena’s cloud-native PLM and QMS solutions are the trusted source for product development, quality management, and multi-tiered supply chain collaboration for nearly 1,500 global manufacturers, including Nutanix, Insulet, and Enphase Energy. Since being acquired by PTC, Arena has expanded into new international markets, introduced over 16 product releases, and added dozens of partners to help companies and their global teams deliver high-quality products faster while navigating market disruptions. With Arena and PTC’s Onshape® cloud-native computer-aided design (CAD) and product data management (PDM) platform, PTC introduced the first cloud-native CAD-PDM-PLM offering to support cross-functional product development—reducing friction, costs, and coding that typically occurs when trying to connect design and development systems.

For more on Arena Supply Chain Intelligence, please visit the Arena SCI page.

About PTC

PTC (NASDAQ: PTC) is a global software company that enables manufacturers and product companies to digitally transform how they design, manufacture, and service the physical products the world relies on. Headquartered in Boston, Massachusetts, PTC employs over 7,000 people and supports more than 30,000 customers globally. For more information, visit www.ptc.com.

Bentley, Enactus Launch 2025 iTwin4Good Challenge 

Nitin Patil
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Bentley, Enactus Launch 2025 iTwin4Good Challenge 

EXTON, PA, USA, Jun 26, 2025 — As the global infrastructure sector faces a critical workforce shortage, Bentley Systems, Inc.(Nasdaq: BSY), the infrastructure engineering software company, and Enactus, a global nonprofit advancing student innovation and entrepreneurship, announce the start of the 2025 iTwin4Good Challenge. This international competition empowers university students to develop digital twin solutions to help address global infrastructure challenges.

Finalists of the 2024 iTwin4Good Challenge on the competition stage in Kazakhstan.

This initiative comes at a pivotal time. In recent years, global infrastructure sectors have faced a critical workforce shortage, despite rising demand for better and more resilient infrastructure. For example, the American Council of Engineering Companies (ACEC) Research Institute reports that 49 percent of engineering firms face project backlogs of one year or more, while the construction industry is short more than 400,000 workers, according to the Associated Builders and Contractors.

The iTwin4Good Challenge places students on a path to address workforce shortages by combining their passion for social and environmental impact with the power of digital technology. Through skills building and mentorship, the program brings together global talent to grow a new and diverse pipeline of future infrastructure leaders and solution developers. Students embark on a six-week program featuring technical training, mentorship from across Bentley, and the opportunity to get certified as an iTwin Developer Associate. Participants—competing solo or in teams of up to three—will use Bentley’s iTwin platform to create apps that could drive positive environmental or social impact in their communities.

Challenge Overview

From June through October 2025, students from the U.S., Germany, Canada, the UK and Ireland (competing jointly), and Brazil will participate in national rounds. Top performers will present their solutions to a panel of industry experts, compete for cash prizes, and advance to a virtual “Champions of Champions” showdown, with the global winner earning the opportunity to attend the Enactus World Cup 2025 in Bangkok.

“The iTwin4Good Challenge is more than a student competition, it’s a catalyst for change and a strategic investment in the future of infrastructure,” said Chris Bradshaw, chief sustainability and education officer, Bentley Systems. “By engaging young minds in real-world problem-solving and equipping the next generation with digital twin expertise, we’re cultivating talent capable of addressing both today’s infrastructure needs and tomorrow’s sustainability challenges.”

George Tsiatis, president & CEO, Enactus Global & Resolution Project added, “This partnership exemplifies what we do best—empowering students to tackle real-world challenges through innovation and entrepreneurship. When young people combine cutting-edge technology with purpose-driven action, they don’t just solve today’s problems, they build the foundation for a more sustainable future.”

This hands-on experience develops industry-ready professionals who can apply digital twin technology to solve real-world challenges, bridging the gap between academic learning and impactful infrastructure innovation. For a look at the initiative in action, watch the 2024 iTwin4Good Championship final presentations from Kazakhstan.

About Enactus

Enactus is the world’s largest experiential learning platform developing entrepreneurial leaders and social innovators across 35+ countries. Through our network of universities and business leaders, we engage over 40,000 students annually in team-based projects that build essential leadership, project management, and enterprise skills while creating meaningful economic, social, and environmental impact. Founded in 1975, Enactus students have launched more than 75,000 projects and businesses, benefiting millions of people worldwide while developing tomorrow’s leaders with a head for business, and a heart for the world. For more information, visit www.enactus.org.

