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Ansys Announces Strategic Collaboration with AWS to Transform Cloud-Based Engineering Simulations

PITTSBURGH, PA, USA, Feb 4, 2022 - Ansys (NASDAQ: ANSS) announced a strategic collaboration with Amazon Web Services, Inc. (AWS), identifying the CSP as the...

Siemens, UMC Join to Develop Process Design Kits for Automotive and Power Applications

PLANO, TX, USA, Jan 21, 2022 - Siemens Digital Industries Software announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design...

Light Deploys Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Gen ADAS Systems

REDWOOD CITY and SAN JOSE, CA, USA, Jan 18, 2022 - Light and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Light has...

Butterfly Network Deploys Cadence Clarity 3D Solver for Advanced Mobile Ultrasound Design

SAN JOSE, CA, USA, Dec 28, 2021 - Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that Butterfly Network, Inc. has successfully deployed the Cadence Clarity 3D...

Zuken’s New Interface Connects Wiring, PCB Design Data and Metadata with SAP’s ERP System

WESTFORD, MA, USA and MUNICH, Germany, Dec 16, 2021 – Zuken, a global technology leader in digital engineering for electronic and electrical systems, announces the...

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