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Ansys Government Initiatives Selected to Join Microelectronics Commons to Support National Security 

PITTSBURGH, PA, USA, Nov 22, 2024 – Ansys (NASDAQ: ANSS) has been awarded a contract to supply digital engineering solutions to the Microelectronics Commons to advance national...

Ansys, NVIDIA Announce Technology Integration to Advance AI-Powered Semiconductor Design

PITTSBURGH, PA, Nov 20, 2024 – Ansys (NASDAQ: ANSS) today announced it is integrating the NVIDIA Modulus AI framework into Ansys semiconductor simulation products to deliver AI...

nLIGHT Launches 2-Kilowatt Dynamic Beam Shaping Laser for LPBF Metal 3D Printing

CAMAS, WA, USA, Nov 12, 2024 - nLIGHT, Inc. (Nasdaq: LASR), a leading provider of high-power semiconductor and fiber lasers used in the industrial,...

AMD Opens Engineering Design Center in Serbia

BELGRADE, Serbia, Oct 9, 2024 - AMD (NASDAQ: AMD) opened a new engineering design center in Serbia, with offices in Belgrade and Nis, strengthening its presence in...

Japan’s Preferred Networks Selects Siemens PowerPro for Next-Gen AI Chip Design

PLANO, TX, USA, Sep 26, 2024 - Siemens Digital Industries Software announced that Japan-based Preferred Networks Inc. (PFN), a leader in deep learning and...

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