About Bentley Systems

Around the world, infrastructure professionals rely on software from Bentley Systems to help them design, build, and operate better and more resilient infrastructure for transportation, water, energy, cities, and more. Founded in 1984 by engineers for engineers, Bentley is the partner of choice for engineering firms and owner-operators worldwide, with software that spans engineering disciplines, industry sectors, and all phases of the infrastructure lifecycle. Through our digital twin solutions, we help infrastructure professionals unlock the value of their data to transform project delivery and asset performance. For more information, visit https://www.bentley.com.

Farsoon Launches FS621M-Cu for Large-Scale, Production-Grade Copper Alloy Additive Manufacturing

Nitin Patil
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Farsoon Launches FS621M-Cu for Large-Scale, Production-Grade Copper Alloy Additive Manufacturing

FRANKFURT, Germany, Jun 26, 2025 – Farsoon, a leader in additive manufacturing innovation, is pleased to announce the launch of large-scale, production-grade copper alloy additive manufacturing solution, FS621M-Cu.

Copper and copper alloys are prized in aerospace engine combustion chambers for their outstanding electrical and thermal conductivity, corrosion resistance, and ductility. Yet their high reflectivity to near-infrared lasers (particularly at 1064 nm) has long hindered their adoption in metal 3D printing.

Farsoon was among the first to become one of China’s first companies to master copper alloy printing by developing a copper-compatible process on its FS271M metal platform in 2017.

Building on this expertise, Farsoon partnered with a leading aerospace manufacturer in 2023 to co-develop the large-format additive manufacturing solution designed for copper alloys. Based on the proven large-format metal AM system FS621M platform (build envelope 620mm x 620mm x 1100mm), the new FS621M-Cu system integrates four 1000W ytterbium fiber lasers (1060–1080 nm) to achieve stable, long-duration printing of highly reflective materials like CuCrZr, enabling the production of large, complex aerospace components previously deemed unfeasible.

Revolutionizing Thrust Chamber Production

The thrust chamber, a liquid rocket engine’s most critical—and notoriously difficult—component, must withstand extreme temperatures, pressures, and vibrations while maintaining precise regenerative cooling channels. Traditional manufacturing relies on labor-intensive processes like spinning, machining, and brazing that incur high costs and extended lead times.

Farsoon’s FS621M-Cu platform leverages laser powder bed fusion (LPBF) to monolithically print copper alloy thrust chamber liners with optimized cooling channels. This approach eliminates assembly steps, enhances heat transfer efficiency, and improves engine performance—all while reducing production costs and slashing development cycles.

Additively manufactured monolithic cooling channel design in thrust chamber

Engineering Breakthroughs for High-Reflectivity Materials

Copper’s high thermal conductivity and laser reflectivity pose unique challenges in AM, often leading to defects like porosity, delamination, and warping. Farsoon overcomes these hurdles through a suite of innovations: an anti-reflective chamber coating, a smart thermal management system, and high-power 1000W lasers paired with tailored process parameters.

Tailored process for copper material

The results speak for themselves. In August 2023, the aerospace customer used the FS621M-Cu platform to produce a 600 mm diameter × 850 mm height thrust chamber liner—one of the largest monolithic copper alloy components ever 3D printed. Testing confirmed exceptional material properties: near-theoretical density (8.86 g/cm³), a pore-free microstructure, and thermal conductivity exceeding 345 W/(m·K). X-ray scans further validated the precision of internal cooling channels, which were polished post-build to minimize pressure drop and maximize engine efficiency.

Thrust chamber cooling channel design section view

Performance Validation & Process Breakthroughs

Mechanical testing of as-printed tensile specimens demonstrated excellent comprehensive properties. Thermal characterization revealed outstanding results:

•  Thermal conductivity: ≥345 W/(m·K)
•  Thermal diffusivity: ≥95 mm²/s
•  Specific heat capacity: ≥0.35 J/(g·K)

Through systematic development in 2023, including copper alloy powder quality control and LPBF process optimization, the customer achieved a technological breakthrough in CuCrZr laser additive manufacturing. The resulting components exceeded design specifications by >50% while achieving:

•  Significant improvement in dimensional accuracy
•  Dramatically reduced lead time (15-20 days vs traditional methods)
•  Substantial cost reductions (up to 75%)

Farsoon metal applications with copper alloy

As demand for high-performance copper components surges, Farsoon delivers the large-scale, stable printing capabilities aerospace innovators need. For more information, contact Farsoon at globalinfo@farsoon.com.

