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SIMULATION

BETA CAE Systems Releases 2025.2HF3 for ANSA, EPILYSIS, META, FATIQ, SPDRM, KOMVOS

LUCERNE, Switzerland, Oct 6, 2026 – BETA CAE Systems is pleased to announce the release of 3rd Hot Fix of 2025.2 for ANSA, EPILYSIS,...

Simscale Launches Engineering AI Agent for Onshape

MUNICH, Germany, Sep 30, 2026 — SimScale, the AI-native cloud platform for engineering simulation, launched the SimScale Engineering AI Agent accessible within PTC’s Onshape...

3D Printing

SOLIDWORKS - BEACON India

BEACON India Brings SOLIDWORKS Innovation Day 2026 to Nine Cities Across India

Nine-city India tour to showcase SOLIDWORKS 2027, AI-powered design, automation and the future of digital engineering and manufacturing Pune, India — October 2, 2026: BEACON...

MFG Tech Update

Mazak Appoints Suzette Mendez as General Manager for Midwest

FLORENCE, KY, USA, Oct 13, 2026 - Mazak has appointed Suzette Mendez as General Manager for its Midwest Region. With more than 20 years...

TRUMPF Launches TruLaser 5000 Series Laser Cutting Machine at EuroBLECH

DITZINGEN, Germany, Oct 13, 2026 – At EuroBLECH, TRUMPF is launching the new generation of its most productive laser cutting machine series, the TruLaser...

Verisurf 2027 Released for 3D Metrology

ANAHEIM, CA, USA, Oct 13, 2026 – Verisurf Software announced the availability of Verisurf 2027, the latest release of its model-based metrology software. New...

InnovMetric Launches MasterKey by PolyWorks Customer Success Program

QUEBEC, QC, Canada, Oct 12, 2026 - InnovMetric is proud to unveil MasterKey by PolyWorks, its new customer success program that brings together the...

ARCH Medical Grinding Wins 2026 ANCA Tool of the Year, Jessica Kuenn of Gorilla Mill Named 2026 ANCA Female Machinist

WIXOM, MI, USA, Oct 12, 2026 – ANCA has announced the winners of the 2026 ANCA Tool of the Year Awards at IMTS 2026, recognising...

EDA

PLANO, TX, USA, Sep 4, 2026 - Siemens today announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor...
DITZINGEN, Germany and TAIPEI, Taiwan, Sep 3, 2026 – The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing...
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