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Thursday, September 17, 2026
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Design News
Siemens Brings Real-Time Supply Chain Intelligence to Xcelerator, Digital Twin
Nitin Patil
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June 16, 2023
0
3D PCB Design
Zuken Releases eCADSTAR 2023 for Internet-Connected PCB Design
Nitin Patil
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June 9, 2023
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CAE
Ansys to Expand Multiphysics Simulation Portfolio for Semiconductor Designers with Acquisition of Diakopto
Nitin Patil
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May 17, 2023
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CAE
Ansys Joins TSMC’s OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
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April 28, 2023
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LogicSwap’s Free Data Migration Software Converts Third-Party PCB Design Data to eCADSTAR
Nitin Patil
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April 14, 2023
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Design News
Hexagon and Altium Partner to Improve Sustainability of Electronics Industry with Cloud-based Digital Reality Solutions
Sachin R Nalawade
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March 6, 2023
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Computer Hardware
Siemens Announces Questa Verification IQ Software for Design and Verification of Integrated Circuits
Sachin R Nalawade
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February 1, 2023
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Design News
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
Nitin Patil
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October 20, 2022
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Design News
Siemens Automates 2.5D, 3D IC Design-for-Test with New Tessent Multi Die Solution
Nitin Patil
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October 3, 2022
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Design News
Siemens, UMC Join to Develop 3D Integrated Circuit Hybrid Bonding Workflow
Nitin Patil
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September 26, 2022
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