About Farsoon

FARSOON Technologies, founded in 2009 in China, is a system supplier of industrial grade plastic laser sintering and metal laser melting systems. Farsoon has developed a team of world-class experts with competencies in electrical/mechanical engineering, laser, scanning and optics, thermal controls, as well as material development and applications engineering. As a globally diverse company, Farsoon was founded with the clear vision and core commitment to creating open platform systems which will give the industry the freedom to innovate and expand the implementation of additive manufacturing in the global product’s marketplace.

Farsoon’s subsidiary FARSOON Europe GmbH (Stuttgart, Germany) provides the whole range of machine portfolio after technical confirmation in China, as well as local service and maintenance activities. For more information, visit https://www.farsoon-gl.com.

DN Solutions Launches NHP 6300 2nd-Gen Horizontal Machining Center

Nitin Patil
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DN Solutions Launches NHP 6300 2nd-Gen Horizontal Machining Center

CHANGWON, South Korea, Jun 26, 2025 — DN Solutions, the world’s third-largest and South Korea’s leading machine tool builder, unveiled its second-generation NHP 6300 horizontal machining center, offering reduced cycle times, enhanced spindle performance, and seamless automation integration.

Engineered to slash non-cutting time, the second-generation NHP 6300 boosts spindle acceleration and deceleration by 20 percent over its predecessor. Table indexing is 35 percent faster, and table rotation speed has more than doubled, significantly reducing cycle times and driving higher throughput.

A hallmark of the NHP series is its standard B-axis rotary table and automatic pallet changer (APC). These components enable complete five-sided machining in a single setup and support uninterrupted production by alternating between two pallets.

Tool change times are 30 percent faster, further minimizing downtime between operations.

Anchored by a high-speed built-in spindle, the NHP 6300 minimizes vibration and thermal distortion to deliver exceptional stability and precision during heavy-duty cutting or extended operation. Integrated cooling for the spindle shaft and nut assemblies, paired with advanced thermal compensation, preserves machining accuracy throughout prolonged cycles.

Automation-ready, the second-generation NHP 6300 seamlessly integrates with systems such as the Linear Pallet System (LPS) and enables 24/7 lights-out manufacturing via smart tool-wear prediction, advanced process scheduling, and defect-prevention logic.

To enhance operational efficiency, the second-generation NHP 6300 features an optional Sludge-Free Coolant (SFC) tank that automatically filters chips and sludge, reducing maintenance downtime and maximizing machine availability.

With its robust design, precision control, and automation flexibility, it provides a comprehensive solution for manufacturers seeking faster, smarter, and more reliable horizontal machining.

About DN Solutions

DN Solutions is a global leader in CNC machine tools and smart manufacturing solutions. Headquartered in Changwon, South Korea, the company has sold more than 290,000 machines across 66 countries and operates 140+ service and sales offices worldwide. Its product portfolio includes machining centers, turning centers, factory automation systems, and now metal additive manufacturing solutions. For more information, visit https://www.dn-solutions.com.

Hypertherm Doubles Powermax Plasma Cutters Warranty to Six-Years

Nitin Patil
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Hypertherm Doubles Powermax Plasma Cutters Warranty to Six-Years

HANOVER, NH, USA, Jun 25, 2025 — Hypertherm Associates, a U.S. based leading manufacturer of industrial cutting systems and software, has doubled the warranty period for the company’s Powermax plasma cutters from three years to six years. All customers who received delivery of a Powermax plasma or gouging system on or after January 1, 2025, are now retroactively eligible for the extended coverage.

“At Hypertherm Associates, we take pride in delivering the most reliable plasma systems in the industry,” said Erik Brine, Hypertherm Associates General Manager. “Extending our warranty from three to six years demonstrates confidence in our plasma technology and a commitment to our customers, who deserve peace of mind in the investments they’ve made.”

Engineered to meet the diverse needs of metalworkers, the Powermax Series includes a line of seven portable, professional-grade plasma systems that easily and reliably gouge and cut metal up to 1.5″ or 38 mm. In addition to its reliability, Powermax systems deliver versatility to manufacturers by offering extensive manual and automated metal cutting and gouging capabilities.

Existing Powermax customers are encouraged to retain their invoice or receipt showing the date of delivery, but do not need to take any action to benefit from the new six-year warranty for their Powermax power supplies.

About Hypertherm Associates

Hypertherm Associates is a U.S. based manufacturer of industrial cutting products and software. Its products, including Hypertherm plasma and OMAX waterjet systems, are used by companies around the world to build ships, airplanes, and railcars; construct steel buildings, fabricate heavy equipment, erect wind turbines, and more. In addition to cutting systems, the company creates CNCs and software trusted for performance and reliability that result in increased productivity and profitability for hundreds of thousands of businesses. Founded in 1968, Hypertherm Associates is a 100 percent Associate-owned company, employing approximately 2,000 Associates, with operations and partner representation worldwide. Learn more at www.HyperthermAssociates.com.

French Designer Patrick Jouin, Dassault Unveil Ta.Tamu, Lightweight, 3D-Printed Foldable Chair

Nitin Patil
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French Designer Patrick Jouin, Dassault Unveil Ta.Tamu, Lightweight, 3D-Printed Foldable Chair

PARIS, France, Jun 25, 2025 — Dassault Systèmes (Euronext Paris: FR0014003TT8, DSY.PA) and the French designer Patrick Jouin today unveiled “Ta.Tamu,” a lightweight, 3D-printed and functional chair, co-created using the 3DEXPERIENCE platform on the cloud. Ta.Tamu serves as a proof of concept for emerging, generative design processes that combine AI-powered virtual twins and the frugal use of materials to drive the generative economy.

Click to image to see the chair in action

Ta.Tamu is the result of a four-year dialogue between Patrick Jouin’s intuitive design approach and Dassault Systèmes’ 3DEXPERIENCE platform. Designers and engineers redefined how a chair could be conceived — challenging traditional design methods, pushing formal and structural limits, and inventing new ways to minimize matter.

Developed through enhanced ideation and concept development, and a life cycle assessment integrated early in the process, Ta.Tamu’s pioneering aesthetics were inspired by biomimicry and the structural logic of the human body, such as bone density and joint articulation. The light yet robust lattice structure weighs just 8.6 pounds (3.9 kg), can support 220 pounds (100 kg), and can be 3D printed in a flat, folded position without needing assembly.

“Nature uses only the energy and materials it needs. We wanted to apply this very simple philosophy to the development of Ta.Tamu. With the help of new collaborative technologies of Dassault Systèmes, we are now able to come up with new ideas and make them possible, creating more efficiently while producing less waste, right from the design process,” said Jouin. 

Ta.Tamu > Dassault Systèmes

Collaborating around an AI-powered virtual twin, design teams modeled and simulated the behavior of complex assembled components, using topological optimization to refine every joint, unfolding articulation, and zone of pressure and support. At each stage, the design evolved in real time through close interaction with the 3DEXPERIENCE platform, with changes updated and visible in the virtual twin. Teams modified the chair’s geometry while balancing its aesthetics, resulting in an optimal design where gesture, function, and structure converge in a chair that weighs 75% less than it would have weighed at full density.

“To improve the world we live in, we have to change the way we produce, design and use materials. Ta.Tamu represents a call to action for industry to embrace a generative economy instead of continuing to create without limits,” said Anne Asensio, Vice President Design Experience, Dassault Systèmes. “Ta.Tamu was created with the technology used to innovate sustainably in industrial contexts. As a science-based company, we want to create value for society in every aspect of people’s lives through our 3DEXPERIENCE platform. Design processes integrating modeling and simulation from the start lead to innovations that improve real life.” 

Ta.Tamu > Dassault Systèmes

About Patrick Jouin

Patrick Jouin is a French designer and a graduate of ENSCI–Les Ateliers. In 1999, he founded his industrial design studio, Patrick Jouin iD. A pioneer in the use of 3D printing for furniture design, he created the Solid collection in 2004, the first series of furniture pieces produced directly from digital files, without molds or assembly. This milestone marked the beginning of an in-depth exploration of new ways to design and manufacture, rethinking forms, gestures, and structures in light of emerging technologies.

Through objects such as One Shot, Bloom, and the monolithic bench at the Palais de Tokyo, Patrick Jouin has revealed the ability of these tools to generate intuitive, lightweight, and sometimes otherwise unattainable forms. Since 2019, he has been engaged in an experimental collaboration with Anne Asensio and the teams at Dassault Systèmes, exploring generative design, folding, and deployability.

About Dassault Systèmes

Dassault Systèmes is a catalyst for human progress. Since 1981, the company has pioneered virtual worlds to improve real life for consumers, patients and citizens. With Dassault Systèmes’ 3DEXPERIENCE platform, 370,000 customers of all sizes, in all industries, can collaborate, imagine and create sustainable innovations that drive meaningful impact. For more information, visit www.3ds.com.

ArianeGroup, Nikon SLM Solutions Collaborate to Advance Ultra-Large-Scale Additive Manufacturing for Space Applications

Nitin Patil
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ArianeGroup, Nikon SLM Solutions Collaborate to Advance Ultra-Large-Scale Additive Manufacturing for Space Applications

LUBECK, Germany, Jun 25, 2025 – Nikon SLM Solutions and ArianeGroup have entered a strategic partnership to support the production, with exclusive initial machine delivery, of ultra-large-scale components over 1 cubic meter, using metal additive manufacturing via powder bed fusion. This collaboration marks a significant milestone for both companies and sets a new benchmark in the aerospace and defense sectors.

With this partnership, Nikon SLM Solutions will keep demonstrating advanced additive manufacturing technology to highly complex, large-format components needing to meet stringent quality and productivity requirements, unlocking new possibilities in functional integration and performance optimization.

The powder bed fusion technology employed for this ultra-large-format metal 3D printing ensures precise layering of high-performance materials, enabling the production of geometrically complex parts at previously unattainable scales.

“Ariane Group is a key global player in the space industry. Our collaboration with ArianeGroup demonstrates the effectiveness of our technology and shows how Nikon SLM’s innovations can meet the demanding needs of strategic, high-tech customer.” — Julien Frugier, Sales Manager, Nikon SLM Solutions

This partnership is a clear demonstration of how additive manufacturing continues to evolve as a foundational tool for the space industry. By minimizing assembly needs and enabling lightweight, high-performance components, Nikon SLM Solutions’ technology provides ArianeGroup new opportunities to enhance lead time and reduce costs on complex, ultra-large-scale hardware for liquid propulsion critical applications.

About ArianeGroup

ArianeGroup is an industrial company delivering critical missions for the space and defence sectors. With 8,300 highly qualified employees in France and Germany, ArianeGroup has unique expertise in access to space, covering the full spectrum of civil and military launch systems, including design, development, manufacturing, integration, flight preparation, operational readiness and end-of-life decommissioning. ArianeGroup is lead contractor for the Ariane 6 European launcher for the European Space Agency (ESA), and for the French oceanic deterrent force M51 strategic missile for the French Defence Armament Procurement Agency (DGA).

Internationally recognised for its innovative, competitive solutions, ArianeGroup has expertise in state-of-the-art technologies, from the chemistry of propellants and composite materials, to liquid, solid and electric space propulsion systems. ArianeGroup also offers a broad range of space, defence and industrial equipment and services, both individually and together with its subsidiaries Sodern, Pyroalliance, Nuclétudes and APP.

In the field of space launchers, ArianeGroup’s subsidiary Arianespace markets Ariane 6, and its subsidiary MaiaSpace develops and markets the reusable launcher Maia.

ArianeGroup, equally owned by Airbus and Safran, posted consolidated revenues of €2.5 billion in 2024.

About Nikon SLM Solutions

Nikon SLM Solutions AG is a global provider of integrated metal additive manufacturing solutions. Leading the industry since its inception, it continues to drive the future of metal AM in every major industry with its customers’ long-term success at its core. Nikon SLM Solutions is home to the world’s fastest metal additive manufacturing machines boasting up to 12 lasers and enabling build rates of up to 1000ccm/h. With a portfolio of systems to suit every customer’s needs, along with its team of experts closely collaborating at every stage of the process, Nikon SLM Solutions leads the way on return on investment with maximum efficiency, productivity, and profitability. Nikon SLM Solutions believes that additive manufacturing is the future of manufacturing and has the desire and capability to take its customers there – right now.

Nikon SLM Solutions AG is a Company headquartered in Germany, with offices in Canada, France, India, Italy, Singapore, South Korea, and the United States.Further information is available on www.nikon-slm-solutions.com.

Siemens Unveils EDA AI System for Semiconductor, PCB Design Portfolio

Nitin Patil
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Siemens Unveils EDA AI System for Semiconductor, PCB Design Portfolio

SAN FRANCISCO, CA, USA, Jun 25, 2025 – At the 2025 Design Automation Conference, Siemens Digital Industries Software unveiled its AI-enhanced toolset for the EDA design flow. Throughout the event, Siemens is showcasing how artificial intelligence (AI) can improve productivity, accelerate time to market for the EDA industry and enable customers to explore innovation opportunities at the rapidly increasing pace that the market demands. 

Siemens is demonstrating a new EDA AI system specifically designed for semiconductor and PCB design environments. The purpose-built EDA AI system delivers secure, advanced generative and agentic AI capabilities, offering unparalleled customization capabilities and seamless integration across the entire EDA workflow.

“We are strategically investing in developing sophisticated industrial-grade AI solutions purpose-built for the unique complexities of EDA. This accumulated expertise forms the technological foundation that empowers our customers to bring breakthrough semiconductor and PCB designs to market faster than ever before,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “Siemens is set to revolutionize the way design teams operate, ushering in a future where generative and agentic AI capabilities are seamlessly integrated into every aspect of the EDA workflow.”

Delivering openness, security and customizability across the entire EDA workflow  

Using the new EDA AI System, customers can integrate their own EDA data and create custom workflows using advanced AI, enabling teams to deploy AI where it adds the most value – enhancing adoption and competitiveness without disrupting workflows. With enterprise-grade security, customizable access control and flexible deployment options (on-premises or cloud), Siemens delivers data protection completely within customers’ secure data centers. Additionally, it provides a strong data flywheel effect using a centralized multimodal data lake that boosts productivity through each interaction while supporting various AI models, including large and small language models, and machine and reinforcement learning.  

Leveraging NVIDIA AI technologies to further accelerate EDA workflows  

In addition to in-house infrastructure and third-party models, Siemens’ EDA AI system also supports NVIDIA NIM microservices and NVIDIA Llama Nemotron models. NVIDIA NIM enables the scalable deployment of inference-ready models across cloud and on-premises environments, supporting real-time tool orchestration and multi-agent systems. Llama Nemotron adds high context reasoning and robust tool-calling for more intelligent automation across the EDA workflow.

“AI agents can dramatically boost productivity for complex electronic design automation to support engineers across layout optimization, simulation and verification, freeing engineers to focus on creative problem-solving and advanced design challenges,” said Tim Costa, senior director of CAE and CUDA-X at NVIDIA.  “With NVIDIA NIM microservices and Llama Nemotron reasoning models, Siemens EDA can speed the development of tomorrow’s most intricate electronic systems.”

Enabling AI capabilities across the Siemens EDA portfolio

Aprisa™ AI software: Aprisa AI is a fully integrated technology in the Aprisa digital implementation solution, enabling next-generation AI features and methodologies across RTL-to-GDS. Its capabilities include AI design exploration that adaptively optimizes for power / performance / area (PPA) for a given design, as well as integrated generative AI-assist, delivering ready-to-run examples and solutions.

With a natural language interface built-in together with production-ready, fully customizable and transportable AI-generated solutions, Aprisa AI delivers 10x productivity, 3x faster time to tapeout and 10 percent better PPA for digital designs across all process technologies, enabling massive engineering team and compute scalability, while accelerating time-to-market for the next generation of silicon designs. To learn more about Aprisa AI please visit: https://siemens.com/aprisa-ai

Calibre® Vision AI software: Calibre Vision AI offers a revolutionary advance in chip integration signoff by helping design teams identify and fix critical design violations in half the time of existing methods by instantly loading and organizing them into intelligent clusters. Designers can then prioritize their activity based on this clustering and achieve a higher level of productivity. Calibre Vision AI also improves efficiency in the workflow with the addition of “bookmarks” that allow designers to capture current analysis state, including notes and assignments, and then foster enhanced collaboration between chip integrators and block owners during physical verification. Calibre Vision AI is integrated into existing layout viewers and physical design tools to enable engineers to debug in their current implantation environment. To learn more about Calibre Vision AI, visit:  https://eda.sw.siemens.com/en-US/ic/calibre-design/interfaces/vision-ai/

Solido™ generative and agentic AI: Solido now harnesses Siemens’ EDA AI system to deliver advanced generative and agentic AI capabilities throughout the Solido Custom IC platform to transform next generation design and verification. Tailored to each phase of the custom IC development process, including schematic capture, simulation, variation-aware design and verification, library characterization, layout and IP validation, Solido’s new generative and agentic AI empowers engineering teams to achieve orders-of-magnitude productivity gains. To learn more about these advanced AI capabilities, visit: https://eda.sw.siemens.com/en-US/ic/solido/solido-generative-agentic-ai/

Availability  

Siemens’ EDA AI system is currently available for early access across the Siemens EDA portfolio. To learn more about how customers can leverage Siemens’ EDA AI portfolio of solutions to transform today’s design challenges into tomorrow’s innovations, visit: https://eda.sw.siemens.com/en-US/trending-technologies/eda-ai-page.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

About Siemens Digital Industries

Siemens Digital Industries (DI) empowers companies of all sizes within the process and discrete manufacturing industries to accelerate their digital and sustainability transformation across the entire value chain. Siemens’ cutting-edge automation and software portfolio revolutionizes the design, realization and optimization of products and production. And with Siemens Xcelerator – the open digital business platform – this process is made even easier, faster, and scalable. Together with our partners and ecosystem, Siemens Digital Industries enables customers to become a sustainable Digital Enterprise. Siemens Digital Industries has a workforce of around 70,000 people worldwide.

About Siemens AG

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, mobility, and healthcare. The company’s purpose is to create technology to transform the everyday, for everyone. By combining the real and the digital worlds, Siemens empowers customers to accelerate their digital and sustainability transformations, making factories more efficient, cities more livable, and transportation more sustainable. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a leading global medical technology provider pioneering breakthroughs in healthcare. For everyone. Everywhere. Sustainably. 

In fiscal 2024, which ended on September 30, 2024, the Siemens Group generated revenue of €75.9 billion and net income of €9.0 billion. As of September 30, 2024, the company employed around 312,000 people worldwide on the basis of continuing operations. Further information is available on the Internet at www.siemens.com. 

Siemens Streamlines Design, Analysis of Complex, Heterogeneously Integrated 2.5D, 3D ICs with Two New EDA Solutions

Nitin Patil
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Siemens Streamlines Design, Analysis of Complex, Heterogeneously Integrated 2.5D, 3D ICs with Two New EDA Solutions

SAN FRANCISCO, CA, USA, Jun 25, 2025 – Siemens Digital Industries Software introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs.

Siemens’ new Innovator3D IC solution suite enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs. In addition, Siemens’ new Calibre 3DStress software leverages advanced thermo-mechanical analysis to identify the electrical impact of stress at the transistor level. Together, these solutions dramatically reduce risk and enhance the design, yield and reliability of complex, next generation 2.5D/3D IC designs.

“By delivering a stress-aware multiphysics analysis solution powered by Calibre 3DStress and driven by the Innovator3D IC solution suite, Siemens enables customers to overcome the complexities and risks associated with 3D IC designs,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “These capabilities are critical for our customers, allowing them to accelerate productivity and meet stringent design timelines by effectively eliminating the barriers of design complexity that traditionally impact design cycles.” 

Innovator3D IC solution suite 

Siemens’ new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP.

Built on an AI-infused user experience offering extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+ million pin designs, the new Innovator3D IC solution suite is comprised of the Innovator3D IC Integrator, a consolidated cockpit for constructing a digital twin using a unified data model for design planning, prototyping and predictive analysis; the Innovator3D IC Layout solution for correct-by-construction package interposer and substrate implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and die-to-die interface compliance analysis; and the Innovator3D IC Data Management solution, for the work-in-progress management of designs and design data IP.   

Calibre 3DStress  

With the thinner dies and higher package processing temperatures of 2.5D/3D IC architectures, IC designers have discovered that designs validated and tested at the die level often no longer conform to specifications after packaging reflows.

Engineered to address this challenge, Calibre 3DStress supports accurate, transistor-level analysis, verification, and debugging of thermo-mechanical stresses and warpage in the context of 3D IC packaging, allowing chip designers to evaluate how chip-package interaction will affect the functionality of their designs earlier in the development cycle. This foresight not only prevents future failures but also optimizes the design for better performance and durability.

Building on the launch of Calibre 3DThermal in 2024, Calibre 3DStress expands the Multiphysics solution, dramatically reducing thermo-mechanical impacts, and delivering design and electrical behavior visibility earlier in the design process. Unlike package-level stress analysis tools, Calibre 3DStress uniquely detects transistor level stress to verify that neither packaging processes nor product functionalities will compromise circuit level performance.

Calibre 3DStress represents an important part of Siemens’ 3D IC multi-physics software portfolio and a foundational part of Siemens’ IC digital twin and semiconductor development workflows. It delivers an innovative combination of industry-standard Calibre physical verification functionality with a native and highly advanced mechanical solver to evaluate stresses in IC structures and materials.  

Customer experiences with Siemens’ technologies for 3D IC design

“In 2023, we adopted Siemens’ technology to meet the complex design and integration challenges of our advanced platform solutions. The Innovator3D IC solution suite plays a critical role in enabling the high-performance solutions we deliver to AI and HPC datacenters,” said Bryan Black, CEO of Chipletz, a leading fabless AI platform provider.

“Siemens EDA’s Calibre 3DStress tool can synthesize the complexity of components, materials and processes related to 3D IC architectures and can create accurate IP-level stress analysis. Using it, ST has been able to implement early design planning and sign-off flows, and accurately model potential electrical failures due to IP-level stress within a 3D IC package. The result is improved reliability and quality, together with a reduced time to market, which provide a win both for ST and our customers,” said Sandro Dalle Feste, APMS Central R&D Senior Director, STMicroelectronics.

To learn more about Siemens’ broad portfolio of solutions for 2.5D/3D IC architectures, visit https://eda.sw.siemens.com/en-US/ic-packaging/3d-ic-design.

About Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

About Siemens Digital Industries

Siemens Digital Industries (DI) empowers companies of all sizes within the process and discrete manufacturing industries to accelerate their digital and sustainability transformation across the entire value chain. Siemens’ cutting-edge automation and software portfolio revolutionizes the design, realization and optimization of products and production. And with Siemens Xcelerator – the open digital business platform – this process is made even easier, faster, and scalable. Together with our partners and ecosystem, Siemens Digital Industries enables customers to become a sustainable Digital Enterprise. Siemens Digital Industries has a workforce of around 70,000 people worldwide.

About Siemens AG

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, mobility, and healthcare. The company’s purpose is to create technology to transform the everyday, for everyone. By combining the real and the digital worlds, Siemens empowers customers to accelerate their digital and sustainability transformations, making factories more efficient, cities more livable, and transportation more sustainable. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a leading global medical technology provider pioneering breakthroughs in healthcare. For everyone. Everywhere. Sustainably. 

In fiscal 2024, which ended on September 30, 2024, the Siemens Group generated revenue of €75.9 billion and net income of €9.0 billion. As of September 30, 2024, the company employed around 312,000 people worldwide on the basis of continuing operations. Further information is available on the Internet at www.siemens.com. 

Bentley Systems Wins Multiple 2025 Sustainability Delivery Awards

Nitin Patil
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Bentley Systems Wins Multiple 2025 Sustainability Delivery Awards

EXTON, PA, USA, Jun 24, 2025 — Bentley Systems, Incorporated (Nasdaq: BSY), the infrastructure engineering software company, was recognized across multiple categories at Environment Analyst’s 2025 Sustainability Delivery Awards, held earlier this month in Chicago.

Bentley received top honors in two award categories and was highly commended in a third, highlighting the company’s continued leadership in driving innovation and measurable progress toward meeting global infrastructure sustainability objectives:

  • Digital Innovation Award (Winner): Bentley’s Carbon Analysis capabilities in iTwin Experience were recognized for their ability to enable infrastructure engineers to simplify and streamline data collection and carbon reporting, easily visualize and quantify embodied carbon, and rapidly explore alternatives for better designs, saving time and reducing risk on major infrastructure projects.
  • Water Project of the Year (Winner): Together, Bentley and SABESP were recognized for the Integra 4.0 Cultural Transformation Through Digitalization project, which is a landmark initiative accelerating sustainable water infrastructure modernization in Brazil through digital twin technology.
  • Energy Project of the Year (Highly Commended): Bentley, alongside Exo, were honored for the Evergy Power Transmission Structure Stabilization project, an effort that leveraged digital modeling and predictive analytics to enhance energy grid resilience.

These recognitions underscore Bentley’s commitment and leadership position to advancing sustainability through digital engineering solutions that enable more resilient, efficient, and low-carbon infrastructure. The water and energy projects were previously honored at Bentley’s 2024 Year in Infrastructure conference: the SABESP Integra 4.0 program was recognized as a Going Digital Award winner in the Water and Wastewater category by a panel of independent jurors, while the Exo Evergy Power Transmission Structure Stabilization program received Bentley Founders Honors.

“At Bentley, our sustainability vision reflects the urgent need to future-proof global infrastructure,” said Chris Bradshaw, chief sustainability and education officer at Bentley Systems. “Digital twins are essential for sustainable development, helping users optimally balance environmental, social, and economic outcomes. We’re proud to be recognized across several categories in the 2025 Sustainability Delivery Awards and remain committed to delivering solutions that drive real progress toward climate and resilience goals.”

The Sustainability Delivery Awards, hosted by Environment Analyst, celebrate innovation, leadership, and tangible progress across global infrastructure. Judged by an independent panel of industry experts, this year’s awards brought together leaders and changemakers committed to transforming the infrastructure sector for a more sustainable future.

About Bentley Systems

Around the world, infrastructure professionals rely on software from Bentley Systems to help them design, build, and operate better and more resilient infrastructure for transportation, water, energy, cities, and more. Founded in 1984 by engineers for engineers, Bentley is the partner of choice for engineering firms and owner-operators worldwide, with software that spans engineering disciplines, industry sectors, and all phases of the infrastructure lifecycle. Through our digital twin solutions, we help infrastructure professionals unlock the value of their data to transform project delivery and asset performance. For more information, visit https://www.bentley.com.

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